公开(公告)号：US20220033628A1

公开(公告)日：2022-02-03

申请号：US17279720

申请日：2019-09-13

Applicant: ZEON CORPORATION

Inventor： Takeshi Hirata ,  Takashi Iga

IPC: C08L23/00 ,  C08L75/04 ,  C08L25/06

Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product having a small variation in specific gravity. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic elastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

公开(公告)号：US09629240B2

公开(公告)日：2017-04-18

申请号：US14369854

申请日：2012-12-27

Applicant: ZEON CORPORATION

Inventor： Yuuki Hayashi ,  Takashi Iga

IPC: B32B5/28 ,  B32B27/08 ,  B32B27/12 ,  H05K1/03 ,  C08J5/24 ,  B32B37/24 ,  B32B38/08 ,  H05K3/00 ,  C08K3/36

CPC classification number: H05K3/4602 ,  B32B5/24 ,  B32B5/28 ,  B32B27/08 ,  B32B27/12 ,  B32B37/24 ,  B32B38/08 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/73 ,  B32B2457/08 ,  C08J5/24 ,  C08K3/36 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/007 ,  Y10T156/10 ,  Y10T428/2495

Abstract: A prepreg with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer includes a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and does not contain fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness smaller than the thickness of the first resin layer.