公开(公告)号：US20240331930A1

公开(公告)日：2024-10-03

申请号：US18616800

申请日：2024-03-26

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/32

CPC classification number: H01F27/292 ,  H01F27/2804 ,  H01F27/323 ,  H01F2027/2809

Abstract: A coil component, which is a kind of electronic component, is designed such that the resistivity of second electrode layers of external terminal electrodes are lower than the resistivity of first electrode layers. Therefore, the electric resistance when the voltage is applied between the external terminal electrodes and the current flows through the portion covering end surfaces is reduced as a whole of the external terminal electrode as compared with the electric resistance of an external terminal electrode constituted only by the first electrode layer.

公开(公告)号：US20230215617A1

公开(公告)日：2023-07-06

申请号：US18119457

申请日：2023-03-09

Applicant: TDK CORPORATION

Inventor： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H05K1/18 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F41/041 ,  H05K1/181 ,  H01F27/2804 ,  H01F2017/048

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US20230072929A1

公开(公告)日：2023-03-09

申请号：US17898736

申请日：2022-08-30

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F5/06 ,  H01F5/04 ,  H01F1/14

Abstract: In the coil component, external stress applied when the upper coil structure, the lower coil structure, and the magnetic sheet are stacked is dispersed by the undulation of both main surfaces of the magnetic sheet. By dispersing the stress in this manner, a situation in which defects such as cracks occur in the coil structure is effectively suppressed.

公开(公告)号：US20220392698A1

公开(公告)日：2022-12-08

申请号：US17829513

申请日：2022-06-01

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI

IPC: H01F27/32 ,  H01F27/29 ,  H01F27/255

Abstract: A coil component improving insulation between external terminals provided on the same surface of an element body is provided. In the coil component, when a voltage is applied via the external terminal electrode, for example, a potential difference may occur between the outer end portions. In the coil component, since the insulation between the outer end portions is enhanced by the upper insulator exposed on the end face of the element body, even when a potential difference occurs between the outer end portions, a situation in which the outer end portions are short-circuited on the end face is prevented.

公开(公告)号：US20210327637A1

公开(公告)日：2021-10-21

申请号：US17234029

申请日：2021-04-19

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Hitoshi OHKUBO ,  Masazumi ARATA

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/255 ,  H01F27/32

Abstract: In an insulation layer of a coil component, a thickness of a second covering part and a third covering part located on the penetration hole side of a first covering part is thinner than that of the first covering part. A stray capacitance occurring between a flat coil pattern and external terminal electrodes is reduced by making the first covering part of the insulation layer thicker than the second covering part and the third covering part. Further, since the second covering part and the third covering part of the insulation layers are thinner than the first covering part, a magnetic volume is increased while external dimensions of the base body is maintained, and thus a high inductance is realized.