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    Coater die grinding and finishing method
    31.
    发明授权
    Coater die grinding and finishing method 失效
    涂布机模具研磨和抛光方法

    公开(公告)号：US5655948A

    公开(公告)日：1997-08-12

    申请号：US464957

    申请日：1995-06-05

    Applicant: Robert A. Yapel ,  Thomas M. Milbourn ,  Ronald A. Hanke ,  Alberto Goenaga ,  Mark E. Ebensperger

    Inventor： Robert A. Yapel ,  Thomas M. Milbourn ,  Ronald A. Hanke ,  Alberto Goenaga ,  Mark E. Ebensperger

    IPC: B24B1/00 ,  B24B19/20

    CPC classification number: B24B19/20 ,  B24B1/00

    Abstract: Methods of finishing and microfinishing the edges of a die component are disclosed. Each edge is polished to finish the edge of the die component to a smoother finish than the rest of the die component. This eliminates the incidence of undesirable streaking defects in the coating. The grinding and polishing includes placing a grind fixture adjacent the die component contiguous with the edge to present a grind fixture surface coplanar with the first surface of the edge, then grinding and polishing together the first surface of the edge of the die component and the adjacent grind fixture surface are polished. This is repeated for the second surface of the edge.

    Abstract translation: 公开了精加工和微精加工模具部件边缘的方法。 每个边缘被抛光以完成模具部件的边缘以比其余的模具部件更光滑的整理。 这消除了涂层中不期望的条纹缺陷的发生。 磨削和抛光包括将研磨装置放置在邻近模具部件的边缘附近，以提供与边缘的第一表面共面的研磨固定表面，然后将模具部件的边缘的第一表面和相邻的 研磨夹具表面抛光。 对于边缘的第二表面重复这一点。

    Solvent formulations for solution deposition of organic materials onto low surface energy layers
    34.
    发明授权
    Solvent formulations for solution deposition of organic materials onto low surface energy layers 失效
    用于将有机材料溶解沉积到低表面能层上的溶剂配方

    公开(公告)号：US07785489B2

    公开(公告)日：2010-08-31

    申请号：US11644439

    申请日：2006-12-22

    Applicant: Alberto Goenaga ,  Paul Anthony Sant

    Inventor： Alberto Goenaga ,  Paul Anthony Sant

    IPC: C09K11/06 ,  C09K11/02 ,  C09D5/24

    CPC classification number: C09K11/06 ,  H01G11/48 ,  H01L51/0007 ,  H01L51/0059 ,  Y02E60/13 ,  Y10S428/917

    Abstract: Compositions for improved liquid deposition of active material in manufacturing processes of electronic devices are provided. The compositions comprise at least one active material for liquid deposition, at least one first solvent, at least one second solvent, and at least one third solvent, with a fourth solvent optional. The solvents are selected on the basis of their co-miscibility, ability to form a composition with each other and with active material without significant precipitation of active material from the composition, and at least one of the solvents having a surface tension equal to or less than that of the substrate upon which active material is to be deposited.

    Abstract translation: 提供了用于在电子设备的制造过程中改善活性材料的液体沉积的组合物。 所述组合物包含用于液体沉积的至少一种活性材料，至少一种第一溶剂，至少一种第二溶剂和至少一种第三溶剂，第四溶剂是任选的。 基于它们的共混性，与组合物形成组合物和活性材料的能力而不是从组合物中显着沉淀活性材料而选择溶剂，并且至少一种具有等于或小于 比要沉积活性材料的基材的材料要高。

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