公开(公告)号：US20130214876A1

公开(公告)日：2013-08-22

申请号：US13668760

申请日：2012-11-05

Applicant: Moon Chul Lee ,  Duck Hwan Kim ,  In Sang Song ,  Jea Shik Shin

Inventor： Moon Chul Lee ,  Duck Hwan Kim ,  In Sang Song ,  Jea Shik Shin

IPC: H03H9/00

CPC classification number: G01N27/04 ,  B81B2201/02 ,  H03H3/0072 ,  H03H3/0077 ,  H03H9/2463 ,  H03H2009/02346 ,  H03H2009/0244

Abstract: A nano scale resonator, a nano scale sensor, and a fabrication method thereof are provided. The nano scale resonator includes a resonance unit of nano scale configured to resonate based on an applied signal, and an anchor on a substrate, the anchor being configured to support the resonance unit, the anchor having an air gap within boundaries of the anchor, the resonance unit, and the substrate, the air gap being configured to reflect a vertical wave occurring in the resonance unit.

Abstract translation: 提供了纳米级谐振器，纳米级传感器及其制造方法。 所述纳米级谐振器包括纳米级的谐振单元，其被配置为基于所施加的信号而谐振，并且所述锚固件被构造成支撑所述谐振单元，所述锚固件在所述锚的边界内具有气隙， 谐振单元和基板，气隙被配置为反映在谐振单元中发生的垂直波。

公开(公告)号：US20130181579A1

公开(公告)日：2013-07-18

申请号：US13686005

申请日：2012-11-27

Applicant: Jea Shik Shin ,  Duck Hwan Kim ,  Chul Soo Kim ,  Ho Soo Park ,  Sang Uk Son ,  In Sang Song ,  Moon Chul Lee ,  Cui Jing

Inventor： Jea Shik Shin ,  Duck Hwan Kim ,  Chul Soo Kim ,  Ho Soo Park ,  Sang Uk Son ,  In Sang Song ,  Moon Chul Lee ,  Cui Jing

IPC: H01L41/107

CPC classification number: H01L41/107 ,  H03H9/02102 ,  H03H9/0211 ,  H03H9/173 ,  H03H9/174 ,  H03H9/175

Abstract: Provided is a bulk acoustic wave resonator (BAWR). The BAWR may include an air cavity disposed on a substrate, a bulk acoustic wave resonant unit including a piezoelectric layer, and a reflective layer to reflect a wave of a resonant frequency that is generated from the piezoelectric layer.

Abstract translation: 提供了一种体声波谐振器（BAWR）。 BAWR可以包括设置在基板上的空气腔，包括压电层的体声波谐振单元和反射层，以反射从压电层产生的谐振频率的波。

公开(公告)号：US08419158B2

公开(公告)日：2013-04-16

申请号：US12139652

申请日：2008-06-16

Applicant: Yong-won Jeong ,  Hyung Choi ,  Eun-bong Han ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim

Inventor： Yong-won Jeong ,  Hyung Choi ,  Eun-bong Han ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim

IPC: B41J29/393

CPC classification number: B41J2/04586 ,  B41J2/0454 ,  B41J2/04563

Abstract: An apparatus to sense the temperature of an ink-jet head includes at least one or more CMOS (complementary metal oxide semiconductor) lateral BJTs (bipolar junction transistors) to sense the temperature of the ink-jet head, and a current supply unit to supply a current to the CMOS lateral BJTs. Minimum sized CMOS lateral BJTs are applied to an ink-jet printer head so that precise temperature control can be performed in a shuttle or array type ink-jet printer.

Abstract translation: 感测喷墨头的温度的装置包括至少一个或多个CMOS（互补金属氧化物半导体）横向BJT（双极结型晶体管），以感测喷墨头的温度，以及电流供应单元 电流到CMOS侧向BJT。 将最小尺寸的CMOS侧向BJT施加到喷墨打印机头，使得可以在梭式或阵列式喷墨打印机中进行精确的温度控制。

公开(公告)号：US08349199B2

公开(公告)日：2013-01-08

申请号：US12544422

申请日：2009-08-20

Applicant: Yong-won Jeong ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim ,  Jong-seok Kim

Inventor： Yong-won Jeong ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim ,  Jong-seok Kim

IPC: B41J2/14 ,  B44C1/22

CPC classification number: B41J2/14129 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631

Abstract: An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate.

Abstract translation: 喷墨打印头的供墨孔及其形成方法包括穿透基板并具有在基板的上方向上变窄的宽度的供墨孔，其中，墨供给孔的至少一个内壁具有多个 相对于基板的表面的台阶和倾斜。

公开(公告)号：US08114578B2

公开(公告)日：2012-02-14

申请号：US11968809

申请日：2008-01-03

Applicant: Moon-chul Lee ,  Yong-seop Yoon ,  Min-soo Kim ,  Yong-won Jeong ,  Dong-sik Shim

Inventor： Moon-chul Lee ,  Yong-seop Yoon ,  Min-soo Kim ,  Yong-won Jeong ,  Dong-sik Shim

IPC: B41J2/16

CPC classification number: G03F7/203 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2002/14475

Abstract: Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.

Abstract translation: 提供了使用光刻工艺制造光敏环氧树脂结构的方法，以及使用制造光敏环氧树脂结构的方法制造喷墨打印头的方法。 制造感光环氧树脂结构的方法包括形成由光敏环氧树脂形成的环氧树脂材料层; 通过进行第一曝光操作在环氧树脂材料层中形成第一曝光图案; 通过进行第二曝光操作在所述环氧树脂材料层的未曝光部分中形成第二曝光图案; 以及显影环氧材料层，其中在第一曝光操作中使用的第一UV能量的量与在第二曝光操作中使用的第二UV能量的量不同。

公开(公告)号：US20100020136A1

公开(公告)日：2010-01-28

申请号：US12389121

申请日：2009-02-19

Applicant: Moon-chul LEE ,  Yong-Seop YOON ,  Yong-Won JEONG ,  Dong-Sik SHIN ,  Jong-Seok KIM

Inventor： Moon-chul LEE ,  Yong-Seop YOON ,  Yong-Won JEONG ,  Dong-Sik SHIN ,  Jong-Seok KIM

IPC: B41J2/175 ,  G11B5/127

CPC classification number: B41J2/14145 ,  B41J2/1404 ,  B41J2/1603 ,  B41J2/1628

Abstract: Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate having an ink feed hole extending therethrough; a chamber layer including a plurality of ink chambers above the substrate; a nozzle layer including a plurality of nozzles above the chamber layer; and at least one support beam formed in the substrate to connect inner walls of the ink feed hole.

Abstract translation: 提供一种喷墨打印头及其制造方法。 喷墨打印头包括：具有延伸穿过其中的供墨孔的基板; 包括在所述基板上方的多个墨水室的室层; 喷嘴层，其包括在所述室层上方的多个喷嘴; 以及形成在所述基板中的至少一个支撑梁，以连接所述供墨孔的内壁。

公开(公告)号：US20100002036A1

公开(公告)日：2010-01-07

申请号：US12367907

申请日：2009-02-09

Applicant: Yong-won JEONG ,  Hyung CHOI ,  Yung-seop YOON ,  Moon-chul LEE ,  Dong-shik SHIM

Inventor： Yong-won JEONG ,  Hyung CHOI ,  Yung-seop YOON ,  Moon-chul LEE ,  Dong-shik SHIM

IPC: B41J29/38

CPC classification number: B41J2/0458 ,  B41J2/04541 ,  B41J2/0455 ,  B41J2/04563

Abstract: Provided are an apparatus and method of controlling jetting of ink of an inkjet printer. The apparatus includes at least one print head chip, which includes a temperature sensor for sensing the temperature of the print head chip and a voltage controlled oscillator (VCO) for converting the sensed temperature to a frequency component. The apparatus may also include a counter, which converts the frequency component to a code information using a reference frequency component, and a controller, which controls the ink jetting operation of the at least one print head chip based on the code information and/or the frequency component.

Abstract translation: 提供一种控制喷墨打印机墨水喷射的装置和方法。 该装置包括至少一个打印头芯片，其包括用于感测打印头芯片的温度的温度传感器和用于将感测到的温度转换成频率分量的压控振荡器（VCO）。 该装置还可以包括使用参考频率分量将频率分量转换为码信息的计数器，以及基于代码信息和/或控制器控制至少一个打印头芯片的喷墨操作的控制器 频率分量。

公开(公告)号：US20090267990A1

公开(公告)日：2009-10-29

申请号：US12209775

申请日：2008-09-12

Applicant: Moon-chul LEE ,  Yong-seop Yoon ,  Yong-won Jeong ,  Dong-sik Shim ,  Sung-joon Park ,  Jong-seok Kim

Inventor： Moon-chul LEE ,  Yong-seop Yoon ,  Yong-won Jeong ,  Dong-sik Shim ,  Sung-joon Park ,  Jong-seok Kim

IPC: B41J2/16

CPC classification number: B41J2/1404 ,  B41J2/14129 ,  B41J2/17563 ,  B41J2002/14403

Abstract: Provided is a thermal inkjet printhead that includes a substrate, which may comprise an ink feed hole for supplying ink, a chamber layer, which is stacked on the substrate, and which comprises an ink chamber that is filled with the ink supplied from the ink feed hole, a heater, which is prepared inside the ink chamber and heats the ink, an island, which is formed on the substrate, and which is prepared at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, and which comprises a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.

Abstract translation: 提供了一种热喷墨打印头，其包括可以包括用于供应墨水的供墨孔的基板，层叠在基板上的室层，并且包括填充有从墨水供给的墨水的墨水室 孔，加热器，其被制备在墨室内并加热墨;形成在基底上的岛，并且在墨室的墨入口处制备的岛，以及喷涂层，其堆叠在 室层，并且其包括用于喷射油墨的喷嘴。 相对于喷嘴的中心，墨水室和彼此面对的岛的壁是对称的。

公开(公告)号：US20090141083A1

公开(公告)日：2009-06-04

申请号：US12114982

申请日：2008-05-05

Applicant: Dong-sik SHIM ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

Inventor： Dong-sik SHIM ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

IPC: B41J2/16 ,  H01L21/00

CPC classification number: B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1639 ,  B41J2002/14387

Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a silicon on insulator (SOI) substrate including a lower silicon substrate, a middle insulating layer, an upper silicon substrate, and an ink feed hole, the ink feed hole penetrates the SOI substrate to supply ink, an insulating layer stacked on the upper silicon substrate of the SOI substrate, a chamber layer stacked on the insulating layer in which a plurality of ink chambers filled with ink supplied from the ink feed hole is formed, a nozzle layer stacked on the chamber layer in which a plurality of nozzles is formed to correspond to the ink chambers, a plurality of heaters formed on the insulating layer which heats ink in the ink chambers to generate bubbles and eject ink through the nozzles, and a driving circuit region on which a driving circuit is formed to drive the heaters.

Abstract translation: 喷墨打印头及其制造方法。 喷墨打印头包括具有下硅衬底，中间绝缘层，上硅衬底和供墨孔的绝缘体上硅（SOI）衬底，所述供墨孔穿透所述SOI衬底以供应墨，绝缘层堆叠 在SOI衬底的上硅衬底上形成层叠在绝缘层上的室层，其中形成有从供墨孔供应的油墨的多个油墨室，堆叠在室层上的喷嘴层，其中多个 喷嘴形成为对应于墨室，形成在绝缘层上的多个加热器，其加热墨室中的墨以产生气泡并通过喷嘴喷射墨;以及驱动电路区域，驱动电路形成在其上以驱动 加热器。

公开(公告)号：US07452809B2

公开(公告)日：2008-11-18

申请号：US11240771

申请日：2005-10-03

Applicant: Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

Inventor： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

IPC: H01L21/44 ,  H01R43/00

CPC classification number: B81C1/00301 ,  Y10T29/49117

Abstract: A fabrication method of a packaging substrate includes the steps of: forming a recess by etching a predetermined area of a lower surface of a substrate; depositing a seed layer on an upper surface of the substrate; in the recess, etching predetermined area(s) of the lower surface of the substrate and forming at least one via hole that reaches the seed layer; and plating the inside of the via hole by using the seed layer, and forming electrode(s) for electrically coupling the upper and lower parts of the substrate. First and second pads coupled to the electrode(s) may be formed on the upper and lower parts of the substrate, respectively. Thus, using the second pads as bonding materials, the packaging process becomes easier, which resultantly simplifies the fabrication process of the packaging substrate and the packaging process.

Abstract translation: 包装基板的制造方法包括以下步骤：通过蚀刻基板的下表面的预定区域来形成凹部; 在基板的上表面上沉积种子层; 在所述凹部中蚀刻所述基板的下表面的预定区域并形成到达所述籽晶层的至少一个通孔; 并且通过使用晶种层对通孔的内部进行电镀，以及形成用于电耦合衬底的上部和下部的电极。 分别连接到电极的第一和第二焊盘分别形成在衬底的上部和下部。 因此，使用第二焊盘作为粘合材料，封装过程变得更容易，从而简化了封装衬底的制造过程和封装过程。