-
公开(公告)号：US20210299799A1
公开(公告)日：2021-09-30
申请号：US17213763
申请日：2021-03-26
发明人： Hiroaki Kawamata , Hayato Kaise , Syuta Akatsuka , Kengo Ohta , Sakie Okada
IPC分类号： B23K35/362 , B23K35/02
摘要： Provided is flux containing rosin-based resin, a solvent, a thixotropic agent and an activator. The thixotropic agent includes any or both of hardened caster oil and bisamide-based thixotropic agent. The contents of the hardened caster oil and the bisamide-based thixotropic agent are respectively within the range of 4 wt. % or more and 10 wt. % or less and the range of 1 wt. % or more and 5 wt. % or less based on the total weight of the flux. The contents of the thixotropic agent are within the range of 5 wt. % or more and 15 wt. % or less based on the total weight of the flux. The activator includes hydrohalide, a halogenated aliphatic compound and an imidazole compound. The contents of the halogen in the flux are within the range of 9000 ppm or more and 50000 ppm or less.
-
公开(公告)号：US11117224B2
公开(公告)日：2021-09-14
申请号：US17049617
申请日：2019-04-15
IPC分类号： B23K35/362 , B23K35/02 , B23K35/26 , B23K35/36
摘要： Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa·s or more and 50 Pa·s or less at 25° C. and has a viscosity of more than 0 Pa·s and 1 Pa·s or less at 100° C., and, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under a N2 atmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating.
-
公开(公告)号：US20210245282A1
公开(公告)日：2021-08-12
申请号：US16957154
申请日：2018-12-10
发明人： Takashi Sugihara , Kaname Nagata
摘要： A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.
-
公开(公告)号：US11059117B2
公开(公告)日：2021-07-13
申请号：US16696907
申请日：2019-11-26
发明人： Noboru Hashimoto , Takahiro Kasama
摘要： To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput.
Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.-
公开(公告)号：US11024598B2
公开(公告)日：2021-06-01
申请号：US16327124
申请日：2017-08-17
发明人： Tetsu Takemasa , Minoru Ueshima
摘要： A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.
-
公开(公告)号：US11007591B2
公开(公告)日：2021-05-18
申请号：US16618903
申请日：2018-05-08
发明人： Koichiro Hosokawa , Tsutomu Hiyama
摘要： A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.
-
公开(公告)号：US20210143122A1
公开(公告)日：2021-05-13
申请号：US17047760
申请日：2019-04-08
摘要： The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent. In a case where SP1 represents a Hansen's method-based average solubility parameter of a resin group consisting of the epoxy resin and the phenolic resin curing agent in the resin composition, and Mn1 represents a number average molecular weight of the resin group, SP1 and Mn1 satisfy Mn1≤210×SP1−4,095.
-
公开(公告)号：US10987764B2
公开(公告)日：2021-04-27
申请号：US16975491
申请日：2018-10-11
IPC分类号： B23K35/00 , B23K35/362 , B23K35/24 , B23K35/02 , B23K103/00
摘要： It is an object of the present invention to provide a flux containing flux components homogeneously dispersed without precipitation of aggregates in addition to having an appropriate balance between fluidity and shape retention property, and a solder paste. A flux comprising 0.5 to 3.5 mass % of a sorbitol-type thixotropic agent selected from the group consisting of dibenzylidene sorbitol, bis(4-methylbenzylidene)sorbitol and a combination thereof, and 2 to 350 mass ppm of a sorbitol-type additive selected from the group consisting of sorbitol, monobenzylidene sorbitol, mono(4-methylbenzylidene)sorbitol and a combination thereof, and a glycol ether-type solvent.
-
公开(公告)号：US10968932B2
公开(公告)日：2021-04-06
申请号：US16759625
申请日：2018-10-30
发明人： Minoru Ueshima , Yoshie Tachibana
摘要： A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.
-
公开(公告)号：US20210071713A1
公开(公告)日：2021-03-11
申请号：US16772067
申请日：2018-12-13
发明人： Kimihiko Kurosaki , Kenzo Tadokoro , Minoru Toyoda
摘要： A sliding member includes a metallic substrate, a porous layer formed on a surface of the metallic substrate and a sliding layer that covers the porous layer. The porous layer is made of a metal itself or an alloy composition. The sliding layer is made of a lead-free resin composition. The resin composition consists of a pitch-based carbon fiber and a fluororesin, and assuming weight of the resin composition as 100, more than 10 weight % and 35 weight % or less of the pitch-based carbon fiber is contained.
-
-
-
-
-
-
-
-
-
搜索结果
495 条记录 (耗时 0.03 秒)
