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    Camera module of reduced size in two dimensions and electronic device including the same
    22.
    发明授权
    Camera module of reduced size in two dimensions and electronic device including the same 有权

    公开(公告)号：US11582371B2

    公开(公告)日：2023-02-14

    申请号：US17366373

    申请日：2021-07-02

    Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.

    Inventor： Jing-Wei Li ,  Sheng-Jie Ding ,  Jian-Chao Song ,  Yu-Shuai Li

    IPC: H04N5/225 ,  G03B17/56

    Abstract: A camera module miniaturized in both width and length includes a baseplate, a lens assembly, and a bracket. The bracket includes a support plate and a support member disposed on the support plate. The support plate includes a first surface facing away from the baseplate and a second surface facing the baseplate. The support plate defines a first opening penetrating the first surface and the second surface. The lens assembly is disposed on the first surface and completely covers the first opening. The support member is located between the support plate and the baseplate. The support member includes a first support portion and a plurality of second support portions arranged at intervals, the first support portion is disposed on the second surface and surrounds the peripheral edge of the first opening. Each second support portion extends outwards from an outer surface of the first support portion.

    CAMERA MODULE AND ELECTRONIC DEVICE HAVING THE CAMERA MODULE
    23.
    发明申请
    CAMERA MODULE AND ELECTRONIC DEVICE HAVING THE CAMERA MODULE 有权

    公开(公告)号：US20220191364A1

    公开(公告)日：2022-06-16

    申请号：US17508262

    申请日：2021-10-22

    Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.

    Inventor： Jing-Wei Li ,  Ding-Nan Huang ,  Jian-Chao Song ,  Yu-Shuai Li

    IPC: H04N5/225 ,  H05K1/18

    Abstract: A camera module includes a circuit board, a photosensitive chip, a filter, a 1 holder, and a lens assembly. A receiving groove is recessed from a surface of the circuit board. The photosensitive chip is received in the receiving groove. The holder is mounted on the surface of the circuit board and covers the photosensitive chip. The filter is mounted in the holder and spaced from the photosensitive chip. The lens assembly is mounted on the holder and located at a side of the filter facing away from the photosensitive chip. A dustproof layer is laid on the surface of the circuit board facing the filter and surrounds the photosensitive chip. An electronic device having the camera module is also provided.

    Lens module with improved image quality and electronic device with the same
    25.
    发明授权
    Lens module with improved image quality and electronic device with the same 有权

    公开(公告)号：US11022730B2

    公开(公告)日：2021-06-01

    申请号：US16384133

    申请日：2019-04-15

    Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

    Inventor： Shin-Wen Chen ,  Jian-Chao Song ,  Jing-Wei Li ,  Sheng-Jie Ding

    IPC: G02B5/02 ,  H04N5/225

    Abstract: A lens module with enhanced absorption of stray light includes a sensor and a mounting bracket. The sensor includes a photosensitive area and a non-photosensitive area arranged surrounding the photosensitive area. The sensor is received in the mounting bracket and a window is defined in the mounting bracket. An annular flange extends from an inner wall of the window towards a center axis of the window. The annular flange includes a reflecting surface facing away from the inner wall of the window and tilted towards the sensor. The photosensitive area is exposed in a through hole of the annular flange. Diffusing reflection structures are formed on the reflecting surface and are configured to diffuse light incident on the non-photosensitive area away from the photosensitive area.

    3D sensing camera of electronic device
    26.
    发明授权
    3D sensing camera of electronic device 有权

    公开(公告)号：US10785467B2

    公开(公告)日：2020-09-22

    申请号：US16248996

    申请日：2019-01-16

    Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.

    Inventor： Shin-Wen Chen ,  Ye-Quang Chen ,  Jing-Wei Li ,  Sheng-Jie Ding ,  Chia-Wei Chen

    IPC: H04N13/257 ,  H04N9/07 ,  H04N13/25 ,  H04N5/225

    Abstract: A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.

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