SYSTEMS AND METHODS CONFIGURED TO DEPLOY CUFFS ONTO BIOLOGICAL STRUCTURES

    公开(公告)号:US20210093853A1

    公开(公告)日:2021-04-01

    申请号:US15733239

    申请日:2018-12-14

    Abstract: An implant insertion system and methods of use of the implant insertion system are disclosed. The implant insertion system includes an implant and an instrument configured to deliver the implant to a biological structure and assist in deploying the implant to the biological structure. The instrument includes a retention member the secures the implant to the instrument and retains the implant in a first configuration. The retention member is movable to decouple the implant from the instrument. The implant is configured to transition from the first configuration to a second configuration, such that in the second configuration the implant is secured to the biological structure.

    Neural interface fabrication
    25.
    发明授权

    公开(公告)号:US10603486B2

    公开(公告)日:2020-03-31

    申请号:US16309182

    申请日:2017-06-12

    Abstract: Methods for fabricating implantable cuff electrodes for contacting or at least partially surrounding internal body tissue such as, e.g., nerves, smooth muscles, striated muscles, arteries, veins, ligamental tissues, connective tissues, cartilage tissues, bones, or other similar body tissues, structures and organs are disclosed. An example method includes preparing a substrate including an implantable cuff electrode shape, applying a mold material to the substrate, curing the mold material to form a mold, releasing the mold from the substrate, inserting at least one conductor into the mold that penetrates through the channel of the mold, pressing a formable material into the channel of the mold to form a body of an implantable cuff electrode about the at least one conductor, curing the body of the implantable cuff electrode, and releasing the body of the implantable cuff electrode from the mold.

    Methods to reduce flashes on electrodes

    公开(公告)号:US12296162B2

    公开(公告)日:2025-05-13

    申请号:US17595169

    申请日:2020-05-07

    Inventor: Cindy Au

    Abstract: A method for use in making an electrode assembly (20) comprises the steps of applying an electrode (24) on a first layer of material (22); laser welding a lead (23) to the electrode; applying an adhesive backfill (26) over the electrode and the lead; and applying a second layer of material (28) over the adhesive backfill and a portion of the first layer to prevent a leakage path between the electrode and the second layer.

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