C-fed antenna formed on multi-layer printed circuit board edge

    公开(公告)号:US10651557B2

    公开(公告)日:2020-05-12

    申请号:US16307244

    申请日:2016-06-06

    Abstract: An antenna comprises an antenna patch (121) and an extension patch (125). The extension patch (125) is conductively coupled to the antenna patch (121) and is arranged in plane offset from the antenna patch (121). The antenna patch (121) is formed of multiple conductive strips (122A, 122B) extending in a horizontal direction along an edge of a multi-layer circuit board having multiple layers stacked along a vertical direction. Each of the conductive strips (122A, 122B) of the antenna patch (121) is arranged on a different layer of the multi-layer circuit board. The conductive strips (122A, 122B) of the antenna patch (121) are electrically connected to each other by conductive vias (123) extending between two or more of the conductive strips (122A. 122B) of the antenna patch (121), which are arranged on different layers of the multi-layer circuit board. Similarly, the extension patch (125) is formed of multiple conductive strips extending in the horizontal direction. Each of the conductive strips of the extension patch (125) is arranged on a different layer of the multi-layer circuit board. The conductive strips of the extension patch are electrically connected to each other by conductive vias extending between two or more of the conductive strips of the extension patch, which are arranged on different layers of the multi-layer circuit board.

    WIDEBAND ANTENNAS INCLUDING A SUBSTRATE INTEGRATED WAVEGUIDE
    24.
    发明申请
    WIDEBAND ANTENNAS INCLUDING A SUBSTRATE INTEGRATED WAVEGUIDE 有权
    宽带天线,包括基板集成波导

    公开(公告)号:US20170047658A1

    公开(公告)日:2017-02-16

    申请号:US14825199

    申请日:2015-08-13

    CPC classification number: H01Q13/00 H01Q1/521 H01Q13/0225 H01Q13/18

    Abstract: A wireless electronic device includes a Substrate Integrated Waveguide (SIW), a first metal layer including one or more top wave traps, a second metal layer, a feeding structure extending through the first metal layer and into the SIW, and a reflector on the first side of the SIW. The reflector directly connects to the first metal layer and extends outward along a major plane of the first side of the first metal layer. The wireless electronic device is configured to resonate at a resonant frequency when excited by a signal transmitted or received though the feeding structure. The one or more top wave traps are configured to trap a signal radiated by the reflector based on the signal transmitted or received though the feeding structure.

    Abstract translation: 无线电子设备包括基板集成波导(SIW),包括一个或多个顶波陷阱的第一金属层,第二金属层,延伸穿过第一金属层并进入SIW的馈电结构,以及第一金属层上的反射器 一边的SIW。 反射器直接连接到第一金属层并沿着第一金属层的第一侧的主平面向外延伸。 无线电子设备被配置为当通过馈送结构发送或接收的信号激发时以共振频率谐振。 一个或多个顶部波陷阱被配置为基于通过馈送结构发送或接收的信号来捕获由反射器辐射的信号。

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