公开(公告)号：US09243909B2

公开(公告)日：2016-01-26

申请号：US13478619

申请日：2012-05-23

申请人： Masayasu Sakuma ,  Yoshihiro Kobayashi ,  Shojiro Kitamura ,  Taketo Chino ,  Michiharu Ogami

发明人： Masayasu Sakuma ,  Yoshihiro Kobayashi ,  Shojiro Kitamura ,  Taketo Chino ,  Michiharu Ogami

IPC分类号： G01P1/02 ,  G01C19/5783 ,  G01D11/24 ,  G01P15/18

CPC分类号： G01D11/30 ,  G01C19/5783 ,  G01D11/245 ,  G01P1/00 ,  G01P1/02 ,  G01P1/023 ,  G01P1/026 ,  G01P15/18

摘要： A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

摘要翻译： 模块包括传感器装置，具有多个安装面的安装基板，彼此相邻的安装面之间的可折叠的部分，具有固定面的支撑构件，其中传感器装置安装在至少一个 安装面，每个安装面沿着每个固定面设置，并且传感器装置设置在支撑构件侧。

公开(公告)号：US08248813B2

公开(公告)日：2012-08-21

申请号：US13051279

申请日：2011-03-18

申请人： Atsushi Ono ,  Yoshihiro Kobayashi ,  Shojiro Kitamura ,  Masayuki Matsunaga ,  Akitoshi Hara

发明人： Atsushi Ono ,  Yoshihiro Kobayashi ,  Shojiro Kitamura ,  Masayuki Matsunaga ,  Akitoshi Hara

IPC分类号： H05K1/18

CPC分类号： B81B7/007 ,  B81B7/0074 ,  B81B2201/025 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15156 ,  H01L2924/15313 ,  H01L2924/16195 ,  Y10T29/49155 ,  H01L2924/00014

摘要： An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface.

摘要翻译： 电子设备包括：轮廓配置，其包括第一表面，与第一表面相对的第二表面和联接到第一和第二表面的安装表面; 第一基板，包括第一电极; 第二基板，包括第二电极; 设置在所述第一和第二基板之间的树脂; 以及用所述树脂密封并具有多面体轮廓构造的电气元件，所述电气元件设置成使得所述多面体的最宽表面面向所述第一基板和所述第二基板之一。 所述第一表面是所述第一基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第一基板的另一个表面相对。 所述第二表面是所述第二基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第二基板的另一表面相对。 安装表面包括：树脂在第一和第二基板之间的暴露表面以及与暴露表面相邻的第一和第二基板的侧表面。 第一电极设置在与安装表面相邻的第一表面的端部处并且电耦合到电气元件。 第二电极设置在邻近安装表面的第二表面的端部。