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公开(公告)号：US11648631B2
公开(公告)日：2023-05-16
申请号：US17256419
申请日：2019-06-27
IPC分类号： B23K35/00 , B23K1/00 , B23K3/00 , B23K35/368 , B23K3/02 , B23K35/365
CPC分类号： B23K35/368 , B23K3/02 , B23K35/365
摘要： Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.
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公开(公告)号：US20210387292A1
公开(公告)日：2021-12-16
申请号：US17286431
申请日：2019-10-21
发明人： Ayaka Shirakawa , Hiroshi Sugii , Atsumi Takahashi , Daisuke Maruko , Hiroyoshi Kawasaki , Masato Shiratori
IPC分类号： B23K35/362 , B23K35/36 , B23K35/02
摘要： A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.
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公开(公告)号：US20210268610A1
公开(公告)日：2021-09-02
申请号：US17256419
申请日：2019-06-27
IPC分类号： B23K35/368 , B23K3/02 , B23K35/365
摘要： Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.
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公开(公告)号：US20210245306A1
公开(公告)日：2021-08-12
申请号：US17261072
申请日：2019-08-01
IPC分类号： B23K35/36 , B23K35/362 , B23K35/02
摘要： Provided are a flux composition that is applicable without any film formation step, and solder paste, a solder joint and a solder joining method using the flux composition. The flux composition contains 20 wt % or more and 50 wt % or less of an epoxy resin, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of organic acid.
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公开(公告)号：US20210197323A1
公开(公告)日：2021-07-01
申请号：US17128239
申请日：2020-12-21
IPC分类号： B23K35/362 , B23K35/02
摘要： Provided is flux for resin flux cored solder using in a soldering method in which the resin flux cored solder is supplied into a through hole formed along a central axis of a soldering iron. The flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less, the activator including an organic acid in an amount of 0 wt % or more and 15 wt % or less, an organohalogen compound in an amount of 0.5 wt % and 15 wt % or less, an amine in an amount of 0 wt % or more and 5 wt % or less, and an amine hydrohalide salt in an amount of 0 wt % or more and 2.5 wt % or less.
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公开(公告)号：US20200346308A1
公开(公告)日：2020-11-05
申请号：US16957753
申请日：2018-12-28
IPC分类号： B23K35/362 , B23K35/02
摘要： A flux in which solder wettability can be maintained and with which it is possible to suppress the amount of residue after soldering and realize low residue. This flux includes 65-99 wt % of a solvent, and also includes 1-13 wt % of at least one acid selected form a dimer acid that is a reaction product of oleic acid and linoleic acid; a trimer acid that is a reaction product of oleic acid and linoleic acid; a hydrogenated dimer acid obtained by hydrogenating dimer acid that is a reaction product of oleic acid and linoleic acid; and a hydrogenated trimer acid obtained by hydrogenating a trimer acid that is a reaction product of oleic acid and linoleic acid.
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公开(公告)号：US10370771B2
公开(公告)日：2019-08-06
申请号：US15461866
申请日：2017-03-17
IPC分类号： B23K35/02 , C22C9/00 , C25D5/12 , C25D3/60 , H01L23/00 , B23K35/26 , B23K35/30 , C22C13/00 , H01B1/02 , B22F9/08 , B22F1/02 , C25D5/20 , F16B5/08 , C25D3/30 , B23K101/40 , H05K3/34
摘要： A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.
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公开(公告)号：US10150185B2
公开(公告)日：2018-12-11
申请号：US15116275
申请日：2014-02-04
IPC分类号： B23K35/02 , B22F9/08 , B22F9/14 , B22F1/00 , H01L23/00 , H01L23/556 , H05K3/34 , B23K35/30 , C22C9/00 , C22C19/03 , C22F1/08 , C22F1/10 , B22F1/02 , B23K1/00 , B23K1/008 , B23K3/06 , B23K101/42 , H01L23/498
摘要： Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.
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公开(公告)号：US10137535B2
公开(公告)日：2018-11-27
申请号：US15116271
申请日：2014-02-04
IPC分类号： B23K35/02 , B22F1/02 , B23K35/22 , C25D7/00 , C22C9/00 , C22F1/00 , C22F1/08 , B23K35/30 , B22F1/00 , C22C9/02 , C22C1/04
摘要： Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Cu ball 20. The Cu ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV.
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公开(公告)号：US20180281118A1
公开(公告)日：2018-10-04
申请号：US15740484
申请日：2016-06-23
IPC分类号： B23K35/02 , B23K35/26 , B23K35/30 , B23K35/365 , B23K35/36 , H01L23/00 , H01L23/498
摘要： The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150° C. with a temperature of 25° C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.
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