公开(公告)号：US20110256334A1

公开(公告)日：2011-10-20

申请号：US12763541

申请日：2010-04-20

Applicant: Victoria Ann Edwards ,  Cynthia Baker Giroux ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada ,  Wanda Janina Walczak

Inventor： Victoria Ann Edwards ,  Cynthia Baker Giroux ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada ,  Wanda Janina Walczak

IPC: B32B27/00 ,  B32B1/04 ,  B32B7/00 ,  B32B37/00 ,  B32B27/36

CPC classification number: B32B3/04 ,  B32B9/045 ,  B32B27/283 ,  B32B27/32 ,  B32B27/36 ,  B32B2255/20 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2307/554 ,  B32B2307/5825 ,  B32B2307/732 ,  B32B2367/00 ,  B32B2439/70 ,  B32B2439/80 ,  B32B2457/12 ,  B32B2457/206 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5256 ,  Y10T156/10 ,  Y10T428/231 ,  Y10T428/239 ,  Y10T428/24 ,  Y10T428/249921 ,  Y10T428/263 ,  Y10T428/31663 ,  Y10T428/31786

Abstract: A free-standing multi-laminate hermetic sheet includes a first carrier film, a hermetic inorganic thin film formed over the first carrier film, and a second carrier film formed over the hermetic inorganic thin film. A workpiece can be hermetically sealed using the multi-laminate sheet, which can be applied to the workpiece in a step separate from a formation step of either the multi-laminate sheet or the workpiece.

Abstract translation: 独立的多层密封薄片包括第一载体膜，形成在第一载体膜上的密封无机薄膜和形成在密封无机薄膜上的第二载体膜。 可以使用可与多层压片或工件的形成步骤分离的步骤施加到工件上的多层压片材气密密封工件。

公开(公告)号：US20100190051A1

公开(公告)日：2010-07-29

申请号：US12362063

申请日：2009-01-29

Applicant: Bruce Gardiner Aitken ,  Todd Parrish St. Clair ,  James R. Lim ,  Prantik Mazumder ,  Mark Alejandro Quesada

Inventor： Bruce Gardiner Aitken ,  Todd Parrish St. Clair ,  James R. Lim ,  Prantik Mazumder ,  Mark Alejandro Quesada

IPC: H01M6/12 ,  H01M6/02 ,  C23C14/34

CPC classification number: H01M10/052 ,  H01M2/1061 ,  H01M6/40 ,  H01M10/0525 ,  H01M10/0565 ,  H01M10/0585 ,  Y10T29/49108

Abstract: A thin film battery comprises a substrate, anode and cathode current collector layers formed over the substrate, anode and cathode layers formed over and in electrical contact with respective ones of the current collector layers, and an electrolyte layer formed between the anode and cathode layers. The thin film battery further comprises a barrier layer formed from a material such as tin oxide, tin phosphate, tin fluorophosphate, chalcogenide glass, tellurite glass or borate glass. The barrier layer is configured to encapsulate the thin film battery layers and substantially inhibit or prevent exposure of the thin film battery layers to air or moisture.

Abstract translation: 薄膜电池包括在基板上形成的基板，阳极和阴极集电器层，在相应的集电器层上形成并与之相接触的阳极和阴极层以及形成在阳极和阴极层之间的电解质层。 薄膜电池还包括由诸如氧化锡，磷酸锡，氟磷酸锡，硫族化物玻璃，碲化物玻璃或硼酸盐玻璃的材料形成的阻挡层。 阻挡层被构造成封装薄膜电池层，并且基本上抑制或防止薄膜电池层暴露于空气或湿气。

公开(公告)号：US20090324830A1

公开(公告)日：2009-12-31

申请号：US12553469

申请日：2009-09-03

Applicant: Bruce Gardiner Aitken ,  Chong Pyung An ,  Benjamin Zain Hanson ,  Mark Alejandro Quesada

Inventor： Bruce Gardiner Aitken ,  Chong Pyung An ,  Benjamin Zain Hanson ,  Mark Alejandro Quesada

IPC: C23C16/22

CPC classification number: H01L51/5253 ,  C23C14/06 ,  H01L31/048 ,  Y02E10/50

Abstract: A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.

Abstract translation: 公开了一种用于抑制装置的氧气和水分渗透的方法，包括以下步骤：在所述装置的至少一部分上沉积磷酸铁低液相线温度（LLT）无机材料以产生沉积的磷酸锡LLT材料，并热处理 沉积的LLT材料在基本上无氧和无水的环境中以形成气密密封; 其中沉积LLT材料的步骤包括使用包含钨的电阻加热元件。 还公开了一种有机电子器件，其包括基板，至少一个电子或光电子层和磷酸锡LLT阻挡层，其中电子或光电子层气密地密封在磷酸锡LLT阻挡层和基板之间。 还公开了一种装置，其至少一部分用磷酸铁LLT阻挡层密封。

公开(公告)号：US07615506B2

公开(公告)日：2009-11-10

申请号：US11544262

申请日：2006-10-06

Applicant: Bruce Gardiner Aitken ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada

Inventor： Bruce Gardiner Aitken ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada

IPC: C03C3/247 ,  C03C8/08 ,  C03C8/20 ,  B32B15/00 ,  B32B17/00 ,  H01L23/29

CPC classification number: C03C3/247 ,  C03C8/24

Abstract: Tungsten-doped tin-fluorophosphate glasses are described herein which exhibit excellent humidity resistance, thermal resistance, and have a low glass transition temperature which makes them suitable for low temperature sealing applications, such as for encapsulating electronic components. In one embodiment, these glasses comprise 55-75% Sn, 4-14% P, 6-24% O, 4-22% F, and 0.15-15% W on a weight percent elemental basis.

Abstract translation: 本文描述了钨掺杂的锡 - 氟磷酸盐玻璃，其表现出优异的耐湿性，耐热性，并且具有低玻璃化转变温度，这使得它们适合于低密封应用，例如用于封装电子部件。 在一个实施方案中，这些玻璃包含基于重量百分比的55-75％Sn，4-14％P，6-24％O，4-22％F和0.15-15％W。

公开(公告)号：US20080149924A1

公开(公告)日：2008-06-26

申请号：US12072784

申请日：2008-02-28

Applicant: Bruce Gardiner Aitken ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada

Inventor： Bruce Gardiner Aitken ,  Shari Elizabeth Koval ,  Mark Alejandro Quesada

IPC: B05D1/40 ,  B05D3/02 ,  B05D1/02 ,  C23C14/28 ,  C23C14/34 ,  H01L51/40 ,  B05D5/12 ,  B05D3/12 ,  B05D1/18

CPC classification number: C23C14/086 ,  C03C3/12 ,  C03C3/247 ,  C03C8/24 ,  C03C17/3615 ,  C03C17/3621 ,  C03C17/3649 ,  C03C17/3663 ,  H01L51/5253 ,  Y10T428/239

Abstract: A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.

Abstract translation: 这里描述了不进行热处理步骤而密封装置的方法和所得的密封装置。 该方法包括以下步骤：（1）将未封装的装置相对于沉积装置定位在所需位置; 和（2）使用沉积装置将密封材料沉积在未封装装置的至少一部分上以形成密封装置，而不必进行后沉积热处理步骤。 例如，密封材料可以是含Sn 2+的无机氧化物材料或低液相线温度的无机材料。

公开(公告)号：US20080026180A1

公开(公告)日：2008-01-31

申请号：US11493741

申请日：2006-07-26

Applicant: Robert L. Bush ,  Steven Bruce Dawes ,  Francis Paul Fehlner ,  Kishor Purushottam Gadkaree ,  Sean Matthew Garner ,  Mark Alejandro Quesada

Inventor： Robert L. Bush ,  Steven Bruce Dawes ,  Francis Paul Fehlner ,  Kishor Purushottam Gadkaree ,  Sean Matthew Garner ,  Mark Alejandro Quesada

IPC: C14C9/00

CPC classification number: D21H17/68 ,  D21H13/40 ,  D21H13/44 ,  D21H13/50 ,  G02F1/133305 ,  Y10T428/24355 ,  Y10T428/4935

Abstract: A flexible substrate is described herein which is made from a freestanding inorganic material (e.g., mica paper, carbon paper, glass fiber paper) with pores/interstices that have been impregnated with a special impregnating material (e.g., silsesquioxane, alkali silicate glass with weight ratio of SiO2/X2O (X is alkali Na, K etc.) between 1.6-3.5). In one embodiment, the flexible substrate is made by: (1) providing a freestanding inorganic material; (2) providing an impregnating material; (3) impregnating the pores/interstices within the freestanding inorganic material with the impregnating material; and (4) curing the freestanding inorganic material with the impregnated pores/interstices to form the flexible substrate. The flexible substrate is typically used to make a flexible display or a flexible electronic.

Abstract translation: 本文描述了由独立的无机材料（例如，云母纸，碳纸，玻璃纤维纸）制成的柔性基底，其具有用特殊浸渍材料浸渍的孔隙/间隙（例如，倍半硅氧烷，具有重量的碱性硅酸盐玻璃 SiO 2 / X 2 O（X是碱Na，K等）的比例在1.6-3.5之间）。 在一个实施例中，柔性基底由以下制成：（1）提供独立的无机材料; （2）提供浸渍材料; （3）用浸渍材料浸渍在独立无机材料内的孔/间隙; 和（4）用浸渍的孔/间隙固化独立的无机材料以形成柔性基底。 柔性基板通常用于制造柔性显示器或柔性电子元件。