公开(公告)号：US08112882B2

公开(公告)日：2012-02-14

申请号：US12285623

申请日：2008-10-09

申请人： Xavier Baillin ,  Jean Brun ,  Thierry Enot ,  David Henry

发明人： Xavier Baillin ,  Jean Brun ,  Thierry Enot ,  David Henry

IPC分类号： H05K3/30

CPC分类号： B81C1/00269 ,  B81B2203/0315 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49181 ,  Y10T29/49218 ,  H01L2924/00

摘要： A method for producing a structure includes bonding two substrates facing one another by crushing a closed peripheral sealing strip located between the two substrates, the closed peripheral sealing strip delineating a closed cavity between the substrates. A microsystem is disposed on one of the substrates within the closed cavity. Before crushing, the sealing strip includes perforated patterns delineating a plurality of voids inside the strip.

摘要翻译： 一种用于制造结构的方法包括通过破碎位于两个基板之间的封闭的外围密封条来封闭彼此面对的两个基板，封闭的外围密封条描绘出基板之间的封闭空腔。 微系统设置在闭合腔内的一个衬底上。 在破碎之前，密封条包括描绘带内的多个空隙的穿孔图案。

公开(公告)号：US20090094816A1

公开(公告)日：2009-04-16

申请号：US12285623

申请日：2008-10-09

申请人： Xavier Baillin ,  Jean Brun ,  Thierry Enot ,  David Henry

发明人： Xavier Baillin ,  Jean Brun ,  Thierry Enot ,  David Henry

IPC分类号： B23P17/00

CPC分类号： B81C1/00269 ,  B81B2203/0315 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49181 ,  Y10T29/49218 ,  H01L2924/00

摘要： The structure comprises facing substrates bonded to one another by crushing a closed peripheral sealing strip delineating a closed cavity in which a microsystem is disposed between the substrates. Before crushing, the sealing strip comprises perforated patterns delineating a plurality of voids inside the strip.

摘要翻译： 该结构包括通过粉碎描绘其中微系统设置在基板之间的封闭空腔的封闭的外围密封条彼此接合的面对的基板。 在破碎之前，密封条包括描绘条带内的多个空隙的穿孔图案。

公开(公告)号：US08782880B2

公开(公告)日：2014-07-22

申请号：US13115419

申请日：2011-05-25

申请人： Dominique Vicard ,  Jean Brun

发明人： Dominique Vicard ,  Jean Brun

IPC分类号： B23P19/00 ,  H01R43/00 ,  B65B15/00 ,  H01L25/065

CPC分类号： B65B15/00 ,  H01L25/0655 ,  H01L2924/0002 ,  Y10T29/5187 ,  Y10T29/5193 ,  Y10T29/53178 ,  Y10T29/53213 ,  Y10T29/53261 ,  H01L2924/00

摘要： An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.

摘要翻译： 一种用于在线上组装芯片器件的装置，每个芯片器件包括两个基本上平行的侧壁，以及用于接收所述线的一个侧壁中的凹槽。 该装置包括具有两个相对表面的夹持装置，相对表面之间的距离基本上恒定并且基本上等于芯片装置的两个侧壁之间的距离。 供线器适于连续地将电线与夹持装置的相对表面中的一个接触。 芯片装置馈送器适于在相对的表面之间一次一个地驱动芯片装置，并且它们的槽朝向导线。 夹持装置可以包括具有基本上垂直于线的旋转轴的两个圆柱形辊，相对的表面由辊的相应表面形成。

公开(公告)号：US08611101B2

公开(公告)日：2013-12-17

申请号：US13124762

申请日：2009-10-21

申请人： Jean Brun ,  Sophie Verrun ,  Dominique Vicard

发明人： Jean Brun ,  Sophie Verrun ,  Dominique Vicard

IPC分类号： H01R9/00 ,  H01R43/00

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/85 ,  H01L25/065 ,  H01L25/50 ,  H01L2224/32014 ,  H01L2224/45015 ,  H01L2224/45028 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/858 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  Y10T29/49194 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.

摘要翻译： 组装具有线元件的至少一个微电子芯片，该芯片包括用于嵌入线元件的凹槽。 线元件是具有基本上平行于凹槽的轴线的纵向轴线的线，包括至少两个被绝缘体覆盖的导电线。 该芯片包括凹槽中的至少一个导电凸块，该凸起与该线束的单根导电线的剥离区域电接触。

公开(公告)号：US20100245182A1

公开(公告)日：2010-09-30

申请号：US12665419

申请日：2008-06-18

申请人： Dominique Vicard ,  Jean Brun ,  Benoit Lepine

发明人： Dominique Vicard ,  Jean Brun ,  Benoit Lepine

IPC分类号： H01Q1/24 ,  H01L21/98

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.

摘要翻译： 本发明涉及射频发送/接收设备的制造。 本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时 机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

公开(公告)号：US6029517A

公开(公告)日：2000-02-29

申请号：US88683

申请日：1998-06-02

申请人： Jean Brun ,  Stephane Caplet

发明人： Jean Brun ,  Stephane Caplet

IPC分类号： G01P15/125 ,  G01V1/18 ,  G01P15/00

CPC分类号： G01V1/181 ,  G01P15/125 ,  G01P2015/0814

摘要： The invention relates to a miniaturized accelerometer of the type with spring compensation of the gravity effect. The accelerometer seismic mass (1), its support and the compensating spring (2) are produced in the same substrate (10), regulating means being provided for placing the spring under mechanical tension.

摘要翻译： 本发明涉及一种具有重力作用的弹簧补偿型的微型加速度计。 加速度计地震质量（1），其支撑和补偿弹簧（2）在相同的基板（10）中产生，调节装置用于将弹簧放置在机械张力下。

公开(公告)号：US5922955A

公开(公告)日：1999-07-13

申请号：US776845

申请日：1997-02-13

申请人： Jean Brun ,  Stephane Caplet ,  Patricia Touret ,  Gerard Ruzie

发明人： Jean Brun ,  Stephane Caplet ,  Patricia Touret ,  Gerard Ruzie

IPC分类号： G01P21/00 ,  B81B3/00 ,  B81C1/00 ,  G01P15/02 ,  G01P15/08 ,  G01P15/00

CPC分类号： G01P15/02 ,  G01P15/0802 ,  G01P2015/0828

摘要： An accelerometer includes a seismic mass which is subjected to a force when accelerated. The seismic mass is connected to a support by a mechanical connection which can bend under the influence of the force. A detector is provided to determine the acceleration induced in the seismic mass by the force. Compensation can be provided for the force exerted on the mass due to gravity. The mechanical connection includes at least one component which provides compensation and induces in the mechanical connection a prestress counteracting the force exerted on the mass by gravity.

摘要翻译： PCT No.PCT / FR96 / 00904 Sec。 371日期1997年2月13日 102（e）1997年2月13日PCT PCT 1996年6月13日PCT公布。 公开号WO97 / 00451 日期1997年1月3日加速度计包括在加速时受到力的地震质量。 地震质量通过能够在力的作用下弯曲的机械连接连接到支撑体上。 提供一个检测器，用于确定由力引起的地震质量中的加速度。 可以为因重力而施加在质量上的力提供补偿。 机械连接包括至少一个部件，其提供补偿并且在机械连接中引起抵抗由重力施加在质量块上的力的预应力。

公开(公告)号：US09093289B2

公开(公告)日：2015-07-28

申请号：US13521589

申请日：2011-02-02

申请人： Dominique Vicard ,  Jean Brun

发明人： Dominique Vicard ,  Jean Brun

IPC分类号： H05K7/06 ,  F21V21/00 ,  H05K13/00 ,  H01L29/06 ,  D03D1/00 ,  D03D9/00 ,  D03D15/00 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L29/0657 ,  D03D1/0088 ,  D03D9/00 ,  D03D15/00 ,  D10B2401/16 ,  D10B2401/18 ,  D10B2501/00 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/4807 ,  H01L2224/49 ,  H01L2224/858 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2224/45099

摘要： A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.

摘要翻译： 一种用于在两个基本上平行的拉紧螺纹上组装装置的方法。 该装置包括电子芯片和在装置的相对侧上开放的两个基本上平行的凹槽。 分离槽的距离对应于分开螺纹的距离。 该装置沿着垂直于凹槽平面的轴线具有穿透形状，在凹槽的水平处具有基部，并且具有比分开螺纹的距离更小的顶点。 该方法包括将装置的顶点放置在两个螺纹之间的步骤; 在所述两个螺纹之间移动所述装置，导致所述螺纹通过所述装置的穿透形状彼此分离; 并且在设备的持续运动中，直到螺纹穿透到凹槽中，从而恢复到其初始间隔距离。

公开(公告)号：US08860200B2

公开(公告)日：2014-10-14

申请号：US12737060

申请日：2009-06-02

申请人： Jean Brun

发明人： Jean Brun

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/90 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/90 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/18161 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/05599

摘要： This invention relates to a stacked electronic device composed of stacked electronic components (120, 130) distributed on one or several added-on levels (N2, N3) each added on the preceding level starting from a base level (N1) possibly containing at least one electronic component (110). At least one electrolytic connection pad of a first type (10.1) on an add-on level (N2) directly connects a conducting element (c1) placed on one face of an electronic component (120) on an add-on level (N2) to a conducting element (z1) placed on an opposite face of a neighboring level (N1) while at least one electrolytic connection pad of a second type (20.1) on the add-on level (N2) passes through a coating layer (220) coating the sides of the electronic component (120) on the add-on level (N2) and directly electrically connects two conducting elements (z1, z2) located on each side of said coating layer (220).

摘要翻译： 本发明涉及一种层叠的电子设备，其由堆叠的电子元件（120,130）组成，分布在一个或多个附加电平（N 2，N 3）上，每个级别（N2，N3）从基本级别（N1） 一个电子部件（110）。 在附加级（N2）上的第一类型（10.1）的至少一个电解连接焊盘直接连接放置在附加层（N2）上的电子部件（120）的一个面上的导电元件（c1） （N2）上的第二类型（20.1）的至少一个电解连接垫穿过涂层（220），所述导电元件（z1）放置在相邻电平（N1）的相对表面上， 在所述附加层（N2）上涂覆所述电子部件（120）的侧面并且直接电连接位于所述涂层（220）的每一侧上的两个导电元件（z1，z2）。

公开(公告)号：US08723312B2

公开(公告)日：2014-05-13

申请号：US12919512

申请日：2008-10-21

申请人： Jean Brun ,  Dominique Vicard ,  Sophie Verrun

发明人： Jean Brun ,  Dominique Vicard ,  Sophie Verrun

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.

摘要翻译： 组件包括至少一个具有两个平行的主表面和侧表面的微电子芯片，至少一个侧面包括容纳具有平行于凹槽的纵向轴线的线的线元件的纵向槽。 凹槽由至少两个侧壁描绘。 线元件在布置在一个侧壁上的至少一个凸块与与凸起相对的凹槽的侧壁之间的夹紧区域的水平处固定到芯片。 夹紧区域具有比线元件的直径更小的高度，并且沿凹槽的纵向轴线横向布置凸块的自由区域。 自由区域具有与分离两个侧壁的距离相对应的高度，该高度大于线元件的直径。