Abstract:
Removing photoresist from alignment marks on a semiconductor wafer using a wafer edge exposure process is disclosed. The alignment marks on the wafer are covered by photoresist used in conjunction with semiconductor processing of one or more layers deposited on the semiconductor wafer. One or more parts of the edge of the wafer are exposed to remove the photoresist from these parts and thus reveal alignment marks on the wafer. The exposure of the one or more parts of the wafer is accomplished without performing a photolithographic clear out process. Rather, a wafer edge exposure (WEE) process is inventively utilized. Once the WEE process is performed, subsequent layers may be deposited by aligning them using the revealed alignment marks.
Abstract:
A display system that can be calibrated and re-calibrated with a minimal amount of manual intervention. To accomplish this, one or more cameras are provided to capture an image of the display screen. The resulting captured image is processed to identify any non-desirable characteristics, including visible artifacts such as seams, bands, rings, etc. Once the non-desirable characteristics are identified, an appropriate transformation function is determined. The transformation function is used to pre-warp the input video signal that is provided to the display such that the non-desirable characteristics are reduced or eliminated from the display. The transformation function preferably compensates for spatial non-uniformity, color non-uniformity, luminance non-uniformity, and other visible artifacts.