公开(公告)号：US20190103291A1

公开(公告)日：2019-04-04

申请号：US16143694

申请日：2018-09-27

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yoshihisa Aoyama

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02

Abstract: A substrate processing apparatus according to an embodiment includes a transport block and a plurality of processing blocks. In the transport block, a transport device for transporting a substrate is disposed. The plurality of processing blocks are disposed adjacent to the transport block and process the substrate transported by the transport device. Each processing block includes one liquid processing unit and one drying unit. The liquid processing unit performs a liquid film forming processing so as to form a liquid film on the top surface of the substrate. The drying unit performs a supercritical drying processing in which the substrate is dried by bringing the substrate into contact with the processing fluid in a supercritical state. The liquid processing unit and the drying unit included in the same processing block are disposed on the same side with respect to the movement direction of the transport device of the transport block.

公开(公告)号：US10593571B2

公开(公告)日：2020-03-17

申请号：US15467001

申请日：2017-03-23

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yasuo Kiyohara ,  Satoshi Okamura ,  Satoshi Biwa ,  Nobuya Yamamoto ,  Katsuhiro Ookawa ,  Keiichi Yahata ,  Tetsuro Nakahara

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10

Abstract: Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.

公开(公告)号：US09558972B2

公开(公告)日：2017-01-31

申请号：US14289992

申请日：2014-05-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tooru Nakamura

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67017

Abstract: In one embodiment, a clean gas supply mechanism includes a supply path having an upstream end provided with a gas intake port, and a downstream end connected to a treatment chamber. The supply path is provided therein with a fan, and a filter disposed upstream of the fan. A return path branches from the supply path at a first position downstream of the fan and upstream of the treatment chamber and is connected to the supply path at a second position downstream of the filter and upstream of the fan. A switching mechanism selectively switches between a first state where the clean gas flows into the treatment chamber, and a second state where the clean gas returns to the supply path through the return path.

Abstract translation: 在一个实施例中，清洁气体供应机构包括供给路径，其具有设置有气体进入口的上游端，以及连接到处理室的下游端。 供给路径设置有风扇和设置在风扇上游的过滤器。 返回路径在风扇下游的第一位置和处理室的上游处从供给路径分支，并且在过滤器的下游的第二位置和风扇的上游连接到供给路径。 切换机构选择性地切换清洁气体流入处理室的第一状态和清洁气体通过返回路径返回供给路径的第二状态。

公开(公告)号：US11139181B2

公开(公告)日：2021-10-05

申请号：US16143694

申请日：2018-09-27

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yoshihisa Aoyama

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02 ,  B05C11/10

Abstract: A substrate processing apparatus according to an embodiment includes a transport block and a plurality of processing blocks. In the transport block, a transport device for transporting a substrate is disposed. The plurality of processing blocks are disposed adjacent to the transport block and process the substrate transported by the transport device. Each processing block includes one liquid processing unit and one drying unit. The liquid processing unit performs a liquid film forming processing so as to form a liquid film on the top surface of the substrate. The drying unit performs a supercritical drying processing in which the substrate is dried by bringing the substrate into contact with the processing fluid in a supercritical state. The liquid processing unit and the drying unit included in the same processing block are disposed on the same side with respect to the movement direction of the transport device of the transport block.

公开(公告)号：US20170287742A1

公开(公告)日：2017-10-05

申请号：US15467001

申请日：2017-03-23

Applicant: Tokyo Electron Limited

Inventor： Hiroaki Inadomi ,  Tooru Nakamura ,  Kouji Kimoto ,  Yasuo Kiyohara ,  Satoshi Okamura ,  Satoshi Biwa ,  Nobuya Yamamoto ,  Katsuhiro Ookawa ,  Keiichi Yahata ,  Tetsuro Nakahara

IPC: H01L21/67 ,  B08B3/08 ,  B08B3/02 ,  B08B3/10

Abstract: Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that performs a drying processing on the substrate in a wet state; a first conveyance unit that conveys the substrate to the liquid processing unit; a second conveyance unit that conveys the substrate in the wet state from the liquid processing unit to the drying processing unit; and a third conveyance unit that conveys the substrate before the liquid processing in the liquid processing unit and to convey the substrate after the drying processing from the drying processing unit. The first and second conveyance units and the drying processing unit are disposed on a side that faces the third conveyance unit, and the liquid processing unit is disposed on a side that faces the first and second conveyance units and is opposite to the third conveyance unit.

公开(公告)号：US20160020122A1

公开(公告)日：2016-01-21

申请号：US14795316

申请日：2015-07-09

Applicant: Tokyo Electron Limited

Inventor： Sho Watanabe ,  Daisuke Aoki ,  Tooru Nakamura

IPC: H01L21/67

CPC classification number: H01L21/67253 ,  H01L21/67051

Abstract: A substrate processing apparatus includes: a chamber that accommodates a processing target substrate therein; a gas supply unit that supplies a gas into the chamber; a gas discharge port that exhausts the chamber; an adjustment mechanism that adjusts an exhaust amount discharged from the gas discharge port; a measuring unit that measures an internal pressure of the chamber; and a controller that executes a series of substrate processings according to recipe information indicating contents of substrate processings. The controller performs a feedback control that controls an opening degree of the adjustment mechanism to maintain the internal pressure within a prescribed range based on a measurement result from the measuring unit. When a predetermined event, estimated to change the internal pressure to a level out of the prescribed range, occurs, the controller switches the feedback control to a non-feedback control that controls the opening degree based on a prescribed control value.

Abstract translation: 基板处理装置包括：容纳处理对象基板的腔室; 气体供应单元，其将气体供应到所述室中; 排气室的排气口; 调节从排气口排出的排气量的调节机构; 测量单元，其测量所述室的内部压力; 以及控制器，其根据表示基板处理的内容的配方信息执行一系列的基板处理。 控制器基于来自测量单元的测量结果执行控制调节机构的开度以将内部压力维持在规定范围内的反馈控制。 当将预计将内部压力改变到超出规定范围的水平的预定事件发生时，控制器将反馈控制切换到基于规定控制值来控制开度的非反馈控制。