公开(公告)号：US20070204953A1

公开(公告)日：2007-09-06

申请号：US11357529

申请日：2006-02-21

Applicant: Ching-Bin Lin

Inventor： Ching-Bin Lin

IPC: B29D31/00 ,  B05D5/06 ,  B05D3/12 ,  C08F2/46

CPC classification number: B05D1/40 ,  B05D1/28 ,  B05D3/0254 ,  B05D3/067 ,  B05D7/04 ,  B29C35/02 ,  B29C35/0888 ,  B29C39/148 ,  B29C59/046 ,  B29C2035/0827 ,  B29C2059/023 ,  B29D11/00278 ,  G02B5/045

Abstract: A method for forming structured or micro-structured film comprising the steps of: A. Coating a photocuring or heat-curing adhesive resin layer on a substrate layer; B. Molding or forming or imprinting a structured or micro-structured pattern including prismatic array on the adhesive resin layer by a tape die having the structured pattern preformed on the tape die; and C. Curing the photocuring or heat-curing adhesive resin layer on the substrate layer to obtain a layered film having a structured pattern surface. The structured pattern is formed on the tape, rather than on the rotary die or die roller, to prevent from sticking of the adhesive resin on the roller to prolong the service life of the production equipment and also to ensure a reliable film product quality.

Abstract translation: 一种形成结构或微结构薄膜的方法，包括以下步骤：A.在基材层上涂布光固化或热固化粘合树脂层; B.通过具有预先形成在带状模具上的结构图案的带状模具成型或形成或压印包含棱柱形阵列的结构或微结构图案在粘合剂树脂层上; C.将基材层上的光固化或热固化粘合树脂层固化，得到具有结构化图案表面的层状膜。 结构图案形成在带上，而不是在旋转模具或模具辊上，以防止粘合剂树脂粘附在辊上，延长生产设备的使用寿命，并确保可靠的膜产品质量。

公开(公告)号：US20070166874A1

公开(公告)日：2007-07-19

申请号：US11626961

申请日：2007-01-25

Applicant: Ching-Bin Lin ,  Pao-Yu Cheng ,  Hung-Yi Lin

Inventor： Ching-Bin Lin ,  Pao-Yu Cheng ,  Hung-Yi Lin

IPC: H01L21/06

CPC classification number: G02B6/124 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00

Abstract: A method for fabricating a nanoimprint mold core is disclosed. The method includes providing a substrate; forming on the substrate an amorphous thin film, which is transformed into a crystalline thin film upon receipt of energy, the crystalline thin film having physical and chemical characteristics different from those of the amorphous thin film; applying the energy onto a predetermined region of the amorphous thin film, to transform the amorphous thin film within the predetermined region into the crystalline thin film; etching the illuminated amorphous film, which has crystalline mark on amorphous film, and at least partially removing the area of remained amorphous thin films; performing an imprinting process on the substrate, which has the etched amorphous thin films formed; and performing a molding releasing process on the substrate, so as to obtain the nanoimprint mold core.

Abstract translation: 公开了一种制造纳米压印模芯的方法。 该方法包括提供基板; 在基板上形成无定形薄膜，其在接收到能量时转变成晶体薄膜，该晶体薄膜具有与非晶薄膜不同的物理和化学特性; 将能量施加到非晶薄膜的预定区域上，将预定区域内的非晶薄膜转变成晶体薄膜; 蚀刻在非晶膜上具有结晶标记的照射非晶膜，并且至少部分去除剩余的非晶态薄膜的面积; 在形成有蚀刻的非晶质薄膜的基板上进行压印处理; 在基板上进行成型脱模工序，得到纳米压印模芯。

公开(公告)号：US06251248B1

公开(公告)日：2001-06-26

申请号：US09422092

申请日：1999-10-15

Applicant: Ching-Bin Lin

Inventor： Ching-Bin Lin

IPC: C25D100

CPC classification number: C25D1/00 ,  C25D1/20

Abstract: A microfabrication process for making a microstructure product comprises: micromachining a polymer substrate for forming a three-dimensional microstructure pattern with deep cavities; shrinking and minimizing the diameter or width of each cavity of the microstructure pattern by steadily swelling the polymer, which is prefixed on a cathode of an electroforming system, by saturating the electrolyte solution into the polymer; electroforming in the electroforming system electrically connected with an anode and the cathode for filling metal in the cavities in the polymer; and desorption of the electrolyte from the polymer to shrink the polymer to be separated from an electroformed microstructure product, and demolding for obtaining the microstructure product having a high aspect ratio of 100 or even higher. The diameter or width of each cavity is shrunk to be smaller, thereby increasing the aspect ratio of the microstructure product.

Abstract translation: 用于制造微结构产品的微加工方法包括：微加工聚合物基材以形成具有深空腔的三维微结构图案; 通过使电解质溶液饱和到聚合物中，使聚合物稳定地膨胀并在电铸系统的阴极上预先固定，从而使微结构图案的每个空腔的直径或宽度最小化; 在与阳极和阴极电连接的电铸系统中电铸在聚合物中的空腔中填充金属; 并从聚合物中解吸电解质以收缩待分离的电铸微结构产品的聚合物，以及脱模以获得具有100或更高的高纵横比的微结构产品。 每个空腔的直径或宽度收缩较小，从而增加微结构产品的纵横比。

公开(公告)号：US5746956A

公开(公告)日：1998-05-05

申请号：US743447

申请日：1996-11-01

Applicant: Tung-Han Chuang ,  Ching-Bin Lin ,  Teng-Chun Tsai ,  Jiin-Chyuan Chang

Inventor： Tung-Han Chuang ,  Ching-Bin Lin ,  Teng-Chun Tsai ,  Jiin-Chyuan Chang

IPC: B29B9/04 ,  B29B9/12 ,  B29C70/88 ,  B32B7/02 ,  B32B15/08 ,  B32B37/15 ,  C08J5/12 ,  C08L25/06 ,  C08L55/02 ,  C08L71/12 ,  H01B1/20

CPC classification number: B32B37/153 ,  B29B9/04 ,  B29C70/885 ,  B32B2311/24

Abstract: The present invention provides novel kind of aluminum laminally filled plastic pellets and a process and apparatus for manufacturing the plastic pellets. The process includes coating the upper and lower surfaces of each of the substantially parallel lined aluminum foil layers with a coupling agent; drying the aluminum foil layers; introducing a molten plastic matrix to the space between each two aluminum foil layers and the outer surfaces of the most outside two aluminum foil layers to moisturize and bind the aluminum foil layers; reducing the thickness of the aluminum foil layers to form a continuous laminally filled plastic composite plate; and cooling and cutting the composite plate into aluminum laminally filled plastic pellets of a predetermined size. The aluminum contained in the plastic pellet maintains a high aspect ratio, therefore, reducing the loading amount of the aluminum required to provide good EMI shielding of the plastic pellets, while not adversely affeting the mechanical properties of the EMI plastic product.

Abstract translation: 本发明提供了新型的层状铝填充塑料颗粒和用于制造塑料颗粒的方法和装置。 该方法包括用偶联剂涂覆每个基本上平行的内衬铝箔层的上表面和下表面; 干燥铝箔层; 将熔融塑料基体引入到两个铝箔层之间的空间和最外侧的两个铝箔层的外表面，以使铝箔层保湿和粘合; 减少铝箔层的厚度，形成连续的层叠填充塑料复合板; 并将复合板冷却并切割成预定尺寸的铝层压填充的塑料颗粒。 包含在塑料颗粒中的铝保持高纵横比，因此，减少了为塑料颗粒提供良好的EMI屏蔽所需的铝的负载量，同时不会不利地影响EMI塑料制品的机械性能。

公开(公告)号：US5531851A

公开(公告)日：1996-07-02

申请号：US431137

申请日：1995-04-28

Applicant: Ching-Bin Lin ,  Tung-Han Chuang

Inventor： Ching-Bin Lin ,  Tung-Han Chuang

IPC: B29B9/02 ,  B29B9/12 ,  B32B15/08 ,  B29B9/06 ,  B23B31/18 ,  B29B11/16

CPC classification number: B29B9/02 ,  B29B9/12 ,  B32B15/08 ,  Y10T156/1062 ,  Y10T156/1067

Abstract: A process for making metallized plastic molding pellets comprising: first metallizing a laminated plastic sheet by sandwiching an electrically conductive metal foil in between two plastic films; secondly slicing the metallized laminated plastic sheet into a plurality of metallized plastic strips; thirdly wetting and binding the metallized plastic strips, which are radially arranged, with a thermoplastic resin matrix to form a metallized plastic bar by pultrusion processing; and finally cutting the pultruded metallized bar to obtain homogeneously metallized plastic pellets for making effective EMI shields.

Abstract translation: 一种用于制造金属化塑料模制粒料的方法，包括：首先通过将导电金属箔夹在两个塑料膜之间来对金属化层压塑料片进行金属化; 其次将金属化层压塑料片切割成多个金属化塑料条; 第三次将热塑性树脂基体径向布置的金属化塑料条进行润湿和粘合，通过拉挤成型加工形成金属化塑料棒; 并最终切割拉挤的金属化棒以获得均匀金属化的塑料颗粒，以制造有效的EMI屏蔽。