Abstract:
Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.
Abstract:
Provided is a method for producing a latex comprising hollow resin particles each with a high void ratio and a method for producing hollow resin particles each with a higher void ratio. In the method for producing the latex: a suspension treatment of the mixture liquid which comprises a monomer, a crosslinkable monomer, an oil-soluble polymerization initiator, a fat/fatty oil, a hydrocarbon solvent, a suspension stabilizer and an aqueous medium is carried out to prepare a suspension comprising monomer drops; a polymerization reaction of the suspension is carried out to prepare a precursor composition which comprises precursor particles each having a hollow portion including the hydrocarbon solvent.
Abstract:
The method for producing hollow resin particles includes: carrying out a suspension treatment of a mixture liquid including a polymerizable monomer including a non-crosslinkable monomer and a crosslinkable monomer, a hydrocarbon solvent and an aqueous medium to prepare a suspension, carrying out a polymerization reaction of the suspension to form precursor particles having a hollow portion and including the hydrocarbon solvent in the hollow portion, and removing the hydrocarbon solvent included in the precursor particles to produce hollow resin particles. A content of the crosslinkable monomer is from 35 parts by mass to 95 parts by mass when the total mass of the polymerizable monomer is regarded as 100 parts by mass; a solubility parameter (SP value) of the polymerizable monomer is from 8.70 to 9.42; and a difference between the SP value of the polymerizable monomer and a SP value of the hydrocarbon solvent is 0.60 or more.
Abstract:
A latex composition containing a conjugated diene polymer latex and a medium-chain fatty acid glyceride, wherein a content proportion of the medium-chain fatty acid glyceride is 1 to 40 parts by weight with respect to 100 parts by weight of the conjugated diene polymer. In the present invention, a medium-chain fatty acid forming the medium-chain fatty acid glyceride is preferably a fatty acid having 6 to 18 carbon atoms. In the present invention, the medium-chain fatty acid glyceride is preferably a medium-chain fatty acid triglyceride. The latex composition preferably further contains a crosslinking agent.
Abstract:
Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 μm to 9.0 μm, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.
Abstract:
A method of production of a circuit board comprising a step of forming resist patterns 20 on a support 10 by a photoresist to obtain a support with resist patterns, a step of forming a curable resin composition layer 30 which is comprised of a curable resin composition on the resist patterns 20 of the support with resist patterns, a step of laying a substrate 40 on the curable resin composition layer 30, a step of making the curable resin composition which forms the curable resin composition layer 30 cure to make the curable resin composition layer 30 a cured resin layer 30a, a step of peeling off the support 10 from the curable resin composition layer 30 or the cured resin layer 30a and the resist patterns 20 before or after making the curable resin composition cure, a step of peeling off or dissolving the resist patterns 20 to remove the resist patterns 20 from the cured resin layer 30a so as to form a cured resin layer which has relief structures, and a step of forming fine wirings 50 by plating recesses of the relief structures which are formed at the cured resin layer 30a.
Abstract:
A prepreg with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer includes a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and does not contain fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness smaller than the thickness of the first resin layer.
Abstract:
Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product having a small variation in specific gravity. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic elastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.
Abstract:
Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product having a small variation in specific gravity. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic elastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.
Abstract:
A foam containing a nitrile group-containing conjugated diene copolymer and a urethane polymer, wherein relative to 100 wt % of the sum of the nitrile group-containing conjugated diene copolymer and the urethane polymer, the nitrile group-containing conjugated diene copolymer is present in an amount of less than 90 wt % and the urethane polymer is present in an amount of more than 10 wt %, the nitrile group-containing conjugated diene copolymer contains ethylenically unsaturated nitrile monomer units in an amount of more than 31 wt %, the foam has a density of 0.08 to 0.30 g/cm3, and in observation of an arbitrary cross section of the foam, air bubble cross sections present in the cross section have an average diameter of 350 μm or less, and the number of air bubble cross sections with a diameter of 0.6 mm or more present in the cross section is 0.062 per mm2 or less.