摘要:
Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.
摘要:
An object-oriented scripting tool uses a XML file for software development and domain management. The XML file includes at least a first tag that defines a scripting class in an object-oriented scripting language. The scripting class includes at least one method, which is defined in a second tag in the XML file. A generic software development and domain management script can be encapsulated into a general scripting class, which can be extended into individual scripting class for specific software development and domain management task.
摘要:
Disclosed herein is a method of fabricating an antenna in which a flexible stamp is formed from a first wafer, the first wafer transferring a pattern to the flexible stamp, in which an antenna substrate is shaped into a three-dimensional contour with a second mold, in which the flexible stamp is positioned in the second mold to deform the flexible stamp into the three-dimensional contour, and in which a metallic layer on the flexible stamp is cold welded to create a set of antenna traces on the antenna substrate in accordance with the pattern. The antenna traces may then be electroplated.
摘要:
Disclosed herein are teleconferencing pods that include a microphone and a loudspeaker for open-air conversations, connectible to a separate telephonic device that generates an intermittent sidetone that is active at certain times not in the control or monitoring of the pod. In those pods is a sidetone suppressor that suppresses a distracting open-air echo produced from the intermittent sidetone and a compensator that detects sidetone transitions to avoid generating an echo signal in the pod and to avoid adapting suppression in the absence of an externally-generated sidetone. Sidetone suppression may be by several means, and may include variables controlled by adaption, including delay factors, scalers and coefficients. Detailed information on various example embodiments of the inventions are provided in the Detailed Description below, and the inventions are defined by the appended claims.
摘要:
A surveillance camera that includes a device for capturing video signals and that converts the video signals to optical signals. The surveillance camera has a first component with a first aperture and a second component with a second aperture The second component engages the first component such that the first component rotates relative to the second component. The surveillance camera has a first optical component that extends through the first aperture of the first component. The surveillance camera also has a second optical component that extends through the second aperture of the second component. The first optical component is separated from the second optical component by a gap. The first optical component is operatively connected to the device. The first optical component receives the optical signals and transmits the optical signals to the second optical component across the gap to permit a continuous rotation of the first component relative to the second component. The second optical component communicates the optical signals to a destination.
摘要:
An optoelectronic device may be fabricated on a three dimensional surface by transferring a material from an elastomeric stamp to a non-planar substrate. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer. The material may be deposited on the stamp while the stamp is in a planar configuration or after the stamp has been deformed to a shape generally the same as the shape of the non-planar substrate. The material may be transferred by cold welding. The device may include organic layers.
摘要:
The present invention provides a deactivation method of multimedia broadcast multicast service for wireless communication system, comprising steps of: in SGSN, completing the context deactivation of user equipment of broadcast multicast service; in the user equipment, completing the context deactivation of user equipment of multimedia broadcast multicast service; in GGSN, completing the context deactivation of user equipment of multimedia broadcast multicast service; characterized by further comprising steps of: in SGSN, after completing the context deactivation of user equipment of multimedia broadcast multicast service, completing the context deactivation of user equipment of multimedia broadcast multicast service in a radio network controller of a radio access network. According to the method of the present invention, the context of user equipment of multimedia broadcast multicast service in the radio network controller is deleted, so that the waste of radio resources is prevented, the hidden troubles induced by the inconsistency of data among the network elements is removed, and a foundation for the correct realization of future products is laid.
摘要:
An apparatus and method for determining the depth of an object below a surface or the thickness of the dermis. The apparatus and method use a plurality of piezoelectric fingers having probes with differently sized contact areas. A plurality of measurements is taken using each of the probes with differently sized contact areas in order to determine the depth of an object below a surface or the thickness of the dermis.
摘要:
Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.