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公开(公告)号:US10964816B2
公开(公告)日:2021-03-30
申请号:US16441080
申请日:2019-06-14
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Kai-Chieh Yang , Li-Yang Chuang , Pei-Yu Wang , Wei Ju Lee , Ching-Wei Tsai , Kuan-Lun Cheng
IPC: H01L29/78 , H01L27/092 , H01L21/8238 , H01L29/08
Abstract: A semiconductor device and a method of forming the same are provided. A semiconductor device according to an embodiment includes a P-type field effect transistor (PFET) and an N-type field effect transistor (NFET). The PFET includes a first gate structure formed over a substrate, a first spacer disposed on a sidewall of the first gate structure, and an unstrained spacer disposed on a sidewall of the first spacer. The NET includes a second gate structure formed over the substrate, the first spacer disposed on a sidewall of the second gate structure, and a strained spacer disposed on a sidewall of the first spacer.
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公开(公告)号:US20210057559A1
公开(公告)日:2021-02-25
申请号:US16549266
申请日:2019-08-23
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Li-Yang Chuang , Ching-Wei Tsai , Wang-Chun Huang , Kuan-Lun Cheng
IPC: H01L29/775 , H01L23/522 , H01L29/06 , H01L21/02 , H01L21/306 , H01L21/311 , H01L21/768 , H01L29/66
Abstract: An integrated circuit (IC) structure with a nanowire power switch device and a method of forming the IC structure are disclosed. The method includes forming a first layer of metal lines of a first back end of line (BEOL) interconnect structure and forming a semiconductor nanowire structure on a first metal line of the first layer of metal lines. The BEOL interconnect structure is formed on a front end of line (FEOL) device layer having multiple active devices. The method further includes forming a first dielectric layer wrapped around the semiconductor nanowire structure, forming a metal layer on the dielectric layer and on a second metal line of the first layer of metal lines, and forming a second layer of metal lines of a second BEOL interconnect structure on the semiconductor nanowire structure. The first and second metal lines are electrically isolated from each other.
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