公开(公告)号：US07771579B2

公开(公告)日：2010-08-10

申请号：US11004294

申请日：2004-12-03

Applicant: Ting-Chu Ko ,  Chien-Hsueh Shih ,  Minghsing Tsai

Inventor： Ting-Chu Ko ,  Chien-Hsueh Shih ,  Minghsing Tsai

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C25D3/02 ,  H01L21/2885 ,  H01L21/76877

Abstract: A chemical solution for an electro chemical plating process includes an electro chemical plating solution; and an additive, added in the electro chemical plating solution, substantially consisting of a polymer with one or more kinds of impurities, wherein each kind of the impurities has a density, with respect to the polymer, lower then 1019 atoms/cc.

Abstract translation: 化学电镀工艺的化学溶液包括电化学镀液; 以及添加在电化学镀液中的添加剂，其基本上由具有一种或多种杂质的聚合物组成，其中各种杂质相对于聚合物的密度低于1019原子/ cc。

公开(公告)号：US20050029659A1

公开(公告)日：2005-02-10

申请号：US10637105

申请日：2003-08-08

Applicant: Ting-Chu Ko ,  Ming-Hsing Tsai ,  Chien-Hsueh Shih

Inventor： Ting-Chu Ko ,  Ming-Hsing Tsai ,  Chien-Hsueh Shih

IPC: H01L23/532 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and system is provided for efficiently varying the composition of the metal interconnects for a semiconductor device. A metal interconnect according to the present disclosure has an intermediate layer on a dielectric material, the intermediate layer having a relatively higher concentration of an impurity metal along with a primary metal, the impurity metal having a lower reduction potential than the primary metal. The metal interconnect has a main layer of the metal alloy interconnect on top of the intermediate layer and surrounded by the intermediate layer, the main layer having a relatively higher concentration of the primary metal than the intermediate layer, wherein the intermediate and main layers of the metal alloy interconnect each maintains a material uniformity.

Abstract translation: 提供了一种方法和系统，用于有效地改变半导体器件的金属互连的组成。 根据本公开的金属互连在电介质材料上具有中间层，中间层与主金属一起具有较高浓度的杂质金属，杂质金属具有比初级金属低的还原电位。 金属互连件在中间层的顶部具有金属合金互连的主层，被中间层包围，主层具有比中间层更高的一次金属浓度，其中，中间层和中间层的中间层和主要层 金属合金互连件均保持材料均匀性。