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    Substrate processing apparatus and liquid mixing method
    3.
    发明授权
    Substrate processing apparatus and liquid mixing method 有权

    公开(公告)号：US10067514B2

    公开(公告)日：2018-09-04

    申请号：US14543951

    申请日：2014-11-18

    申请人： Tokyo Electron Limited

    发明人： Yasuo Kiyohara ,  Ikuo Sunaka ,  Koji Tanaka ,  Takami Satoh ,  Kazuyoshi Mizumoto ,  Takashi Uno ,  Hirotaka Maruyama ,  Hidetomo Uemukai ,  Tomiyasu Maezono

    IPC分类号： B01F15/04 ,  B01F15/02 ,  B01F3/08 ,  G05D11/13

    摘要： A substrate processing apparatus includes a mixing tank, a first opening/closing valve, a second opening/closing valve, a first flow rate measuring unit, a second flow rate measuring unit, a control unit, and a substrate processing unit. A first liquid and a second liquid are mixed such that the second liquid is mixed in an amount more than that of the first liquid. The first and second opening/closing valves open/close a first flow path and a second flow path, respectively. The first and second flow rate measuring units measure flow rates of the first and second liquids flowing through the first and second flow paths, respectively. The control unit controls opening/closing of the first opening/closing valve and the second opening/closing valve. The substrate processing unit processes a substrate by supplying a mixed liquid of the first and second liquids to the substrate.

    Supercritical fluid producing apparatus and substrate processing apparatus
    4.
    发明授权
    Supercritical fluid producing apparatus and substrate processing apparatus 有权

    公开(公告)号：US10796897B2

    公开(公告)日：2020-10-06

    申请号：US15828636

    申请日：2017-12-01

    申请人： Tokyo Electron Limited

    发明人： Yasuo Kiyohara

    IPC分类号： H01L21/02 ,  B01D11/04 ,  F26B5/00 ,  H01L21/67

    摘要： A supercritical fluid producing apparatus according to the present disclosure includes a gas supply line, a cooler, a pump, a buffer tank, a heating device, and a supercritical fluid supply line. An inlet port into which a processing fluid from the pump flows is formed at a predetermined position on the buffer tank, and an outlet port through which the processing fluid flows out is formed at a different position from the inlet port. The buffer tank includes a buffer tank body that stores the processing fluid from the pump, and a heater that heats the processing fluid sent into the buffer tank body.

    SUPERCRITICAL FLUID PRODUCING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
    5.
    发明申请
    SUPERCRITICAL FLUID PRODUCING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 审中-公开

    公开(公告)号：US20180158676A1

    公开(公告)日：2018-06-07

    申请号：US15828636

    申请日：2017-12-01

    申请人： Tokyo Electron Limited

    发明人： Yasuo Kiyohara

    IPC分类号： H01L21/02 ,  B01D11/04

    CPC分类号： H01L21/02101 ,  B01D11/0407 ,  F26B5/005 ,  H01L21/67017 ,  H01L21/67109

    摘要： A supercritical fluid producing apparatus according to the present disclosure includes a gas supply line, a cooler, a pump, a buffer tank, a heating device, and a supercritical fluid supply line. An inlet port into which a processing fluid from the pump flows is formed at a predetermined position on the buffer tank, and an outlet port through which the processing fluid flows out is formed at a different position from the inlet port. The buffer tank includes a buffer tank body that stores the processing fluid from the pump, and a heater that heats the processing fluid sent into the buffer tank body.

    SUBSTRATE PROCESSING APPARATUS
    6.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 审中-公开

    公开(公告)号：US20170287742A1

    公开(公告)日：2017-10-05

    申请号：US15467001

    申请日：2017-03-23

    申请人： Tokyo Electron Limited

    发明人： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yasuo Kiyohara ,  Satoshi Okamura ,  Satoshi Biwa ,  Nobuya Yamamoto ,  Katsuhiro Ookawa ,  Keiichi Yahata ,  Tetsuro Nakahara

    IPC分类号： H01L21/67 ,  B08B3/08 ,  B08B3/02 ,  B08B3/10

    摘要： Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.

    Substrate processing apparatus
    8.
    发明授权
    Substrate processing apparatus 有权

    公开(公告)号：US10593571B2

    公开(公告)日：2020-03-17

    申请号：US15467001

    申请日：2017-03-23

    申请人： Tokyo Electron Limited

    发明人： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yasuo Kiyohara ,  Satoshi Okamura ,  Satoshi Biwa ,  Nobuya Yamamoto ,  Katsuhiro Ookawa ,  Keiichi Yahata ,  Tetsuro Nakahara

    IPC分类号： H01L21/67 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10

    摘要： Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.

    SUBSTRATE PROCESSING APPARATUS AND LIQUID MIXING METHOD
    9.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND LIQUID MIXING METHOD 审中-公开
    基板处理装置和液体混合方法

    公开(公告)号：US20150146498A1

    公开(公告)日：2015-05-28

    申请号：US14543951

    申请日：2014-11-18

    申请人： Tokyo Electron Limited

    发明人： Yasuo Kiyohara ,  Ikuo Sunaka ,  Koji Tanaka ,  Takami Satoh ,  Kazuyoshi Mizumoto ,  Takashi Uno ,  Hirotaka Maruyama ,  Hidetomo Uemukai ,  Tomiyasu Maezono

    IPC分类号： B01F15/04 ,  B01F15/02 ,  B01F3/08

    CPC分类号： G05D11/132 ,  B01F3/088 ,  B01F15/0479

    摘要： A substrate processing apparatus includes a mixing tank, a first opening/closing valve, a second opening/closing valve, a first flow rate measuring unit, a second flow rate measuring unit, a control unit, and a substrate processing unit. A first liquid and a second liquid are mixed such that the second liquid is mixed in an amount more than that of the first liquid. The first and second opening/closing valves open/close a first flow path and a second flow path, respectively. The first and second flow rate measuring units measure flow rates of the first and second liquids flowing through the first and second flow paths, respectively. The control unit controls opening/closing of the first opening/closing valve and the second opening/closing valve. The substrate processing unit processes a substrate by supplying a mixed liquid of the first and second liquids to the substrate.

    摘要翻译： 基板处理装置包括混合槽，第一开闭阀，第二开闭阀，第一流量测量单元，第二流量测量单元，控制单元和基板处理单元。 混合第一液体和第二液体，使得第二液体的混合量大于第一液体的量。 第一和第二打开/关闭阀分别打开/关闭第一流动路径和第二流动路径。 第一和第二流量测量单元分别测量流过第一和第二流路的第一和第二液体的流量。 控制单元控制第一打开/关闭阀和第二打开/关闭阀的打开/关闭。 基板处理单元通过将第一和第二液体的混合液体供给到基板来处理基板。