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    ELECTRONIC COMPONENT
    23.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210358690A1

    公开(公告)日：2021-11-18

    申请号：US17243961

    申请日：2021-04-29

    Applicant: TDK CORPORATION

    Inventor： Toshihiro IGUCHI ,  Norihisa ANDO ,  Kenya TAMAKI ,  Kayou MATSUNAGA

    IPC: H01G4/232 ,  H05K3/34 ,  H01G4/005 ,  H01G2/06 ,  H01G4/30

    Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

    DIELECTRIC COMPOSITION AND ELECTRONIC DEVICE
    24.
    发明申请
    DIELECTRIC COMPOSITION AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20210202169A1

    公开(公告)日：2021-07-01

    申请号：US17119212

    申请日：2020-12-11

    Applicant: TDK CORPORATION

    Inventor： Toshihiro IGUCHI ,  Nobuto MORIGASAKI

    IPC: H01G4/12

    Abstract: A dielectric composition includes main phases and Ca-RE-Si—O segregation phases. The main phases include a main component expressed by ABO3. “A” includes at least one selected from barium and calcium. “B” includes at least one selected from titanium and zirconium. “RE” represents at least one of rare earth elements. A molar ratio of (Si/Ca) is larger than one. A molar ratio of (Si/RE) is larger than one, provided that the molar ratio of (Si/RE) is a molar ratio of silicon included in the segregation phases to the rare earth elements included therein. An average length of major axes of the segregation phases is 1.30-2.80 times as large as an average particle size of the main phases. An average length of minor axes of the segregation phases is 0.21-0.48 times as large as an average particle size of the main phases.

    DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
    25.
    发明申请
    DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200303122A1

    公开(公告)日：2020-09-24

    申请号：US16783209

    申请日：2020-02-06

    Applicant: TDK CORPORATION

    Inventor： Toshihiro IGUCHI

    IPC: H01G4/12 ,  H01G4/30 ,  C04B35/495 ,  C04B35/626 ,  C04B35/634 ,  C04B35/64

    Abstract: Provided is a dielectric composition which includes, as a main component, a complex oxide represented by a general formula AaBbC4O15+α and having a tungsten bronze structure, wherein “A” includes at least Ba, “B” includes at least Zr, “C” includes at least Nb, “a” is 3.05 or higher, and “b” is 1.01 or higher. In the dielectric composition, when the total number of atoms occupying M2 sites in the tungsten bronze structure is set to 1, the proportion of “B” is 0.250 or higher. In addition, in the dielectric composition, an X-ray diffraction peak of a (410) plane of the tungsten bronze structure is splitted into two, and an integrated intensity ratio of an integrated intensity of a high-angle side peak of the X-ray diffraction peak with respect to an integrated intensity of a low-angle side peak of the X-ray diffraction peak is 0.125 or higher.

    EQUIVALENT CIRCUIT
    27.
    发明申请
    EQUIVALENT CIRCUIT 有权

    公开(公告)号：US20250096765A1

    公开(公告)日：2025-03-20

    申请号：US18756961

    申请日：2024-06-27

    Applicant: TDK CORPORATION

    Inventor： Toshihiro IGUCHI ,  Masaki HARA ,  Ryota NAMIKI ,  Ayako SATO ,  Kenya TAMAKI

    IPC: H03H7/00

    Abstract: An equivalent circuit includes a first capacitor having a first capacitance, a circuit part configured to include an inductor component, a capacitor component, and a resistor connected in series with one another, the circuit part being connected in parallel with the first capacitor, and a second capacitor provided between the first capacitor and the circuit part and having a second capacitance. The first capacitance of the first capacitor changes in accordance with a voltage value of a direct current voltage applied to the first capacitor. The second capacitor has the positive second capacitance that changes in accordance with the voltage value of the direct current voltage applied to the first capacitor and that is N times (N>0) the first capacitance of the first capacitor.

    ELECTRONIC COMPONENT
    30.
    发明公开
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240087812A1

    公开(公告)日：2024-03-14

    申请号：US18359319

    申请日：2023-07-26

    Applicant: TDK CORPORATION

    Inventor： Toshihiro IGUCHI ,  Hisashi KOBAYASHI ,  Norihisa ANDO ,  Kenya TAMAKI

    IPC: H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/2325 ,  H01G4/30

    Abstract: An electronic component includes a component body, a metal terminal, and a bonding material. The component body includes an element body and an external electrode. The metal terminal includes a first main surface and a second main surface, and a side surface. The bonding material electrically and physically connects the external electrode and the metal terminal. The metal terminal includes a first metal layer including the first main surface, a second metal layer including the second main surface, and a terminal body including the side surface. The terminal body is exposed at the side surface, and the first metal layer and the second metal layer are separated from each other on the side surface. Each of the first metal layer and the second metal layer includes a Ni plated layer. The terminal body includes Cu. The bonding material includes solder.

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