公开(公告)号：US10679845B2

公开(公告)日：2020-06-09

申请号：US15443306

申请日：2017-02-27

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Satoshi Okamura ,  Satoshi Biwa

IPC: H01L21/67 ,  H01L21/02 ,  B08B7/00 ,  H01L21/677 ,  B08B3/08 ,  H01L21/687

Abstract: Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a container body, and a holding member that conveys the substrate from an outside of the container body into the container body and holds the substrate inside the container body during the processing. A substrate support pin supporting a wafer and a cooling plate cooling the holding member are provided outside the container body.

公开(公告)号：US20200098594A1

公开(公告)日：2020-03-26

申请号：US16578587

申请日：2019-09-23

Applicant: Tokyo Electron Limited

Inventor： Yasuo Kiyohara ,  Hiroaki Inadomi ,  Satoshi Okamura

IPC: H01L21/67 ,  B08B3/10 ,  B08B5/00

Abstract: A substrate processing system includes: a substrate processing apparatus configured to process a substrate with a processing fluid; and a processing fluid supply apparatus configured to supply the processing fluid to the substrate processing apparatus. The processing fluid supply apparatus includes: a circulation line, a gas supply line, a cooler, a pump, a branch line, a heating unit, and a pressure regulator.

公开(公告)号：US20190103291A1

公开(公告)日：2019-04-04

申请号：US16143694

申请日：2018-09-27

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yoshihisa Aoyama

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02

Abstract: A substrate processing apparatus according to an embodiment includes a transport block and a plurality of processing blocks. In the transport block, a transport device for transporting a substrate is disposed. The plurality of processing blocks are disposed adjacent to the transport block and process the substrate transported by the transport device. Each processing block includes one liquid processing unit and one drying unit. The liquid processing unit performs a liquid film forming processing so as to form a liquid film on the top surface of the substrate. The drying unit performs a supercritical drying processing in which the substrate is dried by bringing the substrate into contact with the processing fluid in a supercritical state. The liquid processing unit and the drying unit included in the same processing block are disposed on the same side with respect to the movement direction of the transport device of the transport block.

公开(公告)号：US20170256398A1

公开(公告)日：2017-09-07

申请号：US15443306

申请日：2017-02-27

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Satoshi Okamura ,  Satoshi Biwa

IPC: H01L21/02 ,  B08B3/08 ,  H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a container body, and a holding member that conveys the substrate from an outside of the container body into the container body and holds the substrate inside the container body during the processing. A substrate support pin supporting a wafer and a cooling plate cooling the holding member are provided outside the container body.