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公开(公告)号：US12236825B2
公开(公告)日：2025-02-25
申请号：US16101717
申请日：2018-08-13
Applicant: X Display Company Technology Limited
Inventor： Ronald S. Cok , Erich Radauscher , Erik Paul Vick , Andrew Tyler Pearson , Christopher Andrew Bower , Matthew Alexander Meitl
Abstract: A redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. The first subpixel includes a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. The first light emitter is controlled by the first subpixel controller through the first-light-emitter wire. The second subpixel includes a second-subpixel-controller location connected to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.
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公开(公告)号：US10796938B2
公开(公告)日：2020-10-06
申请号：US16723942
申请日：2019-12-20
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Christopher Andrew Bower , Matthew Alexander Meitl , James O. Thostenson
IPC: H01L21/68 , H01L21/78 , H01L21/683 , H01L21/56 , H01L21/306 , H01L23/31 , H01L23/00 , H01L25/00 , H01L25/075 , G03F7/00 , H05K1/11 , B29C59/02
Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.
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公开(公告)号：US11854855B2
公开(公告)日：2023-12-26
申请号：US16919072
申请日：2020-07-01
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Christopher Andrew Bower , Matthew Alexander Meitl , James O. Thostenson
IPC: H01L21/78 , H01L21/30 , H01L21/683 , H01L21/56 , H01L21/306 , H01L23/31 , H01L23/00 , H01L25/00 , H01L25/075 , G03F7/00 , H05K1/11 , B29C59/02
CPC classification number: H01L21/6835 , B29C59/026 , G03F7/0002 , H01L21/306 , H01L21/568 , H01L21/7806 , H01L23/3171 , H01L24/24 , H01L24/29 , H01L24/75 , H01L24/97 , H01L25/0753 , H01L25/50 , H05K1/111 , H01L2221/68368 , H01L2221/68381 , H01L2224/95001 , H01L2224/951 , H01L2224/95136 , H01L2924/1815
Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.
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公开(公告)号：US20220165666A1
公开(公告)日：2022-05-26
申请号：US17670810
申请日：2022-02-14
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Matthew Alexander Meitl , Christopher Andrew Bower , Christopher Michael Verreen , Erik Paul Vick
IPC: H01L23/525 , H01L23/544 , H01L23/528
Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
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公开(公告)号：US10796971B2
公开(公告)日：2020-10-06
申请号：US16101735
申请日：2018-08-13
Applicant: X Display Company Technology Limited
Inventor： Ronald S. Cok , Erich Radauscher , Salvatore Bonafede , Christopher Andrew Bower , Matthew Alexander Meitl , Carl Ray Prevatte, Jr. , Brook Raymond
IPC: H01L33/00 , H01L21/66 , H01L33/62 , H01L33/38 , H01L25/075
Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.
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Patent Agency Ranking
公开(公告)号：US20200259057A1
公开(公告)日：2020-08-13
申请号：US16806613
申请日：2020-03-02
Applicant: X Display Company Technology Limited
Inventor： Andrew Tyler Pearson , Erich Radauscher , Christopher Michael Verreen , Matthew Alexander Meitl , Christopher Andrew Bower , Ronald S. Cok
IPC: H01L33/62 , H01L23/538
Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.
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公开(公告)号：US11804431B2
公开(公告)日：2023-10-31
申请号：US17670810
申请日：2022-02-14
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Matthew Alexander Meitl , Christopher Andrew Bower , Christopher Michael Verreen , Erik Paul Vick
IPC: H01L23/525 , H01L23/544 , H01L23/528 , H01L27/12
CPC classification number: H01L23/5258 , H01L23/528 , H01L23/544 , H01L27/124
Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
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公开(公告)号：US11309197B2
公开(公告)日：2022-04-19
申请号：US16672399
申请日：2019-11-01
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Christopher Andrew Bower , Matthew Alexander Meitl
IPC: H01L21/67 , H01L21/68 , H01L21/66 , H01L21/683 , H01L25/075
Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.
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公开(公告)号：US11282786B2
公开(公告)日：2022-03-22
申请号：US16702352
申请日：2019-12-03
Applicant: X Display Company Technology Limited
Inventor： Erich Radauscher , Ronald S. Cok , Matthew Alexander Meitl , Christopher Andrew Bower , Christopher Michael Verreen , Erik Paul Vick
IPC: H01L23/525 , H01L23/528 , H01L23/544 , H01L27/12
Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
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公开(公告)号：US11489037B2
公开(公告)日：2022-11-01
申请号：US17487900
申请日：2021-09-28
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Alexander Meitl , Erich Radauscher , Ronald S. Cok
Abstract: A tiled display structure comprises a screen support having a screen emitter side and an opposing screen back side. A black matrix comprises a patterned layer of black-matrix material disposed on the screen back side, the pattern defining pixel openings that are substantially devoid of black-matrix material. An array of tiles comprises tiles each having a tile substrate and a plurality of pixels disposed in or on the tile substrate. Each pixel comprises one or more light emitters. The one or more light emitters are each disposed to emit light through a pixel opening in the black matrix. A substantially transparent adhesive layer adheres the array of tiles to the black-matrix material.
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