公开(公告)号：US06523455B1

公开(公告)日：2003-02-25

申请号：US09982068

申请日：2001-10-17

Applicant: Rodney James Callahan ,  Ronald James Mangiapane

Inventor： Rodney James Callahan ,  Ronald James Mangiapane

IPC: F01B300

CPC classification number: F04B27/109

Abstract: A swashplate-type compressor is provided. The compressor has a housing member that defines a plurality of grooves having features that allow the grooves to direct lubricating oil splashed against the housing member toward a central opening that houses a bearing and shaft. Preferably, the grooves comprise an annular groove and a series of oil collection grooves emanating outward from the annular groove. Each oil collection groove has a first wall that is substantially perpendicular to the plane of the housing member and a second wall that is angled with respect to both the first wall and the plane of the housing member. Also, each oil collection groove is in fluid communication with the annular groove. The housing member may further define one or more axial holes disposed within the annular groove.

Abstract translation: 提供斜盘式压缩机。 压缩机具有壳体构件，其限定多个凹槽，其具有允许凹槽将润滑油引导到容纳轴承和轴的中心开口的壳体构件的特征。 优选地，槽包括环形槽和从环形槽向外发出的一系列采油槽。 每个采油槽具有基本上垂直于壳体构件的平面的第一壁和相对于壳体构件的第一壁和平面成角度的第二壁。 此外，每个采油槽与环形槽流体连通。 壳体构件还可以限定设置在环形槽内的一个或多个轴向孔。

公开(公告)号：US06398631B1

公开(公告)日：2002-06-04

申请号：US09681160

申请日：2001-02-02

Applicant: Gary L. Anderson ,  Judy Schmidt ,  Brent Teasley ,  Dennis Buese ,  James Callahan ,  Randy Gene Loeschen

Inventor： Gary L. Anderson ,  Judy Schmidt ,  Brent Teasley ,  Dennis Buese ,  James Callahan ,  Randy Gene Loeschen

IPC: B24B4702

CPC classification number: B24B37/345 ,  H01L21/67745

Abstract: A system for facilitating transfer of a semiconductor wafer into or out of a wafer carrier of a polishing or lapping machine without contacting a face of the wafer. The system includes a wafer transport suitable for placement above the carrier, the transport having at least one open cavity with a size and shape suitable for registering alignment with an opening of the carrier. The cavity and opening together form a compartment adapted to receive and hold the wafer. A liquid delivery conduit having an outlet located above an abrading member of the machine is arranged to deliver a liquid to a position generally beneath the transport. A method for transferring the wafer to or from the machine includes delivering liquid beneath the wafer. The wafer thereby moves between a first position resting on the abrading member and a second position spaced above the abrading member where a tool may engage the edge of the wafer for holding the wafer without contacting the face of the wafer.

Abstract translation: 一种用于促进半导体晶片进入或抛出抛光或研磨机的晶片载体而不接触晶片的表面的系统。 该系统包括适于放置在载体上方的晶片传送装置，该传送装置具有至少一个开口空腔，其尺寸和形状适合于与载体的开口对准。 空腔和开口一起形成适于容纳和保持晶片的隔间。 具有位于机器的研磨部件上方的出口的液体输送管道布置成将液体输送到通常位于输送器下方的位置。 将晶片转移到或从机器转移的方法包括在晶片下方输送液体。 因此，晶片因此在搁置在研磨部件上的第一位置和在研磨部件上方间隔开的第二位置之间移动，其中工具可以接合晶片的边缘以保持晶片而不接触晶片的表面。

公开(公告)号：US6043687A

公开(公告)日：2000-03-28

申请号：US124350

申请日：1998-07-29

Applicant: Michael James Callahan, Jr.

Inventor： Michael James Callahan, Jr.

IPC: H01L21/761 ,  H01L27/08 ,  H02P6/06

CPC classification number: H01L21/761 ,  H01L27/0802

Abstract: A precision analog circuit ensures precision matching between two or more resistive elements. In order that the two or more resistive elements are truly matched, a first electrical value, such as V.sub.DS, of the two or more resistive elements are equal and a second electrical value, such as V.sub.GS, of the two or more resistive elements are equal so that a ratio of the first resistive element to the second resistive element is a predetermined value regardless of the voltage coefficients of the resistive elements.

Abstract translation: 精密模拟电路确保两个或多个电阻元件之间的精度匹配。 为了使两个或更多个电阻元件真正匹配，两个或更多个电阻元件的第一电值（例如VDS）相等，并且两个或更多个电阻元件的第二电值（诸如VGS）相等 使得第一电阻元件与第二电阻元件的比率是与电阻元件的电压系数无关的预定值。

公开(公告)号：US1490314A

公开(公告)日：1924-04-15

申请号：US53180022

申请日：1922-01-25

Applicant: JAMES CALLAHAN

Inventor： JAMES CALLAHAN

IPC: B65F7/00

CPC classification number: B65F7/00