-
公开(公告)号：US20220165666A1
公开(公告)日：2022-05-26
申请号：US17670810
申请日：2022-02-14
发明人： Erich Radauscher , Ronald S. Cok , Matthew Alexander Meitl , Christopher Andrew Bower , Christopher Michael Verreen , Erik Paul Vick
IPC分类号： H01L23/525 , H01L23/544 , H01L23/528
摘要： A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
-
公开(公告)号：US11316086B2
公开(公告)日：2022-04-26
申请号：US17006674
申请日：2020-08-28
IPC分类号： H01L33/00 , H01L33/62 , H01L23/00 , H01L25/075 , H01L33/22
摘要： A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.
-
公开(公告)号：US20220069154A1
公开(公告)日：2022-03-03
申请号：US17008264
申请日：2020-08-31
IPC分类号： H01L31/173 , H01L31/02 , H01L31/0232 , H01L31/153 , G02B6/10
摘要： An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.
-
公开(公告)号：US11233170B2
公开(公告)日：2022-01-25
申请号：US16777192
申请日：2020-01-30
摘要： A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.
-
公开(公告)号：US20210343903A1
公开(公告)日：2021-11-04
申请号：US16918808
申请日：2020-07-01
摘要： A transfer-print component structure comprises a component having a component first side and an opposing component second side, and a single electrode disposed on the component first side. The single electrode is the only electrode disposed on the component first side. One or more stabilizing connection posts are disposed on the first side and extend away from the component. Each of the one or more stabilizing connection posts is electrically conductive and is electrically connected in common to the single electrode. In some embodiments, the one or more stabilizing connection posts comprise at least three distal portions disposed at three spatially separated locations that are not in a common line. A printed structure comprises a destination substrate with a contact pad with at least one stabilizing connection post is in electrical contact the contact pad.
-
公开(公告)号：US20210151630A1
公开(公告)日：2021-05-20
申请号：US17163306
申请日：2021-01-29
发明人： Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson , Erik Paul Vick
摘要： An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
-
公开(公告)号：US10944027B2
公开(公告)日：2021-03-09
申请号：US16442142
申请日：2019-06-14
发明人： Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson , Erik Paul Vick
摘要： An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
-
公开(公告)号：US20210020491A1
公开(公告)日：2021-01-21
申请号：US17063681
申请日：2020-10-05
IPC分类号： H01L21/683 , H01L21/56 , H01L23/00 , B41F16/00
摘要： A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. Each sacrificial portion is exposed through an opening. A micro-device is disposed on each sacrificial portion and laterally attached to an anchor by a multi-layer tether. In certain embodiments, a micro-device structure is constructed by providing the source substrate, disposing micro-devices on each sacrificial portion, depositing a first tether layer over at least a portion of the source substrate and the micro-device, depositing a second tether layer over the first tether layer, and patterning the first tether layer and the second tether layer to form (i) a multi-layer tether for each of the micro-devices such that the multi-layer tether laterally attaches the micro-device to one of the anchors, and (ii) an opening exposing each of the sacrificial portions.
-
公开(公告)号：US20210016591A1
公开(公告)日：2021-01-21
申请号：US17064387
申请日：2020-10-06
IPC分类号： B42D25/36 , H01L25/16 , F21V23/00 , B42D25/29 , B42D25/355 , F21V8/00 , B42D25/305 , H01L41/113 , H02N2/18 , B42D25/45
摘要： A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.
-
公开(公告)号：US10832934B2
公开(公告)日：2020-11-10
申请号：US16008945
申请日：2018-06-14
IPC分类号： H01L21/683 , H01L21/56 , H01L23/00 , B41F16/00
摘要： A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. Each sacrificial portion is exposed through an opening. A micro-device is disposed on each sacrificial portion and laterally attached to an anchor by a multi-layer tether. In certain embodiments, a micro-device structure is constructed by providing the source substrate, disposing micro-devices on each sacrificial portion, depositing a first tether layer over at least a portion of the source substrate and the micro-device, depositing a second tether layer over the first tether layer, and patterning the first tether layer and the second tether layer to form (i) a multi-layer tether for each of the micro-devices such that the multi-layer tether laterally attaches the micro-device to one of the anchors, and (ii) an opening exposing each of the sacrificial portions.
-
-
-
-
-
-
-
-
-
搜索结果
83 条记录 (耗时 0.031 秒)