公开(公告)号：US20120018205A1

公开(公告)日：2012-01-26

申请号：US13184607

申请日：2011-07-18

Applicant: Koji SATO ,  Yukio SANADA ,  Yasuhiro NISHISAKA

Inventor： Koji SATO ,  Yukio SANADA ,  Yasuhiro NISHISAKA

IPC: H05K1/18 ,  H01C7/02 ,  H01C7/13

CPC classification number: H05K1/183 ,  H01C1/14 ,  H01C7/008 ,  H01C7/02 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/228 ,  H01L41/083 ,  H05K1/186 ,  H05K3/321 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10439 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。