公开(公告)号：US11559676B2

公开(公告)日：2023-01-24

申请号：US16897485

申请日：2020-06-10

Applicant: Greatbatch Ltd.

Inventor： Hans P. Rieckmann ,  Hans Pflaumer ,  Grant A. Scheibe ,  Biswa P. Das ,  Joseph E. Lesser ,  Thomas E. Bailey

IPC: A61M39/06 ,  A61M25/00 ,  A61M39/02 ,  A61M25/06

Abstract: In various examples, a hub for a medical device includes a hub housing including a passage from a proximal end of the hub housing to a distal end of the hub housing. A valve is disposed within the hub. The valve is configured to allow passage of an insertable device through the valve while inhibiting leakage of fluid from the valve. A cap is engaged to the hub housing. The cap includes an opening therethrough sized and shaped to allow passage of the insertable device through the opening. The opening allows access to the passage of the hub housing. An angled sidewall is disposed within the hub. The angled sidewall is configured to retain and deform the valve into a curved shape.

公开(公告)号：US11541233B2

公开(公告)日：2023-01-03

申请号：US17181416

申请日：2021-02-22

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Jason Woods

IPC: A61N1/00 ,  A61N1/08 ,  H01G4/005 ,  H01G4/30 ,  H01G4/35 ,  A61N1/375 ,  H01G4/236 ,  A61N1/36 ,  A61N1/39 ,  A61N1/362 ,  H01G4/12 ,  H03H1/00 ,  A61N1/37

Abstract: A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, or a thermal-setting electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

公开(公告)号：US11527795B2

公开(公告)日：2022-12-13

申请号：US16788679

申请日：2020-02-12

Applicant: Greatbatch Ltd.

Inventor： Robert S. Rubino ,  Keith W. Seitz ,  Xiaohong Tang ,  Todd C. Sutay ,  Brian P. Hohl ,  Holly Noelle Moschiano ,  Biswa P. Das ,  Afsar Ali ,  Sourabh Biswas ,  Gary Freitag ,  David Dianetti ,  Ho-Chul Yun ,  Thomas Marzano

IPC: H01M50/10 ,  H01M50/116 ,  H01M50/147 ,  H01M50/155 ,  H01M50/169 ,  H01M50/186 ,  H01M50/191 ,  H01M50/543 ,  H01M4/131 ,  H01M10/0525

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both of ceramic casing halves. A thin film metallization, such as of titanium, contacts an edge periphery of each ceramic casing half. The first ceramic casing half is moved into registry with the second ceramic casing half so that the first and second ring-shaped metallizations contact each other. Then, a laser welds through one of the casing halves being a substantially transparent ceramic, for example sapphire, to braze the first and second ring-shaped metallizations to each other to thereby join the first and second casing halves together to form a casing housing the electrode assembly. A solid electrolyte (LixPOyNz) activates the electrode assembly.

公开(公告)号：US20220331595A1

公开(公告)日：2022-10-20

申请号：US17715528

申请日：2022-04-07

Applicant: Greatbatch Ltd.

Inventor： Kenneth P. Moceri ,  Louie Serpe ,  Alison M. Torregrossa

IPC: A61N1/375

Abstract: A polymeric film cover assembly for isolating an electrochemical power source from the other components housed inside an implantable medical device is described. The cover assembly comprises a first shallow-formed shaped-cover of a polymeric film configured to cover a first portion of the exterior surface of the casing and a second shallow-formed shaped-cover of the polymeric film configured to cover a second portion of the exterior surface of the casing. With the first and second shaped-covers contacting the casing, the shaped-covers are connected to each other in an overlapping or butted relationship to substantially or completely cover the exterior surface area of the casing. The interlocking polyester shaped-covers are readily formable into the desired three-dimensional form factor of the casing of power source while maintaining a desirable film thinness.

公开(公告)号：US11344734B2

公开(公告)日：2022-05-31

申请号：US16589752

申请日：2019-10-01

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/40 ,  H01G4/005 ,  A61N1/08 ,  H01R43/00 ,  C22C29/12 ,  H02G3/22 ,  H01G4/30 ,  B23K35/30 ,  H01G2/10 ,  H01G4/35 ,  H01R13/52 ,  H01G4/236 ,  B23K35/32 ,  H01R4/02 ,  H01R13/719 ,  B23K35/02 ,  A61N1/05 ,  H01G4/12 ,  A61N1/372 ,  B22F7/08 ,  B22F1/10

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.

公开(公告)号：US20220085473A1

公开(公告)日：2022-03-17

申请号：US17471686

申请日：2021-09-10

Applicant: Greatbatch Ltd.

Inventor： Jared D. Arellano ,  Lasantha Viyannalage

IPC: H01M50/645 ,  H01M50/188

Abstract: A miniature electrochemical cell of a primary or secondary chemistry with a total volume that is less than 0.5 cc is described. The cell has a casing comprising an annular sidewall supported on a lower plate opposite an upper lid. The lid has a sealed electrolyte fill port that is axially aligned with an annulus residing between the inner surface of the annular sidewall and the electrode assembly. The fill port axially aligned with the annulus between the electrode assembly and the casing sidewall allows the casing to be filled with electrolyte using a vacuum filling process so that activating electrolyte readily wets the anode and cathode active materials and the intermediate separator.

公开(公告)号：US20220023643A1

公开(公告)日：2022-01-27

申请号：US17384193

申请日：2021-07-23

Applicant: Greatbatch Ltd.

Inventor： Scott Carter ,  Luis Daniel Villamil

IPC: A61N1/375

Abstract: In various examples, a header of an implantable device includes a first header portion and a second header portion at least partially disengageable from the first header portion. In a closed configuration, the first header portion is fully engaged with the second header portion, and in an open configuration, the first header portion is at least partially disengaged from the second header portion. At least one bore within the header is sized and shaped to accommodate a proximal end of a lead. The bore is split substantially longitudinally to form a first bore portion and a second bore portion. With the proximal end of the lead disposed within the bore and a positioning feature interacting with a lead feature, at least one lead contact aligns with at least one header contact to allow the at least one lead contact to electrically couple to the at least one header contact.

公开(公告)号：US20220013876A1

公开(公告)日：2022-01-13

申请号：US17358076

申请日：2021-06-25

Applicant: Greatbatch Ltd.

Inventor： Daniel M. Baumer ,  Joshua C. Ulrich ,  Marcus J. Palazzo ,  David Wutz ,  David Dianetti

IPC: H01M50/636 ,  H01M50/153 ,  H01M6/14

Abstract: A miniature electrochemical cell of a primary or secondary chemistry with a total volume that is less than 0.5 cc is described. The cell has a casing comprising an annular sidewall supported on a lower plate opposite an upper lid. The lid has a sealed electrolyte fill port. At least one electrolyte channel in the inner surface of the lid extends radially from the fill port and outwardly beyond an outer peripheral edge of the current collector. A current collector contacts an inner surface of the lid with a first electrode active material contacting the current collector. An opposite polarity active material contacts the lower plate. A dielectric material coats the lower open end of the annular sidewall and a portion of the inner surface of the sidewall. A glass seals the dielectric material to the lower plate. An electrolyte activates the electrode assembly.

公开(公告)号：US20210348253A1

公开(公告)日：2021-11-11

申请号：US17315895

申请日：2021-05-10

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Jason Woods

IPC: C22C14/00 ,  H05K5/06 ,  H05K9/00 ,  A61N1/375 ,  C23C14/35 ,  C22C5/02

Abstract: A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an ENI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant coating layer that is disposed on the device side surface of the hermetic seal ferrule over which an optional ECA stripe may be provided. The optional ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyamide, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free coating layer may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof. As used herein, the oxide-free coating layer is not limiting and as will be taught, in addition to sputtering, there are many other methods of applying a proud oxide-free surface on either an AIMD ferrule or am AIMD housing.

公开(公告)号：US20210154483A1

公开(公告)日：2021-05-27

申请号：US17165500

申请日：2021-02-02

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Brian P. Hohl ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/35 ,  H01G4/236 ,  H01G4/008 ,  H01G4/12

Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.