公开(公告)号：US20250123983A1

公开(公告)日：2025-04-17

申请号：US18791405

申请日：2024-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongmin GIM ,  Heekwon PARK ,  Jaemin JUNG ,  Changho CHOI ,  Yang Seok KI

IPC: G06F13/40 ,  G06F13/42

Abstract: An apparatus including a switch may include a first interface configured to communicate with at least one memory device, and a second interface configured to communicate with a first physical connector and a second physical connector, where the switch is configured to communicate with a device using the first physical connector using a memory access protocol. The second interface may be configured to communicate with a second device using the second physical connector using the memory access protocol. The apparatus may further include a second switch including a third interface configured to communicate with the at least one memory device, and a fourth interface configured to communicate with a third physical connector and a fourth physical connector, where the second switch may be configured to communicate with the device using the third physical connector using the memory access protocol.

公开(公告)号：US20250123971A1

公开(公告)日：2025-04-17

申请号：US18755026

申请日：2024-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungsik CHOI ,  Ruth KIM ,  Seok-Young YOON

IPC: G06F12/1036 ,  G06F12/0873

Abstract: A processor-implemented method includes receiving a mapping instruction to map target data onto a process address space, in response to reception of the mapping instruction, marking an unused node in a tree that manages the process address space as a use node to reuse, and mapping the target data onto a virtual area in the process address space, wherein the tree manages the virtual area onto which the target data is mapped as the use node.

公开(公告)号：US20250123943A1

公开(公告)日：2025-04-17

申请号：US18909171

申请日：2024-10-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changyong Oh ,  Byeonghui Kim ,  Seongho Roh ,  Hyeongyu Min ,  Hyunkyo Oh ,  Dongchan Lee ,  Hankyoo Lee ,  Kibeen Jung

IPC: G06F11/34

Abstract: Provided are a method and apparatus for optimizing prefetch performance of a storage device. The method of optimizing prefetch performance of a storage device includes receiving prefetch data from the storage device configured to process a workload based on a parameter, generating prefetch performance data for a plurality of combinations of block size and queue depth, based on the prefetch data, generating index data for evaluating the prefetch performance data, based on the prefetch performance data, updating the parameter to generate an updated parameter based on the index data, and transferring, to the storage device, the updated parameter, wherein the generating of the index data includes generating the index data by taking into account an inversion interval in which prefetch performance decreases with an increase in the block size or the queue depth.

公开(公告)号：US20250123755A1

公开(公告)日：2025-04-17

申请号：US18670908

申请日：2024-05-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehyun KIM ,  Suhyun KIM ,  Ikkyun PARK ,  Hyunju YI

IPC: G06F3/06

Abstract: An embodiment of the method includes transferring a first read command corresponding to a first cell region of the memory device through a first channel, receiving first data, read from the first cell region, from the memory device through a second channel physically separated from the first channel, transferring a status information request command through the first channel, the status information request command request the transfer of status information about a second cell region of the memory device, receiving the status information about the second cell region from the memory device through the first channel, and transferring a second read command corresponding to the second cell region of the memory device through the first channel, at least a portion of a period in which the status information is received through the first channel overlaps a period where the first data is received through the second channel.

公开(公告)号：US20250123746A1

公开(公告)日：2025-04-17

申请号：US18814996

申请日：2024-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEONGWOOK PARK

IPC: G06F3/06

Abstract: A memory system includes an external memory device and a first memory processing unit of a main memory device. The external memory device and a host may be disposed on different boards, and the external memory device may transfer compressed data to the host in response to a swap-in request from the host. The first memory processing unit and the host may be disposed on the same board. The first memory processing unit may load the compressed data, decompress the compressed data to obtain decompressed data, and store the decompressed data in a main memory of the main memory device.

公开(公告)号：US20250123645A1

公开(公告)日：2025-04-17

申请号：US18733152

申请日：2024-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunghun CHO ,  Juri LEE

IPC: G05F1/575

Abstract: A voltage regulator configured to generate an output voltage includes a comparison unit configured to generate a second voltage based on a reference voltage and a first voltage generated by a feedback of the output voltage, a power noise replica buffer unit configured to generate a third voltage including a power noise copied based on the second voltage, and a pass transistor configured to generate the output voltage in response to the third voltage.

公开(公告)号：US20250123573A1

公开(公告)日：2025-04-17

申请号：US18757567

申请日：2024-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yong BAE ,  Hyeon Jin KIM ,  Jeong-Gil KIM ,  Kyoung Hwan OH ,  Dong Jin LEE

IPC: G03F7/00

Abstract: A lithography apparatus comprises a wafer stage, a cable configured to be bent as the wafer stage moves, a first support configured to prevent the cable from sagging, and to support the cable to maintain a bent state of the cable when the cable moves, a first rail installed on a first side of the cable, and including curved track extending in a direction from a lower portion of the cable toward an upper portion of the cable, wherein the first rail includes a concave first surface, a second rail installed on a second side of the cable opposite the first side of the cable, and including curved track extending in the direction from the lower portion of the cable toward the upper portion of the cable, wherein the second rail includes a concave second surface.

公开(公告)号：US20250123243A1

公开(公告)日：2025-04-17

申请号：US18670118

申请日：2024-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeon Bo SHIM ,  Souk KIM ,  Younghoon SOHN ,  Jaeho KIM ,  Inseok PARK ,  Jaewon YANG ,  Minho RIM

IPC: G01N29/04 ,  G01N29/24

Abstract: A semiconductor substrate inspection device is provided and includes: a function generator that generates a first signal and a second signal; an ultrasonic generator that receives the first signal generated from the function generator, generates an ultrasonic wave based on the first signal, and generates a surface wave signal on an upper surface of a substrate using the ultrasonic wave; and an electron beam measurer that inspects the surface wave signal, wherein the electron beam measurer includes: a laser light source that receives the second signal generated from the function generator and generates a first pulse laser beam based on the second signal; an electron beam generator that receives the first pulse laser beam and generates an electron beam that is emitted onto the upper surface of the substrate; and a backscattered electron detector that detects backscattered electrons generated based on the electron beam being incident on the substrate.

公开(公告)号：US20250123046A1

公开(公告)日：2025-04-17

申请号：US18805923

申请日：2024-08-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhong YU ,  Chanbin PARK ,  Seyeun CHANG ,  Deulre MIN ,  Jungeun SEO ,  Jisick HWANG

IPC: F25D11/02 ,  F25D17/04 ,  F25D23/12

Abstract: A refrigerator may include an inner case that forms a storage compartment, a duct facing along a rear wall of the inner case and configured to guide cold air into the storage compartment, a temperature control compartment within the storage compartment, the temperature control compartment to have a temperature independent of a temperature of the storage compartment, and a heating assembly configured to control the temperature of the temperature control compartment, the heating assembly including a heater, a connector configured to supply power to the heater and mountable on the duct so as to face the rear wall of the inner case, and a heater case accommodating the heater and configured to cover the connector mounted on the duct so that with the connector mounted on the duct, moisture which flows or condenses on the duct is prevented and/or reduced from entering the connector.

公开(公告)号：US20250123032A1

公开(公告)日：2025-04-17

申请号：US18923068

申请日：2024-10-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jimin HONG ,  Jungwoo YOO ,  Insub LEE

IPC: F25B21/02

Abstract: Disclosed is a thermoelectric element cooling device including: a thermoelectric element having an endothermic surface and an exothermic surface; a first heat dissipation plate connected to the endothermic surface and configured to dissipate heat to the endothermic surface; a first heat exchanger configured to transfer heat to the first heat dissipation plate; a second heat dissipation plate configured to dissipate heat received from the exothermic surface to a second heat exchanger; the second heat exchanger configured to release heat received from the second heat dissipation plate to the outside; and a thermoconductive member disposed at at least one position between the endothermic surface of the thermoelectric element and the first heat dissipation plate or between the exothermic surface and the second heat dissipation plate, wherein the thermoconductive member has: one side in contact with one of the surfaces of the thermoelectric element; and the other side in contact with the first heat dissipation plate or the second heat dissipation plate, the thermoconductive member includes a plurality of anisotropic, thermoconductive fillers, and at least one of the plurality of anisotropic, thermoconductive fillers is located adjacent to the one side and the other side.