公开(公告)号：US20220102166A1

公开(公告)日：2022-03-31

申请号：US17546960

申请日：2021-12-09

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/48 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L23/495 ,  H01L21/54 ,  H01L21/78

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US11264286B2

公开(公告)日：2022-03-01

申请号：US16445778

申请日：2019-06-19

Applicant: STMicroelectronics, Inc.

Inventor： Nicolas Loubet ,  Pierre Morin ,  Yann Mignot

IPC: H01L29/78 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/165 ,  H01L21/02 ,  H01L21/762 ,  H01L29/49 ,  H01L29/06 ,  H01L29/417

Abstract: Integrated circuits are disclosed in which the strain properties of adjacent pFETs and nFETs are independently adjustable. The pFETs include compressive-strained SiGe on a silicon substrate, while the nFETs include tensile-strained silicon on a strain-relaxed SiGe substrate. Adjacent n-type and p-type FinFETs are separated by electrically insulating regions formed by a damascene process. During formation of the insulating regions, the SiGe substrate supporting the n-type devices is permitted to relax elastically, thereby limiting defect formation in the crystal lattice of the SiGe substrate.

公开(公告)号：US20220034659A1

公开(公告)日：2022-02-03

申请号：US17504994

申请日：2021-10-19

Applicant: STMicroelectronics, Inc.

Inventor： Deyou FANG ,  Chao-Ming TSAI ,  Milad ALWARDI ,  Yamu HU ,  David MCCLURE

IPC: G01C19/5726 ,  G01C25/00 ,  G01C19/5733

Abstract: A microelectromechanical system (MEMS) gyroscope includes a driving mass and a driving circuit that operates to drive the driving mass in a mechanical oscillation at a resonant drive frequency. An oscillator generates a system clock that is independent of and asynchronous to the resonant drive frequency. A clock generator circuit outputs a first clock and a second clock that are derived from the system clock. The drive loop of the driving circuit including an analog-to-digital converter (ADC) circuit that is clocked by the first clock and a digital signal processing (DSP) circuit that is clocked by the second clock.

公开(公告)号：US20220030667A1

公开(公告)日：2022-01-27

申请号：US17472247

申请日：2021-09-10

Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD ,  STMICROELECTRONICS, INC.

Inventor： Fuchao WANG ,  Olivier LENEEL ,  Ravi SHANKAR

IPC: H05B3/00 ,  H05B1/02 ,  H05B3/34 ,  H05B3/12 ,  H01L23/34 ,  H05B3/02 ,  H05B3/06

Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

公开(公告)号：US11227776B2

公开(公告)日：2022-01-18

申请号：US15392909

申请日：2016-12-28

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/44 ,  H01L21/48 ,  H01L23/495 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L21/54 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US20210391356A1

公开(公告)日：2021-12-16

申请号：US17159013

申请日：2021-01-26

Applicant: STMICROELECTRONICS, INC.

Inventor： John H. ZHANG

IPC: H01L27/12 ,  H01L29/66 ,  H01L27/11 ,  H01L27/092 ,  H01L29/161 ,  H01L29/78 ,  H01L23/528 ,  H01L27/112 ,  H01L21/84 ,  H01L21/266 ,  H01L21/8238 ,  H01L29/06

Abstract: Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.

公开(公告)号：US11199410B2

公开(公告)日：2021-12-14

申请号：US16399829

申请日：2019-04-30

Applicant: STMICROELECTRONICS, INC.

Inventor： Mahaveer Jain ,  Mahesh Chowdhary

IPC: G01C21/16 ,  G01C21/20 ,  G01C21/28 ,  G01S19/47

Abstract: A device including microelectromechanical systems (MEMS) sensors is used in dead reckoning in conditions where Global Positioning System (GPS) signals or Global Navigation Satellite System (GNSS) signals are lost. The device is capable of tracking the location of the device after the GPS/GNSS signals are lost by using MEMS sensors such as accelerometers and gyroscopes. By calculating a misalignment angle between a sensor frame of the device with either the movement direction of the vehicle or the walking direction of a pedestrian using the MEMS sensors, the device can accurately calculate the location of a user of the device even without the GPS/GNSS signals. Accordingly, a device capable of tracking the location of a pedestrian and a user riding in a vehicle without utilizing GPS/GNSS signals can be provided.

公开(公告)号：US11162790B2

公开(公告)日：2021-11-02

申请号：US16452813

申请日：2019-06-26

Applicant: STMicroelectronics, Inc.

Inventor： Deyou Fang ,  Chao-Ming Tsai ,  Yamu Hu

IPC: G01C19/5719 ,  G01C19/5607 ,  G01C19/5642 ,  G01C19/56 ,  G01C19/5649

Abstract: A drive signal is applied to a MEMS gyroscope having several intrinsic resonant modes. Frequency and amplitude of mechanical oscillation in response to the drive signal is sensed. At startup, the drive signal frequency is set to a kicking frequency offset from a resonant frequency corresponding to a desired one of the intrinsic resonant modes. In response to sufficient sensed amplitude of mechanical oscillation at the kicking frequency, a frequency tracking process is engaged to control the frequency for the drive signal to sustain mechanical oscillation at the frequency of the desired one of the plurality of intrinsic resonant modes as the oscillation amplitude increases. When the increasing amplitude of the mechanical oscillation exceeds a threshold, a gain control process is used to exercise gain control over the applied drive signal so as to cause the amplitude of mechanical oscillation to match a further threshold. At that point start-up terminates.

公开(公告)号：US11152326B2

公开(公告)日：2021-10-19

申请号：US16664568

申请日：2019-10-25

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Rammil Seguido ,  Raymond Albert Narvadez ,  Michael Tabiera

IPC: H01L23/00 ,  H01L23/495

Abstract: The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.

公开(公告)号：US11084283B2

公开(公告)日：2021-08-10

申请号：US16676070

申请日：2019-11-06

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC.

Inventor： Domenico Giusti ,  Marco Ferrera ,  Carlo Luigi Prelini ,  Simon Dodd

IPC: B41J2/14 ,  B41J2/18 ,  B41J2/16 ,  B41J2/055 ,  B05B1/02

Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.