公开(公告)号：US6009129A

公开(公告)日：1999-12-28

申请号：US808601

申请日：1997-02-28

Applicant: Thomas J. Kenney ,  Ilkka Niva ,  Steven D. Gray ,  Joe Dowling

Inventor： Thomas J. Kenney ,  Ilkka Niva ,  Steven D. Gray ,  Joe Dowling

IPC: H04B1/10

CPC classification number: H04B1/7102 ,  H04B1/1027

Abstract: In the front end of a CDMA cellular or broadband PCS mobile phone receiver, a switched bypass connection is provided to bypass the low noise amplifier, sending the received signal through an amplifier bypass connection. The amplifier bypass connection may include an attenuator. The switched bypass is activated by a control signal generated by a digital signal processor. The digital signal processor analyzes the received signal to detect and determine the relative contribution of the IMD interference to the total received signal power and, when the IMD interference exceeds a predetermined level, sends a control signal to bypass the low noise amplifier. Identification of the presence of IMD interference is by spectral estimation to discern when the mobile phone is in the presence of large near-band signals from an AMPS or other narrow-band base station which causes in-band IMD. In a preferred embodiment, the spectral estimation is performed by collecting a series of data samples from the received signal and, using a digital signal processor (DSP), computing a Discrete Fourier Transform (DFT) to generate frequency domain data, passing the data through a filter bank, then using a decision algorithm to determine whether or not there is sufficient IMD present in the received signal to bypass the LNA. If the IMD level is high enough to warrant bypass of the LNA, the DSP will provide a signal to an automatic gain control (AGC) block for controlling a variable gain amplifier (VGA) to compensate for gain loss due to bypass of the LNA.

Abstract translation: 在CDMA蜂窝或宽带PCS移动电话接收机的前端，提供开关旁路连接以绕过低噪声放大器，通过放大器旁路连接发送接收的信号。 放大器旁路连接可以包括衰减器。 开关旁路由数字信号处理器产生的控制信号激活。 数字信号处理器分析接收到的信号以检测并确定IMD干扰对总接收信号功率的相对贡献，并且当IMD干扰超过预定电平时，发送控制信号以绕过低噪声放大器。 识别IMD干扰的存在是通过频谱估计来识别当移动电话在存在来自AMPS或其他导致带内IMD的其他窄带基站的大的近带信号的情况下。 在优选实施例中，通过从接收到的信号收集一系列数据采样来执行频谱估计，并且使用数字信号处理器（DSP），计算离散傅立叶变换（DFT）来产生频域数据，将数据传递通过 滤波器组，然后使用判定算法来确定接收到的信号中是否存在足够的IMD以绕过LNA。 如果IMD电平足够高以保证LNA的旁路，则DSP将为自动增益控制（AGC）模块提供一个信号，用于控制可变增益放大器（VGA），以补偿由于LNA旁路引起的增益损失。

公开(公告)号：USD377818S

公开(公告)日：1997-02-04

申请号：US47832

申请日：1996-01-16

Applicant: Steven D. Gray ,  Richard C. Helmstetter

Designer： Steven D. Gray ,  Richard C. Helmstetter

公开(公告)号：US09057016B2

公开(公告)日：2015-06-16

申请号：US13594901

申请日：2012-08-27

Applicant: Kamlesh P. Nair ,  Steven D. Gray

Inventor： Kamlesh P. Nair ,  Steven D. Gray

IPC: C08G63/02 ,  C09K19/36 ,  C08L77/00 ,  C09K19/22 ,  C09K19/30 ,  C09K19/32 ,  C09K19/34 ,  C09K19/48 ,  C08K5/20 ,  C09K19/04

CPC classification number: C09K19/22 ,  C08K5/20 ,  C09K19/3086 ,  C09K19/322 ,  C09K19/3444 ,  C09K19/48 ,  C09K2019/0481 ,  C08L67/03

Abstract: A method for forming a high molecular weight liquid crystalline polymer is provided. The method include melt polymerizing two or more precursor monomers (e.g., acetylated or non-acetylated) in the presence of an aromatic amide oligomer. The present inventors have discovered that such an oligomer can lower the melt viscosity of the viscous polymer as it is formed. The ability to lower melt viscosity in situ during melt polymerization enables the formation of high molecular weight polymers that display low melt viscosity and can still be removed from the reactor vessel without solidifying therein. This not only improves the ease of processing, but also allows molecular weights to be reached that are even higher than conventionally practical.

Abstract translation: 提供了形成高分子量液晶聚合物的方法。 该方法包括在芳族酰胺低聚物存在下熔融聚合两种或更多种前体单体（例如乙酰化或非乙酰化的）。 本发明人已经发现，这种低聚物可以降低粘稠聚合物形成时的熔体粘度。 在熔融聚合期间降低熔融粘度的能力使得能够形成显示低熔体粘度的高分子量聚合物，并且仍然可以从反应器容器中除去而不在其中固化。 这不仅提高了加工的容易性，而且还使达到甚至高于传统实际的分子量。

公开(公告)号：US09045685B2

公开(公告)日：2015-06-02

申请号：US13594923

申请日：2012-08-27

Applicant: Kamlesh P. Nair ,  Steven D. Gray ,  Joseph J. Grenci

Inventor： Kamlesh P. Nair ,  Steven D. Gray ,  Joseph J. Grenci

IPC: C09K19/54 ,  C09K19/30 ,  C09K19/32 ,  C09K19/34 ,  C09K19/38 ,  C08L77/12 ,  B29C39/00 ,  C09K19/22 ,  C09K19/48 ,  C08K5/20 ,  C08K5/3492 ,  C09K19/04

CPC classification number: C09K19/54 ,  B29C39/006 ,  C08K5/20 ,  C08K5/34922 ,  C08L77/12 ,  C09K19/22 ,  C09K19/3086 ,  C09K19/322 ,  C09K19/3444 ,  C09K19/48 ,  C09K2019/0481

Abstract: A molded part having a predetermined shape is provided. The molded part may be formed by casting a liquid crystalline polymer composition into a mold cavity at a relatively low shear rate. Due to the use of a relatively low shear rate, the polymer composition does not generally undergo extensive shear orientation, which can allow the resulting part to be further processed using standard finishing techniques. The ability to use relatively low shear rates during casting is achieved in the present invention through the use of an aromatic amide oligomer. More particularly, the present inventors have discovered that the aromatic amide oligomer can serve as a flow aid by altering intermolecular polymer chain interactions, thereby lowering the overall viscosity of the polymer matrix to “ultralow” levels without having a significant impact on the mechanical properties.

Abstract translation: 提供具有预定形状的模制件。 模制部件可以通过将液晶聚合物组合物以相对低的剪切速率浇铸到模腔中而形成。 由于使用相对低的剪切速率，聚合物组合物通常不经受广泛的剪切取向，这可以允许使用标准精整技术进一步处理所得到的部分。 在本发明中通过使用芳族酰胺低聚物实现了在铸造过程中使用相对低的剪切速率的能力。 更具体地，本发明人已经发现，通过改变分子间聚合物链相互作用，芳族酰胺低聚物可以用作流动助剂，从而将聚合物基体的总体粘度降低到“超低”水平，而对机械性能没有显着的影响。

公开(公告)号：US08852730B2

公开(公告)日：2014-10-07

申请号：US13594919

申请日：2012-08-27

Applicant: Kamlesh P. Nair ,  Steven D. Gray ,  Camilo Cano

Inventor： Kamlesh P. Nair ,  Steven D. Gray ,  Camilo Cano

IPC: C09K19/38 ,  B29C43/24 ,  C09K19/48 ,  C09K19/32 ,  C09K19/34 ,  C09K19/30 ,  C09K19/22 ,  C08K5/20 ,  C09K19/04

CPC classification number: C09K19/22 ,  C08K5/20 ,  C09K19/3086 ,  C09K19/322 ,  C09K19/3444 ,  C09K19/48 ,  C09K2019/0481

Abstract: A melt-extruded substrate that can be readily thermoformed into a shaped, three-dimensional article is provided. The substrate is formed from a polymer composition that contains a thermotropic liquid crystalline polymer and a unique aromatic amide oligomer. The present inventors have discovered that the oligomer can help increase the “low shear” complex viscosity of the resulting polymer. The ability to achieve enhanced low shear viscosity values can lead to polymer compositions with an increased melt strength, which allows the resulting substrate to better maintain its shape during thermoforming without exhibiting a substantial amount of sag. Due to its relatively high degree of melt strength, the polymer composition is particularly well suited for forming thin extruded substrates for use in thermoforming processes.

Abstract translation: 提供了可以容易地热成型为成型的三维制品的熔融挤出基材。 基材由含有热致液晶聚合物和独特芳族酰胺低聚物的聚合物组合物形成。 本发明人已经发现，低聚物可以帮助提高所得聚合物的“低剪切”复数粘度。 获得增强的低剪切粘度值的能力可以导致具有增加的熔体强度的聚合物组合物，这允许所得到的基材在热成型期间更好地保持其形状，而不会显示大量的下垂。 由于其熔体强度相对较高，聚合物组合物特别适用于形成用于热成型工艺的薄的挤出基材。

公开(公告)号：US08669341B2

公开(公告)日：2014-03-11

申请号：US13594912

申请日：2012-08-27

Applicant: Kamlesh P. Nair ,  Steven D. Gray

Inventor： Kamlesh P. Nair ,  Steven D. Gray

IPC: C08G63/02 ,  C08G64/00

CPC classification number: C09K19/22 ,  C08K5/20 ,  C09K19/3086 ,  C09K19/322 ,  C09K19/3444 ,  C09K19/48 ,  C09K2019/0481

Abstract: A method for forming a high molecular weight thermotropic liquid crystalline polymer is provided. The method includes melt polymerizing two or more monomers in the presence of a unique aromatic amide oligomer to form a prepolymer, and then solid-state polymerizing the prepolymer to achieve a target molecular weight. The present inventors have discovered that a unique aromatic amide oligomer can be employed to help increase the “low shear” complex viscosity of the resulting solid-state polymerized composition. This allows for the attainment of higher than conventional “low shear” complex viscosity values and/or a substantial reduction in the solid-state polymerization time needed to achieve a target complex viscosity. In addition, the oligomeric flow aid can also accelerate the extent to which the “high shear” melt viscosity is increased during solid-state polymerization, which may also contribute to a substantial reduction in the solid-state polymerization time needed to achieve a certain molecular weight.

Abstract translation: 提供了形成高分子量热致液晶聚合物的方法。 该方法包括在独特的芳族酰胺低聚物存在下熔融聚合两种或更多种单体以形成预聚物，然后使预聚物固相聚合以达到目标分子量。 本发明人已经发现，可以使用独特的芳族酰胺低聚物来帮助提高所得固态聚合组合物的“低剪切”复数粘度。 这允许达到高于常规“低剪切”复数粘度值和/或实现目标复合物粘度所需的固态聚合时间的显着降低。 此外，低聚流动助剂还可以加速在固态聚合期间“高剪切”熔体粘度增加的程度，这也可能导致实现某种分子所需的固态聚合时间的显着降低 重量。

公开(公告)号：US20130137824A1

公开(公告)日：2013-05-30

申请号：US13306088

申请日：2011-11-29

Applicant: Steven D. Gray ,  Scott Cooper ,  Jason Clark

Inventor： Steven D. Gray ,  Scott Cooper ,  Jason Clark

IPC: C08F230/04 ,  C08L43/00

CPC classification number: C08F230/04 ,  C08F212/08 ,  C08F220/06 ,  C08F230/00

Abstract: A method for making a polystyrene ionomer comprises: preparing a metallic comonomer within styrene monomer to form a reaction mixture; and placing the reaction mixture under conditions suitable for the formation of a polymer composition. The metallic comonomer can be a metal acrylate, formed by contacting a metal complex and an acrylate precursor.

Abstract translation: 制备聚苯乙烯离聚物的方法包括：在苯乙烯单体内制备金属共聚单体以形成反应混合物; 并将反应混合物置于适于形成聚合物组合物的条件下。 金属共聚单体可以是通过使金属络合物和丙烯酸酯前体接触而形成的金属丙烯酸酯。

公开(公告)号：US20130052446A1

公开(公告)日：2013-02-28

申请号：US13594919

申请日：2012-08-27

Applicant: Kamlesh P. Nair ,  Steven D. Gray ,  Camilo Cano

Inventor： Kamlesh P. Nair ,  Steven D. Gray ,  Camilo Cano

IPC: C09K19/38 ,  B29C43/24

CPC classification number: C09K19/22 ,  C08K5/20 ,  C09K19/3086 ,  C09K19/322 ,  C09K19/3444 ,  C09K19/48 ,  C09K2019/0481

Abstract: A melt-extruded substrate that can be readily thermoformed into a shaped, three-dimensional article is provided. The substrate is formed from a polymer composition that contains a thermotropic liquid crystalline polymer and a unique aromatic amide oligomer. The present inventors have discovered that the oligomer can help increase the “low shear” complex viscosity of the resulting polymer. The ability to achieve enhanced low shear viscosity values can lead to polymer compositions with an increased melt strength, which allows the resulting substrate to better maintain its shape during thermoforming without exhibiting a substantial amount of sag. Due to its relatively high degree of melt strength, the polymer composition is particularly well suited for forming thin extruded substrates for use in thermoforming processes.

Abstract translation: 提供了可以容易地热成型为成型的三维制品的熔融挤出基材。 基材由含有热致液晶聚合物和独特芳族酰胺低聚物的聚合物组合物形成。 本发明人已经发现，低聚物可以帮助提高所得聚合物的低剪切复合物粘度。 获得增强的低剪切粘度值的能力可以导致具有增加的熔体强度的聚合物组合物，这允许所得到的基材在热成型期间更好地保持其形状而不显示大量的下垂。 由于其熔体强度相对较高，聚合物组合物特别适用于形成用于热成型工艺的薄的挤出基材。

公开(公告)号：USD675272S1

公开(公告)日：2013-01-29

申请号：US29416409

申请日：2012-03-21

Applicant: Matthew Greensmith ,  Nathan T. Sargent ,  Joseph Henry Hoffman ,  Robert Nunez ,  Steven D. Gray

Designer： Matthew Greensmith ,  Nathan T. Sargent ,  Joseph Henry Hoffman ,  Robert Nunez ,  Steven D. Gray

公开(公告)号：US08301189B1

公开(公告)日：2012-10-30

申请号：US12018163

申请日：2008-01-22

Applicant: Mahesh Subramanian ,  Steven D. Gray

Inventor： Mahesh Subramanian ,  Steven D. Gray

IPC: H04M1/00

CPC classification number: H04W52/028 ,  H04W52/0254 ,  H04W52/029 ,  Y02D70/142 ,  Y02D70/164 ,  Y02D70/23

Abstract: An apparatus for reducing power consumption in an IP (Internet Protocol) communications device. The apparatus may include a high-power consumption main application processor and a low-power consumption application processor to share processor functions. The high-power consumption application processor may carry out functions related to the user interface of the device, signaling and control path. The low-power consumption application processor may implement IP processing, voice signal processing and video signal processing.

Abstract translation: 一种用于降低IP（因特网协议）通信设备中的功耗的装置。 该装置可以包括大功率消耗主应用处理器和低功耗应用处理器以共享处理器功能。 高功耗应用处理器可以执行与设备的用户界面，信令和控制路径相关的功能。 低功耗应用处理器可以实现IP处理，语音信号处理和视频信号处理。