公开(公告)号：US08959757B2

公开(公告)日：2015-02-24

申请号：US13339817

申请日：2011-12-29

Applicant: Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

IPC: H05K3/30

CPC classification number: H05K1/111 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/82136 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/10439 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00

Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract translation: 在一个实施例中，屏蔽电子模块形成在基板上。 基板具有附接到部件区域的部件区域和一个或多个电子部件。 一组导电焊盘可以附接到部件区域，另外一组导电焊盘可以设置在电子部件上。 组件区域上的导电焊盘通过导电层电耦合到电子部件的导电焊盘。 第一绝缘层设置在导电层之上的部件区域和下方，可以使电子部件和衬底与导电层绝缘。 第二绝缘层设置在覆盖至少导电层的第一绝缘层上。 以这种方式，导电层与组件区域上形成的电磁屏蔽隔离。

公开(公告)号：US20180218959A1

公开(公告)日：2018-08-02

申请号：US15877538

申请日：2018-01-23

Applicant: JTEKT CORPORATION

Inventor： Naoki TANI

IPC: H01L23/36 ,  H01L29/423 ,  H05K1/02 ,  H01L23/488 ,  H01L23/538

CPC classification number: H01L23/36 ,  H01L23/488 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L29/4238 ,  H01L2224/13013 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14151 ,  H01L2224/14156 ,  H01L2224/14517 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/30051 ,  H01L2224/30151 ,  H01L2224/30156 ,  H01L2224/30517 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33051 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/81825 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/3511 ,  H02K9/22 ,  H02K11/33 ,  H05K1/0201 ,  H05K2201/10439 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality of joint portions at which a plurality of electrodes formed on the electrode surface are joined to the substrate. A no-electrode surface of the horizontal semiconductor chip and a heatsink are joined together through a second joint portion at which the no-electrode surface and the heatsink are joined together. In a plan view from a direction normal to a principal surface of the substrate, when a region inside the outline of the rough shape of an aggregate of the first joint portions is a first joint region and a region inside the outline of the second joint portion is a second joint region, the first joint region and the second joint region are the same in position, shape, and size.

公开(公告)号：US08819932B2

公开(公告)日：2014-09-02

申请号：US13184607

申请日：2011-07-18

Applicant: Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka

Inventor： Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka

IPC: H05K3/02

CPC classification number: H05K1/183 ,  H01C1/14 ,  H01C7/008 ,  H01C7/02 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/228 ,  H01L41/083 ,  H05K1/186 ,  H05K3/321 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10439 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。

公开(公告)号：US20100288535A1

公开(公告)日：2010-11-18

申请号：US12546502

申请日：2009-08-24

Applicant: Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

Inventor： Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, in which a cooling member connecting with an inner circuit layer of a printed circuit board is provided on one side of an electronic component, so that the heat radiation performance thereof can be improved and the thickness thereof can be decreased, and a method of manufacturing the same.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，其中在电子部件的一侧设置有与印刷电路板的内部电路层连接的冷却部件，从而能够提高其散热性能， 其厚度可以减小，及其制造方法。

公开(公告)号：US09936578B2

公开(公告)日：2018-04-03

申请号：US14517002

申请日：2014-10-17

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

IPC: H05K7/00 ,  H05K1/11 ,  H01L23/552 ,  H01L23/00 ,  H05K1/18 ,  H05K9/00 ,  H01L23/31 ,  H05K3/28

CPC classification number: H05K1/111 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/82136 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/10439 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00

Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

公开(公告)号：US09007161B2

公开(公告)日：2015-04-14

申请号：US14339506

申请日：2014-07-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka

IPC: H05K1/18 ,  H01C1/14 ,  H01C7/00 ,  H01C7/02 ,  H01G2/06 ,  H01G4/228 ,  H01F27/28 ,  H01G4/008 ,  H01G4/12 ,  H01L41/083 ,  H05K3/32

CPC classification number: H05K1/183 ,  H01C1/14 ,  H01C7/008 ,  H01C7/02 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/228 ,  H01L41/083 ,  H05K1/186 ,  H05K3/321 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10439 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。

公开(公告)号：US20140369014A1

公开(公告)日：2014-12-18

申请号：US14363208

申请日：2012-08-22

Applicant: Yusuke Takagi

Inventor： Yusuke Takagi

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/05

CPC classification number: H05K1/183 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/182 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K2201/10439 ,  H05K2203/0169 ,  H05K2203/0323

Abstract: A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.

Abstract translation: 布线板包括作为金属芯基板的基底基板，并且包括其中将要安装作为电气部件或电子部件的内部部件的开口，以及端子放置部，其内部部件的端子 将要安装的端子放置部分围绕基底基板的开口形成，并且从基底基板的表面向内凹入，使得内部部件的一部分被放置在开口内。

公开(公告)号：US20140332260A1

公开(公告)日：2014-11-13

申请号：US14339506

申请日：2014-07-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koji SATO ,  Yukio SANADA ,  Yasuhiro NISHISAKA

IPC: H05K1/18 ,  H01F27/28 ,  H01G4/008 ,  H01C7/00 ,  H01L41/083 ,  H01G4/12

CPC classification number: H05K1/183 ,  H01C1/14 ,  H01C7/008 ,  H01C7/02 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/228 ,  H01L41/083 ,  H05K1/186 ,  H05K3/321 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10439 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。

公开(公告)号：US20240334609A1

公开(公告)日：2024-10-03

申请号：US18609434

申请日：2024-03-19

Applicant: TDK Corporation

Inventor： Toshiyuki ABE ,  Kazutoshi TSUYUTANI ,  Naoyuki ISHIKAWA

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/182 ,  H05K1/0237 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/10439

Abstract: Disclosed herein is an apparatus that includes a multilayer substrate including a plurality of conductive layers and a plurality of insulating layers alternately stacked, and an electronic component having a first signal pad. The plurality of conductive layers include a first internal conductive layer having a first signal pattern, and a second internal conductive layer having a second signal pattern. The plurality of insulating layers include a first insulating layer positioned between the first and second internal conductive layers. The electronic component is embedded in the first insulating layer such that the first signal pad is connected to the first signal pattern. The first and second signal patterns are connected to each other by a first via conductor penetrating through the first insulating layer. The distance between the electronic component and the first via conductor is greater than a diameter of the first via conductor.

公开(公告)号：US20180317318A1

公开(公告)日：2018-11-01

申请号：US15950479

申请日：2018-04-11

Applicant: Seiko Epson Corporation

Inventor： Yohei YAMADA ,  Tomoyuki KAMAKURA

IPC: H05K1/02 ,  H05K1/18 ,  G01B7/16

CPC classification number: H05K1/0283 ,  G01B7/20 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/0191 ,  H05K2201/09281 ,  H05K2201/09736 ,  H05K2201/10151 ,  H05K2201/10439 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.