REFRESH CONTROL CIRCUIT AND SEMICONDUCTOR MEMORY APPARATUS USING THE SAME
    31.
    发明申请
    REFRESH CONTROL CIRCUIT AND SEMICONDUCTOR MEMORY APPARATUS USING THE SAME 有权
    使用相同的刷新控制电路和半导体存储器

    公开(公告)号:US20120051169A1

    公开(公告)日:2012-03-01

    申请号:US12958233

    申请日:2010-12-01

    Applicant: Ki Hoon LEE

    Inventor: Ki Hoon LEE

    CPC classification number: G11C11/40618

    Abstract: Disclosed is a refresh control circuit for activating a plurality of bank selection signals in response to a refresh command signal. Each of the plurality of bank selection signals is assigned to one of a plurality of bank groups. The refresh control circuit is configured to activate the plurality of bank selection signals when a refresh cycle selection signal is deactivated, and activate a part of the plurality of bank selection signals when the refresh cycle selection signal is activated.

    Abstract translation: 公开了一种刷新控制电路,用于响应刷新命令信号激活多个存储体选择信号。 多个存储体选择信号中的每一个被分配给多个存储体组中的一个。 刷新控制电路被配置为当刷新周期选择信号被去激活时激活多个存储体选择信号,并且当刷新周期选择信号被激活时激活多个存储体选择信号的一部分。

    METHOD OF FORMING CHALCOGENIDE THIN FILM
    32.
    发明申请
    METHOD OF FORMING CHALCOGENIDE THIN FILM 有权
    形成聚乙烯薄膜的方法

    公开(公告)号:US20110027976A1

    公开(公告)日:2011-02-03

    申请号:US12936563

    申请日:2009-04-16

    CPC classification number: C23C16/305 C23C16/042 C23C16/45527

    Abstract: The present invention concerns a method of forming a chalcogenide thin film for a phase-change memory. In the method of forming a chalcogenide thin film according to the present invention, a substrate with a pattern formed is loaded into a reactor, and a source gas is supplied onto the substrate. Here, the source gas includes at least one source gas selected from germanium (Ge) source gas, gallium (Ga) source gas, indium (In) source gas, selenium (Se) source gas, antimony (Sb) source gas, tellurium (Te) source gas, tin (Sn) source gas, silver (Ag) source gas, and sulfur (S) source gas. A first purge gas is supplied onto the substrate in order to purge the source gas supplied onto the substrate, a reaction gas for reducing the source gas is then supplied onto the substrate, and a second purge gas is supplied onto the substrate in order to purge the reaction gas supplied onto the substrate. At least one operation, namely changing the supply time of the first purge gas and/or adjusting the internal pressure of the reactor is performed in such a way as to ensure that the deposition rate at an inner portion of the pattern is greater than the deposition rate at an upper portion of the pattern. According to the present invention, it is possible to form a chalcogenide thin film having an excellent gap-fill property by changing the purge time of the source gas or adjusting the internal pressure of the reactor in such a way as to ensure that the film forming rate at the inner portion of the pattern is greater than the film forming rate at the upper portion of the pattern.

    Abstract translation: 本发明涉及一种形成用于相变存储器的硫族化物薄膜的方法。 在根据本发明的形成硫族化物薄膜的方法中,将形成有图案的基板装载到反应器中,并将源气体供应到基板上。 这里,源气体包括选自锗(Ge)源气体,镓(Ga)源气体,铟(In)源气体,硒(Se)源气体,锑(Sb)源气体,碲( Te)源气体,锡(Sn)源气体,银(Ag)源气体和硫(S)源气体。 为了清洗供给到基板上的源气体,将第一吹扫气体供给到基板上,然后将用于还原原料气体的反应气体供给到基板上,向基板供给第二吹扫气体以便吹扫 供给到基板上的反应气体。 执行至少一种操作,即改变第一吹扫气体的供应时间和/或调节反应器的内部压力,以确保图案内部的沉积速率大于沉积物的沉积速率 速率在图案的上部。 根据本发明,可以通过改变源气体的吹扫时间或调节反应器的内部压力来形成具有优异间隙填充性质的硫族化物薄膜,以确保成膜 在图案的内部的速率大于图案上部的成膜速率。

    Method of depositing chalcogenide film for phase-change memory
    34.
    发明授权
    Method of depositing chalcogenide film for phase-change memory 有权
    沉积硫族化合物膜用于相变记忆的方法

    公开(公告)号:US07803656B2

    公开(公告)日:2010-09-28

    申请号:US12301071

    申请日:2007-05-18

    Abstract: Provided is a method of depositing a chalcogenide film for phase-change memory. When the chalcogenide film for phase-change memory is deposited through a method using plasma such as plasma enhanced chemical vapor deposition (PECVD) or plasma enhanced atomic layer deposition (PEALD), a plasma reaction gas including He is used such that the crystallinity of the chalcogenide film is adjusted and the grain size and morphology of the deposited film are adjusted.

    Abstract translation: 提供了一种沉积用于相变存储器的硫族化物膜的方法。 当通过诸如等离子体增强化学气相沉积(PECVD)或等离子体增强原子层沉积(PEALD)的等离子体的方法沉积用于相变存储器的硫族化物膜时,使用包括He的等离子体反应气体,使得 调整硫属化物膜并调节沉积膜的晶粒尺寸和形态。

    METHOD OF DEPOSITING CHALCOGENIDE FILM FOR PHASE-CHANGE MEMORY
    35.
    发明申请
    METHOD OF DEPOSITING CHALCOGENIDE FILM FOR PHASE-CHANGE MEMORY 有权
    用于相变记忆沉积氯化铝膜的方法

    公开(公告)号:US20090093083A1

    公开(公告)日:2009-04-09

    申请号:US12301071

    申请日:2007-05-18

    Abstract: Provided is a method of depositing a chalcogenide film for phase-change memory. When the chalcogenide film for phase-change memory is deposited through a method using plasma such as plasma enhanced chemical vapor deposition (PECVD) or plasma enhanced atomic layer deposition (PEALD), a plasma reaction gas including He is used such that the crystallinity of the chalcogenide film is adjusted and the grain size and morphology of the deposited film are adjusted.

    Abstract translation: 提供了一种沉积用于相变存储器的硫族化物膜的方法。 当通过诸如等离子体增强化学气相沉积(PECVD)或等离子体增强原子层沉积(PEALD)的等离子体的方法沉积用于相变存储器的硫族化物膜时,使用包括He的等离子体反应气体,使得 调整硫属化物膜并调节沉积膜的晶粒尺寸和形态。

    CLEANING METHOD OF APPARATUS FOR DEPOSITING METAL CONTAINING FILM
    36.
    发明申请
    CLEANING METHOD OF APPARATUS FOR DEPOSITING METAL CONTAINING FILM 审中-公开
    用于沉积含金属膜的装置的清洁方法

    公开(公告)号:US20090090384A1

    公开(公告)日:2009-04-09

    申请号:US12301051

    申请日:2007-01-22

    CPC classification number: C23C16/4405

    Abstract: Provided is a cleaning method of an apparatus for depositing a metal containing film using a metal organic (MO) source. A fluorine (F)-containing gas and a carbon (C)-eliminating gas are supplied to a reactor of the apparatus so that in-situ cleaning can be performed. A solid by-product is not generated in the method, and after a predetermined quantity of wafers is processed, in-situ cleaning can be performed without exposing the reactor to the air such that productivity of the apparatus is maximized.

    Abstract translation: 提供一种使用金属有机(MO)源沉积含金属膜的设备的清洁方法。 将含氟(F)的气体和碳(C) - 还原气体供给到设备的反应器中,从而可以进行原位清洗。 在该方法中不产生固体副产物,并且在处理了预定量的晶片之后,可以进行原位清洁而不将反应器暴露在空气中,使得装置的生产率最大化。

Patent Agency Ranking