公开(公告)号：US09646950B2

公开(公告)日：2017-05-09

申请号：US15012907

申请日：2016-02-02

Applicant: Texas Instruments Incorporated

Inventor： Kejun Zeng ,  Amit Sureshkumar Nangia

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/85 ,  H01L21/56 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4845 ,  H01L2224/48507 ,  H01L2224/48824 ,  H01L2224/85035 ,  H01L2224/85205 ,  H01L2224/85948 ,  H01L2924/00014 ,  H01L2924/3862 ,  H01L2924/013 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for fabricating a semiconductor device is disclosed. A packaged semiconductor device is provided having copper ball bonds attached to aluminum pads. The packaged device is treated for at least one cycle at a temperature in the range from about 250° C. to 270° C. for a period of time in the range from about 20 s to 40 s.