摘要:
The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers.
摘要:
The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers.
摘要:
A method for making a structure including at least the steps of: making at least one first portion of at least one getter material against a first substrate or a second substrate, making at least one second portion of at least one getter material against the second substrate when the first portion of getter material is placed against the first substrate, or against the first substrate when the first portion of getter material is placed against the second substrate, and attaching the second substrate to the first substrate by thermocompression of a first part of the first portion of getter material against at least one part of the second portion of getter material, forming at least one cavity delimited by the first substrate and the second substrate, a second part of the first portion of getter material being placed in the cavity.
摘要:
The structure comprises facing substrates bonded to one another by crushing a closed peripheral sealing strip delineating a closed cavity in which a microsystem is disposed between the substrates. Before crushing, the sealing strip comprises perforated patterns delineating a plurality of voids inside the strip.