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    Fabrication method of packaging substrate and packaging method using the packaging substrate
    3.
    发明授权
    Fabrication method of packaging substrate and packaging method using the packaging substrate 有权
    包装基材的包装方法和封装方法

    公开(公告)号：US07452809B2

    公开(公告)日：2008-11-18

    申请号：US11240771

    申请日：2005-10-03

    申请人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

    发明人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

    IPC分类号： H01L21/44 ,  H01R43/00

    CPC分类号： B81C1/00301 ,  Y10T29/49117

    摘要： A fabrication method of a packaging substrate includes the steps of: forming a recess by etching a predetermined area of a lower surface of a substrate; depositing a seed layer on an upper surface of the substrate; in the recess, etching predetermined area(s) of the lower surface of the substrate and forming at least one via hole that reaches the seed layer; and plating the inside of the via hole by using the seed layer, and forming electrode(s) for electrically coupling the upper and lower parts of the substrate. First and second pads coupled to the electrode(s) may be formed on the upper and lower parts of the substrate, respectively. Thus, using the second pads as bonding materials, the packaging process becomes easier, which resultantly simplifies the fabrication process of the packaging substrate and the packaging process.

    摘要翻译： 包装基板的制造方法包括以下步骤：通过蚀刻基板的下表面的预定区域来形成凹部; 在基板的上表面上沉积种子层; 在所述凹部中蚀刻所述基板的下表面的预定区域并形成到达所述籽晶层的至少一个通孔; 并且通过使用晶种层对通孔的内部进行电镀，以及形成用于电耦合衬底的上部和下部的电极。 分别连接到电极的第一和第二焊盘分别形成在衬底的上部和下部。 因此，使用第二焊盘作为粘合材料，封装过程变得更容易，从而简化了封装衬底的制造过程和封装过程。

    Fabrication method of packaging substrate and packaging method using the packaging substrate
    4.
    发明申请
    Fabrication method of packaging substrate and packaging method using the packaging substrate 有权
    包装基材的包装方法和封装方法

    公开(公告)号：US20060094158A1

    公开(公告)日：2006-05-04

    申请号：US11240771

    申请日：2005-10-03

    申请人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

    发明人： Moon-chul Lee ,  Woon-bae Kim ,  Jun-sik Hwang ,  Chang-youl Moon

    IPC分类号： H01L21/50

    CPC分类号： B81C1/00301 ,  Y10T29/49117

    摘要： A fabrication method of a packaging substrate includes the steps of: forming a recess by etching a predetermined area of a lower surface of a substrate; depositing a seed layer on an upper surface of the substrate; in the recess, etching predetermined area(s) of the lower surface of the substrate and forming at least one via hole that reaches the seed layer; and plating the inside of the via hole by using the seed layer, and forming electrode(s) for electrically coupling the upper and lower parts of the substrate. First and second pads coupled to the electrode(s) may be formed on the upper and lower parts of the substrate, respectively. Thus, using the second pads as bonding materials, the packaging process becomes easier, which resultantly simplifies the fabrication process of the packaging substrate and the packaging process.

    摘要翻译： 包装基板的制造方法包括以下步骤：通过蚀刻基板的下表面的预定区域来形成凹部; 在基板的上表面上沉积种子层; 在所述凹部中蚀刻所述基板的下表面的预定区域并形成到达所述籽晶层的至少一个通孔; 并且通过使用晶种层对通孔的内部进行电镀，以及形成用于电耦合衬底的上部和下部的电极。 分别连接到电极的第一和第二焊盘分别形成在衬底的上部和下部。 因此，使用第二焊盘作为粘合材料，封装过程变得更容易，从而简化了封装衬底的制造过程和封装过程。

    Wafer level packaging cap and fabrication method thereof
    5.
    发明授权
    Wafer level packaging cap and fabrication method thereof 有权
    晶圆级封装盖及其制造方法

    公开(公告)号：US07449366B2

    公开(公告)日：2008-11-11

    申请号：US11365838

    申请日：2006-03-02

    申请人： Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

    发明人： Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L21/4817 ,  H01L21/50 ,  H01L2924/16235

    摘要： A wafer level packaging cap for covering a device wafer with a device thereon and a fabrication method thereof are provided. The method includes operations of forming a plurality of connection grooves on a wafer, forming a seed layer on the connection grooves, forming connection parts by filling the connection grooves with a metal material, forming cap pads on a top surface of the wafer to be electrically connected to the connection parts, bonding a supporting film with the top surface of the wafer on which the cap pads are formed, forming a cavity on a bottom surface of the wafer to expose the connection parts through the cavity, and forming metal lines on the bottom surface of the wafer to be electrically connected to the connection parts.

    摘要翻译： 提供了一种用于在其上覆盖器件晶片的晶片级封装盖及其制造方法。 该方法包括在晶片上形成多个连接槽的操作，在连接槽上形成种子层，通过用金属材料填充连接槽来形成连接部分，在晶片的顶表面上形成电极盖 连接到连接部分，将支撑膜与其上形成有盖垫的晶片的顶表面接合，在晶片的底表面上形成空腔，以通过空腔露出连接部分，并在其上形成金属线 晶片的底表面电连接到连接部分。

    Wafer level package for surface acoustic wave device and fabrication method thereof
    7.
    发明申请
    Wafer level package for surface acoustic wave device and fabrication method thereof 有权
    用于表面声波器件的晶片级封装及其制造方法

    公开(公告)号：US20070096227A1

    公开(公告)日：2007-05-03

    申请号：US11415099

    申请日：2006-05-02

    申请人： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

    发明人： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

    IPC分类号： H01L29/84

    CPC分类号： H03H9/1092

    摘要： A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.

    摘要翻译： 用于声表面波器件的晶片级封装及其制造方法包括在器件晶片的上表面上形成有SAW元件的SAW器件; 接合在所述SAW元件的上部的盖晶片; 在所述盖晶片和所述SAW器件之间容纳所述SAW元件的空腔部; 帽盖，形成在盖晶片的上表面上; 以及金属线，其形成为穿透盖晶片以电连接帽垫和SAW元件，器件晶片和盖晶片由相同的材料制成。

    Wafer level packaging cap and fabrication method thereof
    8.
    发明申请
    Wafer level packaging cap and fabrication method thereof 有权
    晶圆级封装盖及其制造方法

    公开(公告)号：US20070085195A1

    公开(公告)日：2007-04-19

    申请号：US11365838

    申请日：2006-03-02

    申请人： Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

    发明人： Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Ji-hyuk Lim ,  Suk-jin Ham ,  Jun-sik Hwang ,  Chang-youl Moon

    IPC分类号： H01L23/12

    CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L21/4817 ,  H01L21/50 ,  H01L2924/16235

    摘要： A wafer level packaging cap for covering a device wafer with a device thereon and a fabrication method thereof are provided. The method includes operations of forming a plurality of connection grooves on a wafer, forming a seed layer on the connection grooves, forming connection parts by filling the connection grooves with a metal material, forming cap pads on a top surface of the wafer to be electrically connected to the connection parts, bonding a supporting film with the top surface of the wafer on which the cap pads are formed, forming a cavity on a bottom surface of the wafer to expose the connection parts through the cavity, and forming metal lines on the bottom surface of the wafer to be electrically connected to the connection parts.

    摘要翻译： 提供了一种用于在其上覆盖器件晶片的晶片级封装盖及其制造方法。 该方法包括在晶片上形成多个连接槽的操作，在连接槽上形成种子层，通过用金属材料填充连接槽来形成连接部分，在晶片的顶表面上形成电极盖 连接到连接部分，将支撑膜与其上形成有盖垫的晶片的顶表面接合，在晶片的底表面上形成空腔，以通过空腔露出连接部分，并在其上形成金属线 晶片的底表面电连接到连接部分。

    Cap wafer, semiconductor package, and fabricating method thereof
    9.
    发明申请
    Cap wafer, semiconductor package, and fabricating method thereof 审中-公开
    封装晶片，半导体封装及其制造方法

    公开(公告)号：US20060022325A1

    公开(公告)日：2006-02-02

    申请号：US11189725

    申请日：2005-07-27

    申请人： Jun-sik Hwang ,  Woon-bae Kim ,  Chang-youl Moon ,  In-sang Song

    发明人： Jun-sik Hwang ,  Woon-bae Kim ,  Chang-youl Moon ,  In-sang Song

    IPC分类号： H01L23/544

    CPC分类号： B81B7/007 ,  H01L23/04 ,  H01L2224/48463 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/16235 ,  H01L2924/00015 ,  H01L2924/00

    摘要： A cap wafer including a cavity, a packaged semiconductor including the cap wafer, and a method of fabricating the cap wafer. The cap wafer includes a cavity formed in an area of a lower surface of the cap wafer; and at least one feed-through penetrating through upper and lower surfaces of the cap wafer so as to be connected to the cavity. The packaged semiconductor includes a base wafer including an upper surface including an area in which a circuit device is formed; a cap wafer including a lower surface including an area in which a cavity having a predetermined size is formed, the cap wafer being combined with the base wafer to position the circuit device in the cavity so as to package the circuit device; and at least one feed-through penetrating through upper and lower portions of the cap wafer so as to be connected to the cavity and electrically connected to the circuit device.

    摘要翻译： 包括空腔的盖晶片，包括盖晶片的封装半导体以及制造盖晶片的方法。 盖晶片包括形成在盖晶片的下表面的区域中的空腔; 以及至少一个穿透帽盖晶片的上表面和下表面的馈通以连接到腔体。 封装半导体包括：基底晶片，其包括具有形成电路器件的区域的上表面; 包括具有形成具有预定尺寸的空腔的下表面的盖晶片，所述盖晶片与所述基底晶片组合以将所述电路器件定位在所述腔中以封装所述电路器件; 以及至少一个穿透帽盖晶片的上部和下部的馈通，以便连接到腔并电连接到电路装置。

    Micro-mirror device package and method for fabricating the same
    10.
    发明申请
    Micro-mirror device package and method for fabricating the same 审中-公开
    微镜器件封装及其制造方法

    公开(公告)号：US20070024549A1

    公开(公告)日：2007-02-01

    申请号：US11414345

    申请日：2006-05-01

    申请人： Won-kyoung Choi ,  Woon-bae Kim ,  Yong-kweun Mun ,  Chang-youl Moon ,  Sung-hee Lee

    发明人： Won-kyoung Choi ,  Woon-bae Kim ,  Yong-kweun Mun ,  Chang-youl Moon ,  Sung-hee Lee

    IPC分类号： G09G3/34

    CPC分类号： B81B7/0067 ,  B81B2201/042 ,  B81B2203/0384 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A micro-mirror device package including a micro-mirror device; a substrate, on which the micro-mirror device is mounted; and a window lid mounted on the substrate to cover the micro-mirror device. The window lid has a light transmitting part, which is sloped in relation to the micro-mirror device, and through which laser beams are transmitted to the micro-mirror device, and supporting parts downwardly extending from the light transmitting part. When a laser beam is inputted, the package separates the laser beam from noise beams, thereby improving the quality of image on a screen. By fabricating an array of window lids which correspond to micro-mirror devices, respectively, it is possible to fabricate the above-mentioned micro-mirror device package through a batch process performed in terms of a wafer size.

    摘要翻译： 一种包括微镜装置的微镜装置封装; 其上安装有微镜装置的基板; 以及安装在基板上以覆盖微镜装置的窗口盖。 窗口盖具有相对于微镜装置倾斜的透光部，激光束通过该透光部透射到微镜装置，以及从透光部向下延伸的支撑部。 当输入激光束时，封装将激光束与噪声光束分离，从而提高了屏幕上的图像质量。 通过分别制造对应于微镜装置的窗口阵列，可以通过以晶片尺寸执行的批处理来制造上述微镜器件封装。