公开(公告)号：US06404046B1

公开(公告)日：2002-06-11

申请号：US09497377

申请日：2000-02-03

Applicant: Thomas P. Glenn ,  Steven M. Anderson

Inventor： Thomas P. Glenn ,  Steven M. Anderson

IPC: H01L2302

CPC classification number: H01L23/3107 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A module of electrically interconnected integrated circuit packages and methods of making the module are disclosed. The module includes at least first and second integrated circuit packages, each of which are comprised of a package body formed of an encapsulant material. A plurality of leads extend from the package bodies of the first and second packages. The leads are bent into a C-shape. Keys and keyholes in the package bodies allow the packages to be stacked one on top of the other. One or more leads of the first package are electrically connected to one or more leads of the second package through an interposer that is positioned between the first and second packages. The interposer includes conductive paths that enable the electrical connection of leads of the first and second packages in cases where the leads to be interconnected are displaced from one and other.

Abstract translation: 公开了电互连集成电路封装的模块和制造该模块的方法。 模块包括至少第一和第二集成电路封装，每个封装由封装材料形成的封装体构成。 多个引线从第一和第二封装的封装主体延伸。 引线弯曲成C形。 包装体中的钥匙和钥匙孔允许包装物堆叠在另一个之上。 第一封装的一个或多个引线通过位于第一和第二封装之间的插入件电连接到第二封装的一个或多个引线。 插入器包括导电路径，其能够在待互连的引线从一个或另一个位移的情况下实现第一和第二封装的引线的电连接。