Resin composition comprising thermoplastic plastomer and hollow resin particles and molded product thereof

    公开(公告)号:US12139609B2

    公开(公告)日:2024-11-12

    申请号:US17279711

    申请日:2019-09-13

    Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic plastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

    METHOD FOR PRODUCING HOLLOW RESIN PARTICLES

    公开(公告)号:US20220153881A1

    公开(公告)日:2022-05-19

    申请号:US17425987

    申请日:2020-01-30

    Abstract: The method for producing hollow resin particles includes: carrying out a suspension treatment of a mixture liquid including a polymerizable monomer including a non-crosslinkable monomer and a crosslinkable monomer, a hydrocarbon solvent and an aqueous medium to prepare a suspension, carrying out a polymerization reaction of the suspension to form precursor particles having a hollow portion and including the hydrocarbon solvent in the hollow portion, and removing the hydrocarbon solvent included in the precursor particles to produce hollow resin particles. A content of the crosslinkable monomer is from 35 parts by mass to 95 parts by mass when the total mass of the polymerizable monomer is regarded as 100 parts by mass; a solubility parameter (SP value) of the polymerizable monomer is from 8.70 to 9.42; and a difference between the SP value of the polymerizable monomer and a SP value of the hydrocarbon solvent is 0.60 or more.

    Latex composition
    4.
    发明授权

    公开(公告)号:US11118038B2

    公开(公告)日:2021-09-14

    申请号:US16337244

    申请日:2017-09-19

    Abstract: A latex composition containing a conjugated diene polymer latex and a medium-chain fatty acid glyceride, wherein a content proportion of the medium-chain fatty acid glyceride is 1 to 40 parts by weight with respect to 100 parts by weight of the conjugated diene polymer. In the present invention, a medium-chain fatty acid forming the medium-chain fatty acid glyceride is preferably a fatty acid having 6 to 18 carbon atoms. In the present invention, the medium-chain fatty acid glyceride is preferably a medium-chain fatty acid triglyceride. The latex composition preferably further contains a crosslinking agent.

    HOLLOW RESIN PARTICLES AND SHEET
    5.
    发明申请

    公开(公告)号:US20210002497A1

    公开(公告)日:2021-01-07

    申请号:US16981775

    申请日:2019-03-25

    Abstract: Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 μm to 9.0 μm, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.

    METHOD OF PRODUCTION OF CIRCUIT BOARD
    6.
    发明申请
    METHOD OF PRODUCTION OF CIRCUIT BOARD 审中-公开
    生产电路板的方法

    公开(公告)号:US20150237736A1

    公开(公告)日:2015-08-20

    申请号:US14424854

    申请日:2013-08-23

    Inventor: Takashi Iga

    Abstract: A method of production of a circuit board comprising a step of forming resist patterns 20 on a support 10 by a photoresist to obtain a support with resist patterns, a step of forming a curable resin composition layer 30 which is comprised of a curable resin composition on the resist patterns 20 of the support with resist patterns, a step of laying a substrate 40 on the curable resin composition layer 30, a step of making the curable resin composition which forms the curable resin composition layer 30 cure to make the curable resin composition layer 30 a cured resin layer 30a, a step of peeling off the support 10 from the curable resin composition layer 30 or the cured resin layer 30a and the resist patterns 20 before or after making the curable resin composition cure, a step of peeling off or dissolving the resist patterns 20 to remove the resist patterns 20 from the cured resin layer 30a so as to form a cured resin layer which has relief structures, and a step of forming fine wirings 50 by plating recesses of the relief structures which are formed at the cured resin layer 30a.

    Abstract translation: 一种电路板的制造方法,其特征在于,包括通过光致抗蚀剂在支持体10上形成抗蚀剂图案20以获得具有抗蚀剂图案的载体的步骤,形成由固化性树脂组合物构成的固化性树脂组合物层30的工序 具有抗蚀剂图案的支持体的抗蚀剂图案20,将基材40铺设在可固化树脂组合物层30上的步骤,使形成固化性树脂组合物层30的固化性树脂组合物固化,使固化性树脂组合物层 30表示固化树脂层30a,在使固化性树脂组合物固化前后之前,从固化性树脂组合物层30或固化树脂层30a和抗蚀图案20剥离载体10的步骤,剥离或溶解的步骤 抗蚀剂图案20,以从固化树脂层30a去除抗蚀剂图案20,以形成具有浮雕结构的固化树脂层,以及形成精细布线的步骤 通过在固化树脂层30a上形成的浮雕结构的凹部进行电镀。

    PREPREG, LAMINATE, AND METHOD OF PRODUCTION OF PREPREG
    7.
    发明申请
    PREPREG, LAMINATE, AND METHOD OF PRODUCTION OF PREPREG 有权
    PREPREG,LAMINATE和PREPREG的生产方法

    公开(公告)号:US20140363646A1

    公开(公告)日:2014-12-11

    申请号:US14369854

    申请日:2012-12-27

    Abstract: A prepreg with a first resin layer and a second resin layer which is formed on this first resin layer, wherein the first resin layer is formed by a first resin composition, the second resin layer includes a resin layer which is formed by a second resin composition which is different from the first resin composition and in which a fiber base material is contained, the second resin layer is provided with a fiber base material-containing layer, an A layer which is positioned at an opposite side of the first resin layer side of the fiber base material-containing layer and does not contain fiber base material, and a B layer which is positioned at the first resin layer side of the fiber base material-containing layer and which does not contain the fiber base material, and said B layer has a thickness smaller than the thickness of the first resin layer.

    Abstract translation: 在该第一树脂层上形成有第一树脂层和第二树脂层的预浸料,其中第一树脂层由第一树脂组合物形成,第二树脂层包括由第二树脂组合物形成的树脂层 其与第一树脂组合物不同,并且其中包含纤维基材,第二树脂层设置有含纤维基材的层,A层位于第一树脂层侧的相反侧 含有纤维基材的层并且不含纤维基材,B层位于含纤维基材层的第一树脂层侧,不含有纤维基材,所述B层 具有比第一树脂层的厚度小的厚度。

    RESIN COMPOSITION AND MOLDED PRODUCT THEREOF

    公开(公告)号:US20250026925A1

    公开(公告)日:2025-01-23

    申请号:US18906610

    申请日:2024-10-04

    Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product having a small variation in specific gravity. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic elastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

    Resin composition and molded product thereof

    公开(公告)号:US12139594B2

    公开(公告)日:2024-11-12

    申请号:US17279720

    申请日:2019-09-13

    Abstract: Provided is a resin composition configured to show a small change in the void ratio of hollow resin particles during mold processing and configured to stably mold a lightweight molded product having a small variation in specific gravity. The resin composition is a resin composition comprising 50 parts by mass to 95 parts by mass of a thermoplastic elastomer and 5 parts by mass to 50 parts by mass of hollow resin particles, wherein the hollow resin particles have a void ratio of from 50% to 85%; wherein the hollow resin particles have a shell containing a resin; and wherein, with respect to 100 parts by mass of repeating units constituting the resin, 30 parts by mass to 100 parts by mass of a crosslinkable monomer unit and 0 part by mass to 70 parts by mass of a non-crosslinkable monomer unit are contained as a polymerizable monomer unit.

    Foam
    10.
    发明授权
    Foam 有权

    公开(公告)号:US11525046B2

    公开(公告)日:2022-12-13

    申请号:US16769660

    申请日:2018-12-10

    Abstract: A foam containing a nitrile group-containing conjugated diene copolymer and a urethane polymer, wherein relative to 100 wt % of the sum of the nitrile group-containing conjugated diene copolymer and the urethane polymer, the nitrile group-containing conjugated diene copolymer is present in an amount of less than 90 wt % and the urethane polymer is present in an amount of more than 10 wt %, the nitrile group-containing conjugated diene copolymer contains ethylenically unsaturated nitrile monomer units in an amount of more than 31 wt %, the foam has a density of 0.08 to 0.30 g/cm3, and in observation of an arbitrary cross section of the foam, air bubble cross sections present in the cross section have an average diameter of 350 μm or less, and the number of air bubble cross sections with a diameter of 0.6 mm or more present in the cross section is 0.062 per mm2 or less.

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