公开(公告)号：US20210043425A1

公开(公告)日：2021-02-11

申请号：US16979793

申请日：2019-06-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi SAWACHI

IPC: H01J37/32 ,  C23C16/455 ,  H01L21/67

Abstract: When a gas supplied to a gas injection unit is switched from a first processing gas to a second processing gas, a controller of a gas supply system performs control to open a first supply on/off valve connected to the gas injection unit and provided in a first gas supply line for supplying the first processing gas and a second exhaust on/off valve provided in a first gas exhaust line branched from the first gas supply line, close a second supply on/off valve connected to the gas injection unit and provided in a second gas supply line for supplying the second processing gas and a first exhaust on/off valve provided in a second gas exhaust line branched from the second gas supply line; and then open the second supply on/off valve and the first exhaust on/off valve and close the first supply on/off valve and the second exhaust on/off valve.

公开(公告)号：US20150000707A1

公开(公告)日：2015-01-01

申请号：US14311640

申请日：2014-06-23

Applicant: Tokyo Electron Limited

Inventor： Eiji TAKAHASHI ,  Norikazu SASAKI ,  Atsushi SAWACHI

IPC: H01J37/32

CPC classification number: H01J37/32862 ,  H01J37/32449 ,  H01J37/32853 ,  Y10T137/2574

Abstract: A method for cleaning a process chamber of a processing apparatus including the process chamber and a gas supply mechanism. The gas supply mechanism includes a flow splitter, a first flow path communicating with an upstream end of the flow splitter, a first valve provided in the first flow path, a second flow path communicating with a downstream end of the flow splitter and connected to the process chamber, a second valve provided in the second flow path, a bypass flow path connecting the first flow path and the second flow path, and a bypass valve provided in the bypass flow path. The method includes a step of closing the first valve and the second valve and opening the bypass valve, and a step of cleaning the process chamber by introducing a gas through the bypass flow path into the process chamber after opening the bypass valve.

Abstract translation: 一种用于清洁包括处理室和气体供应机构的处理设备的处理室的方法。 气体供给机构包括分流器，与分流器的上游端连通的第一流路，设置在第一流路中的第一阀，与流量分配器的下游端连通的第二流路， 处理室，设置在第二流路中的第二阀，连接第一流路和第二流路的旁通流路，以及设置在旁通流路中的旁通阀。 该方法包括关闭第一阀和第二阀并打开旁通阀的步骤，以及通过在打开旁通阀之后通过旁路流动路径将气体引入处理室来清洁处理室的步骤。