公开(公告)号：US20250053384A1

公开(公告)日：2025-02-13

申请号：US18447522

申请日：2023-08-10

Applicant: MEDIATEK INC.

Inventor： Wei-Chun KAO ,  Hsien-Ming TSAI ,  Jing-Yen HUANG ,  Ming-Chun CHENG

IPC: G06F8/30

Abstract: A method for multiple executable binaries with static links is provided. The method includes a fixed binary generated from non-modified source program file has symbols of functions and variables with fixed addresses; a first modifiable binary generated from modified source program files has symbols of functions and variables with changed addresses; and a first reference table contains the symbols of functions and variables of the first modifiable binary which are referred by the fixed binary; wherein the first modifiable binary refers to the symbols of the fixed binary directly, and the fixed binary refers to the symbols of functions and the variables of the first modifiable binary through the first reference table at runtime.

公开(公告)号：US12224836B2

公开(公告)日：2025-02-11

申请号：US18083643

申请日：2022-12-19

Applicant: MEDIATEK INC.

Inventor： Chong-You Lee ,  Jiaxian Pan ,  Yabo Li ,  Wei-Jen Chen ,  Wei-Hsuan Hsieh ,  Feng Chiu ,  Da-chun Hsing ,  Sung-Chiao Li

IPC: H04B7/06

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a device. The device applies Nso sensing beam vectors to Nso received signals at Nant antennas to obtain Nso measurements, respectively, Nso and Nant each being an integer greater than or equal to 1. The device determines a beam vector based on the Nso measurements and the Nso sensing beam vectors.

公开(公告)号：US12219650B2

公开(公告)日：2025-02-04

申请号：US18362546

申请日：2023-07-31

Applicant: MEDIATEK INC.

Inventor： Chien-Chun Huang-Fu ,  Chun-Fan Tsai ,  I-Kang Fu ,  Chin-Chia Chang

IPC: H04W76/30 ,  H04W36/00 ,  H04W36/14 ,  H04W76/27

Abstract: A User Equipment (UE) including a wireless transceiver and a controller is provided. The wireless transceiver performs wireless transmission and reception to and from a first service network utilizing a first RAT or a second service network utilizing a second RAT. The controller sends an indicator of a connection release request to the first service network via the wireless transceiver in response to terminating a first communication service with the first service network or in response to leaving the first service network for the second service network. Also, the controller releases a Radio Resource Control (RRC) connection with the first service network after sending the indicator of the connection release request.

公开(公告)号：US20250038811A1

公开(公告)日：2025-01-30

申请号：US18780808

申请日：2024-07-23

Applicant: MEDIATEK INC.

Inventor： Pedram Kheirkhah Sangdeh ,  Jie-Ni Liang ,  Gyu Bum Kyung

IPC: H04B7/06 ,  H04W24/02

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a base station. The base station receives a sounding reference signal (SRS) from a user equipment (UE). The base station estimates an uplink (UL) channel state information (CSI) based on the received SRS. The base station monitors the estimated UL CSI to track changes. The base station determines whether to update or switch an artificial intelligence (AI)/machine learning (ML) model used for downlink (DL) CSI compression based on the monitoring of the estimated UL CSI.

公开(公告)号：US20250038412A1

公开(公告)日：2025-01-30

申请号：US18547211

申请日：2023-04-23

Applicant: MEDIATEK INC.

Inventor： Nai-Chen LIU ,  Shih-Huang YEH ,  Chung-Hsin CHIANG ,  Wun-Jian LIN

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q9/06 ,  H01Q13/10

Abstract: A semiconductor package is provided. The semiconductor package includes a first passive component module, a first antenna module, a first conductive structure and a second conductive structure. The first passive component module has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The passive component module has a first size. The first antenna module is separated from the first passive component module and stacked on the top surface of the first passive component module. The antenna module has a second size. The first conductive structure is in contact with the top surface of the first passive component module and electrically connected to the first antenna module. The second conductive structure is in contact with the bottom surface of the first passive component module.

公开(公告)号：US20250038126A1

公开(公告)日：2025-01-30

申请号：US18784941

申请日：2024-07-26

Applicant: MEDIATEK INC.

Inventor： De-Wei Liu ,  Pu-Shan Huang ,  Sang-Mao Chiu ,  Shih-Yi Syu

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/055 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/58

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface, and a vertical sidewall extending between the top surface and the bottom surface; an integrated circuit die mounted within a device region on the top surface of the substrate; a metal interconnect structure embedded within the device region of the substrate, wherein the integrated circuit die is electrically connected to the metal interconnect structure; and a peripheral shielding ring embedded within a peripheral region of the substrate. The peripheral region surrounds the device region. A lid is mounted on the top surface of the substrate. The lid is electrically connected with the peripheral shielding ring.

公开(公告)号：US20250023226A1

公开(公告)日：2025-01-16

申请号：US18735547

申请日：2024-06-06

Applicant: MEDIATEK Inc.

Inventor： Chih-Hsiang LIU ,  Shih-Huang YEH

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q1/50

Abstract: An antenna device includes an antenna substrate and a semiconductor package. The antenna substrate includes a base and an input pad, wherein the base has a first surface, and the input pad is disposed on a first portion of the first surface. The semiconductor package is disposed on the first surface of the semiconductor package. The semiconductor package has a second surface facing the first surface, and an entirety of the second surface and a second portion of the first surface overlap.

公开(公告)号：US20250015498A1

公开(公告)日：2025-01-09

申请号：US18731366

申请日：2024-06-03

Applicant: MEDIATEK INC.

Inventor： Nai-Chen Liu ,  Yu-Chen Chen ,  Chung-Hsin Chiang

IPC: H01Q9/04 ,  H01Q1/50 ,  H01Q5/35 ,  H01Q9/28

Abstract: An antenna for multi-band communication includes a plurality of radiators which are physically separated from each other. Each radiator is disposed on different planes and is used to jointly function as one or more dipoles. Further, each radiator contributes to resonances at two or more non-overlapping bands. This compact, multi-layered antenna structure is designed for space-efficient operation in multiple frequency bands. It is particularly suitable for portable communication devices with size constraints, as it provides transmit and/or receive capabilities across different bands while occupying minimal space.

公开(公告)号：US12192980B2

公开(公告)日：2025-01-07

申请号：US17693241

申请日：2022-03-11

Applicant: MEDIATEK INC.

Inventor： Chi-Hsuan Hsieh

IPC: H04W72/12 ,  H04L5/00 ,  H04L27/26 ,  H04W72/0446 ,  H04W72/20

Abstract: Method and UE are provided for scheduling for scheduling with multiple cells. In particular, a UE can connect to a plurality of cells in a network. The UE can determine a reference slot length according to an SCS of a first cell of the plurality of cells.

公开(公告)号：US20250008318A1

公开(公告)日：2025-01-02

申请号：US18711002

申请日：2023-01-10

Applicant: MEDIATEK INC.

Inventor： Guan-Yu LIN ,  Chia-Hao YU ,  Lung-Sheng TSAI ,  Nathan Edward TENNY

IPC: H04W8/24 ,  H04W88/04

Abstract: A synergetic communication method for capability reporting in relay communications is proposed. A user equipment (UE) may detect the relay node(s). In an event that a trigger condition is triggered, the UE may transmit the capability report associated with the detected relay node to the network node. The network node may generate the resource configuration based on the capability report from the UE. Therefore, the network node is able to obtain the capability information of the relay node even if the relay node has limited capability, e.g., the relay node is a layer 0 (L0) relay node or a layer 1 (L1) relay node.