公开(公告)号：US20020123298A1

公开(公告)日：2002-09-05

申请号：US10136600

申请日：2002-04-30

Applicant: Lam Research Corporation

Inventor： Wilbur Krusell ,  Glenn Travis ,  Erik Engdahl ,  James Bagley

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B021/00

CPC classification number: B24B37/245 ,  B24B21/04 ,  B24B37/26

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract translation: 公开了一种用于化学机械平面化半导体晶片的设备，其具有连续的抛光带，第一侧具有固定的研磨表面和与第一侧相对的第二侧。 在一个实施例中，第一驱动辊保持抛光条的第一端，第二驱动辊保持抛光条的第二端，并且一对支撑辊在抛光的任一端接触抛光条的第二侧 带支撑。 驱动马达可操作地连接到第一和第二驱动辊，用于以线性双向的方式移动抛光条。

公开(公告)号：US20020090889A1

公开(公告)日：2002-07-11

申请号：US09758077

申请日：2001-01-10

Inventor： Annette M. Crevasse ,  William G. Easter ,  John A. Maze ,  Frank Miceli

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/013 ,  B24B49/02

Abstract: The present invention provides a polishing apparatus for use in polishing a substrate, including: (1) A polishing platen, and (2) a rotational strain sensor coupled to the polishing platen configured to detect a change in a rotational strain of the polishing platen during a polishing process. In addition, the present invention provides an accompanying method of detecting an endpoint during the polishing process by detecting a change between a first rotational strain and a second rotational strain with the rotational strain sensor.

Abstract translation: 本发明提供了一种用于抛光基板的抛光装置，包括：（1）研磨台板，和（2）连接到抛光台板的旋转应变传感器，其被配置为检测抛光台板的旋转应变的变化 抛光过程。 此外，本发明提供了一种在抛光过程中通过利用旋转应变传感器检测第一旋转应变和第二旋转应变之间的变化来检测端点的伴随方法。

公开(公告)号：US20020068507A1

公开(公告)日：2002-06-06

申请号：US09732327

申请日：2000-12-06

Inventor： Thomas A. Lorincz

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: C25F3/16 ,  C25F7/00 ,  Y10S451/908

Abstract: A pipe electropolishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a nonuniform portion (70) of the pipe (28), then increased polishing action is provided as by increasing the voltage using a variable power supply (30a) and/or by slowing down the progress of the cathode (14) using a variable speed cable puller (18).

Abstract translation: 用于管道（28）的正确抛光的管道电解抛光系统（10,10a）具有用于检测管（28）内的阴极（14）的即时位置的设置，例如电缆标记（52）和电缆标记传感器 50），红外摄像机（60），单独或组合使用的热敏蜡笔（64），热敏电阻（66）和电容传感器（68）。 根据本发明的电解抛光方法（80），当确定阴极处于管道（28）的不均匀部分（70）中时，通过使用可变电源提供电压来提供增加的抛光动作（ 30a）和/或通过使用变速电缆拉线器（18）减慢阴极（14）的进度。

公开(公告)号：US20020039873A1

公开(公告)日：2002-04-04

申请号：US09963422

申请日：2001-09-27

Applicant: NIPPEI TOYAMA CORPORATION

Inventor： Sadatsune Ammi

IPC: B24B051/00

CPC classification number: B24B55/00

Abstract: A machining controlling apparatus numerically controls a wheel spindle stock and a spindle apparatus, and performs the machining operation of a workpiece by a grinding wheel. When a power failure has been detected by a power-failure detecting unit, a grinding machine is stopped after the grinding wheel is retreated from the workpiece within a very short period until the controlling operation by the machining controlling apparatus becomes impossible.

Abstract translation: 加工控制装置对车轮主轴原料和主轴装置进行数值控制，并通过砂轮进行工件的加工操作。 当电源故障检测单元检测到电源故障时，在砂轮在非常短的时间内从工件退出之后停止研磨机，直到通过加工控制装置的控制操作变得不可能。

公开(公告)号：US20020034921A1

公开(公告)日：2002-03-21

申请号：US09406843

申请日：1999-09-29

Inventor： TOSHIAKI MIZUNO ,  RYOJI SHIBATA

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B41/005 ,  B24B9/14 ,  B24B13/005 ,  B24B49/12

Abstract: An eyeglass lens processing system includes: input means for inputting frame shape data and layout data; grinding means having holding means for sucking and holding the subject lens at one end of a rotating shaft for nipping and rotating the subject lens, for grinding the subject lens by a grinding wheel; lens conveying means for holding the subject lens placed at a predetermined position and conveying the subject lens to an intended position; amount-of-eccentricity measuring means for detecting a position of an optical center of the subject lens held by the lens conveying means and for obtaining an amount of eccentricity of the optical center of the subject lens with respect to a predetermined reference position; and calculating means for obtaining processing data for the sucked and held subject lens by causing the reference position and the center of the rotating shaft to be aligned with each other by the lens conveying means, on the basis of data on the frame shape, the layout data, and the amount of eccentricity.

Abstract translation: 眼镜透镜处理系统包括：输入装置，用于输入帧形数据和布局数据; 研磨装置具有用于在用于夹持和旋转被摄体透镜的旋转轴的一端处吸取和保持被摄体透镜的保持装置，用于通过砂轮研磨被摄体透镜; 透镜传送装置，用于保持放置在预定位置处的被摄体透镜并将目标透镜传送到预期位置; 偏心距测量装置，用于检测由透镜输送装置保持的被摄体透镜的光学中心的位置，并获得相对于预定基准位置的被摄体透镜的光学中心的偏心量; 以及计算装置，用于通过使得基准位置和旋转轴的中心通过透镜输送装置彼此对准，基于框架形状的数据来获得被吸取和保持的被摄体透镜的处理数据，布局 数据和偏心量。

公开(公告)号：US20020031981A1

公开(公告)日：2002-03-14

申请号：US09989498

申请日：2001-11-19

Inventor： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen ,  Sasson Somekh

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/30 ,  B24B37/0053

Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

Abstract translation: 用于化学机械抛光系统的载体头包括基底感测机构。 承载头包括基部和连接到基部以限定室的柔性构件。 柔性构件的下表面提供衬底接收表面。 衬底检测机构包括用于测量腔室中的压力并产生代表其的输出信号的传感器，以及被配置为响应于输出信号指示衬底是否附着到衬底接收表面的处理器。

公开(公告)号：US20020009950A1

公开(公告)日：2002-01-24

申请号：US09915557

申请日：2001-07-27

Applicant: Hitachi Ltd.

Inventor： Shigeru Mori ,  Shigetoshi Kondoh ,  Tadashi Nishino ,  Yasutsugu Yoshimura ,  Yasuharu Imagawa ,  Hiroyuki Shiraiwa

IPC: B24B049/00 ,  B24B051/00 ,  B24B007/00

CPC classification number: B24B5/363 ,  B21B13/023 ,  B21B28/04 ,  B24B5/167 ,  B24B49/16 ,  B24D9/08 ,  G05B19/4163

Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.

公开(公告)号：US20010055932A1

公开(公告)日：2001-12-27

申请号：US09924367

申请日：2001-08-07

Inventor： Scott E. Moore

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B49/00 ,  H01L22/26

Abstract: A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.

公开(公告)号：US20010027080A1

公开(公告)日：2001-10-04

申请号：US09851661

申请日：2001-05-08

Applicant: Applied Materials, Inc., Delaware corporation

Inventor： Andreas Norbert Wiswesser ,  Walter Schoenleber ,  Boguslaw Swedek ,  Manoocher Birang

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B49/12 ,  B24B37/013 ,  B24B49/04

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and a polishing head to hold a substrate against the polishing pad during processing. The substrate includes a thin film structure disposed on a wafer. A first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. A second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.

Abstract translation: 化学机械抛光装置包括用于支撑抛光垫的压板和用于在加工期间将衬底保持在抛光垫上的抛光头。 衬底包括设置在晶片上的薄膜结构。 第一光学系统包括产生撞击在基板的表面上的第一光束的第一光源和用于测量从基板的表面反射的光以产生测量的第一干涉信号的第一传感器。 第二光学系统包括第二光源，用于产生入射到衬底的表面上的第二光束;以及第二传感器，用于测量从衬底的表面反射的光，以产生测量的第二干涉信号。 第二光束具有与第一光束不同的波长。

公开(公告)号：US20010012750A1

公开(公告)日：2001-08-09

申请号：US09810827

申请日：2001-03-16

Inventor： Scott E. Moore

IPC: B24B001/00 ,  B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B21/004 ,  B24B49/16

Abstract: Endpointing devices, planarizing machines with endpointing devices, and methods for endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies. One endpointing apparatus in accordance with the invention includes a primary support member for supporting either a polishing pad or a substrate assembly, and a secondary support member coupled to the primary support member. The primary support member is movable with respect to the secondary support member in a lateral motion at least generally parallel to the planarizing plane in correspondence to the drag forces between the substrate assembly and the polishing pad. The endpointing apparatus also includes a force detector attached to at least one of the primary and secondary support members at a force detector site that can have a contact surface transverse to the planarizing plane. The force detector measures lateral forces between the primary support member and the secondary support member in response to drag forces between the substrate assembly and the polishing pad. In operation, the endpoint of CMP processing is detected when the measure lateral force is equal to a predetermined endpoint force for a particular CMP application.

Abstract translation: 端点装置，具有终点装置的平面化机器以及用于终止微电子基板组件的机械和/或化学机械平面化的方法。 根据本发明的一个终点装置包括用于支撑抛光垫或基板组件的主支撑构件和联接到主支撑构件的次支撑构件。 相对于衬底组件和抛光垫之间的牵引力，主支撑构件能够相对于辅助支撑构件以至少大致平行于平坦化平面的横向运动可移动。 终点装置还包括力检测器，该力检测器在能够具有横向于平坦化平面的接触表面的力检测器位置处附接到主支撑构件和辅助支撑构件中的至少一个。 力检测器响应于衬底组件和抛光垫之间的阻力来测量主支撑构件和辅助支撑构件之间的横向力。 在操作中，当测量横向力等于特定CMP应用的预定端点力时，检测CMP处理的端点。