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公开(公告)号:US11084283B2
公开(公告)日:2021-08-10
申请号:US16676070
申请日:2019-11-06
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor: Domenico Giusti , Marco Ferrera , Carlo Luigi Prelini , Simon Dodd
Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
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公开(公告)号:US11081778B2
公开(公告)日:2021-08-03
申请号:US16123908
申请日:2018-09-06
Applicant: STMicroelectronics, Inc.
Inventor: Pierre Rizzo , Christophe Henri Ricard
Abstract: A method and apparatus for performing a low-power presence check are provided. In the method and apparatus, a controller detects a presence of a tag by at least causing the antenna to generate a magnetic field over a first time period for detecting the tag, measuring an antenna voltage over a second time period, causing the antenna to cease generating a magnetic field over a third time period longer than the first time period and comparing the antenna voltage to an antenna reference voltage to determine whether the tag is present. The controller detects the presence of the tag in response to receiving a command from a host device for performing the low-power presence check. The command may be a one-time command for every presence check stage or a command that is repeatedly received each time the controller detects the presence of the tag.
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公开(公告)号:US20210191755A1
公开(公告)日:2021-06-24
申请号:US16721331
申请日:2019-12-19
Applicant: STMicroelectronics, Inc.
Inventor: Karimuddin SAYED , Ashish BHARGAVA , Chandandeep Singh PABLA , Mahesh CHOWDHARY
Abstract: Systems, methods and devices are provided to improve management and accuracy of timestamps associated with sensor-based data. An indication is received of a sensor event associated with data samples provided from a sensor having an output data rate. A respective timestamp is assigned to each of the data samples. Assigning the respective timestamp may include, responsive to a determination that the indicated event is an interrupt event, calculating an actual data sampling interval based at least in part on time intervals between previous sensor events and a on a quantity of the one or more data samples. Assigning the respective timestamp may alternatively include, responsive to a determination that the event type is a data flush event, assigning the respective timestamp based on an actual data sampling interval associated with one or more previous sensor events if the actual data sampling interval has been previously stored, and otherwise assigning the respective timestamp based at least in part on the output data rate. Correction logic and drift compensation may be applied to the assigned respective timestamps.
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公开(公告)号:US20210190640A1
公开(公告)日:2021-06-24
申请号:US16719004
申请日:2019-12-18
Applicant: STMicroelectronics, Inc.
Inventor: Cheng PENG , Xiaoyong YANG
IPC: G01M99/00 , G01S17/58 , G01S7/4865
Abstract: Disclosed herein is a system for detecting rotational speed and early failures of an electronic device. The system includes a rotating disk affixed to a rotating shaft of the electronic device. The rotating disk has projections extending from its periphery. A time of flight ranging system determines distance to the projections extending from the rotating disk. Processing circuitry determines a rotational speed of the rotating shaft from the determined distances to the projections extending from the rotating disk, and detects whether the electronic device is undergoing an early failure from the determined distances to the projections extending from the rotating disk. Rotational speed is determined from the time between successive peaks in the determined distances, and early failures (for example, due to wobble of the shaft) are determined where the peaks vary unexpectedly in magnitude.
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公开(公告)号:US11037864B2
公开(公告)日:2021-06-15
申请号:US16264824
申请日:2019-02-01
Applicant: STMicroelectronics, Inc.
Inventor: Rennier Rodriguez , Maiden Grace Maming , Jefferson Talledo
IPC: H01L23/495 , H01L21/48 , H01L23/00
Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.
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公开(公告)号:US11031350B2
公开(公告)日:2021-06-08
申请号:US16223582
申请日:2018-12-18
Applicant: STMICROELECTRONICS, INC.
Inventor: Jefferson Talledo
IPC: H01L23/00 , H01L23/31 , H01L23/495 , H01L21/56 , H01L21/48
Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.
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公开(公告)号:US11004776B2
公开(公告)日:2021-05-11
申请号:US15912193
申请日:2018-03-05
Applicant: STMicroelectronics, Inc.
Inventor: Jefferson Talledo , Rammil Seguido
IPC: H01L23/495 , H01L23/48 , H01L23/52 , H01L23/00 , H01L21/56 , H01L23/498 , H01L23/31
Abstract: A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to the circuit board. The semiconductor device may include an IC mounted on the IC die pad, bond wires coupling the circuit board with the IC, and encapsulation material surrounding the IC, the bond wires, and the arms.
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公开(公告)号:US20210111109A1
公开(公告)日:2021-04-15
申请号:US17131222
申请日:2020-12-22
Applicant: STMICROELECTRONICS, INC.
Inventor: Rennier RODRIGUEZ , Aiza Marie AGUDON , Maiden Grace MAMING
IPC: H01L23/495 , H01L23/64
Abstract: The present disclosure is directed to a flat no-lead semiconductor package with a surfaced mounted structure. An end portion of the surface mounted structure includes a recessed member so that the surface mounted structure is coupled to leads of the flat no-lead semiconductor package through, among others, the sidewalls of the recessed members.
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公开(公告)号:US20210103345A1
公开(公告)日:2021-04-08
申请号:US17122999
申请日:2020-12-15
Applicant: STMICROELECTRONICS S.r.l. , STMICROELECTRONICS, INC.
Inventor: Stefano Paolo Rivolta , Mahaveer Jain , Ashish Bhargava
IPC: G06F3/0346 , G06F3/0487
Abstract: Digital signal processing circuitry, in operation, determines, based on accelerometer data, a carry-position of a device. Double-tap detection parameters are set using the determined carry-position. Double-taps are detected using the set double-tap detection parameters. In response to detection of a double-tap, control signals, such as a flag or an interrupt signal, are generated and used to control operation of the device. For example, a device may enter a wake mode of operation in response to detection of a double-tap.
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公开(公告)号:US10964551B2
公开(公告)日:2021-03-30
申请号:US15085678
申请日:2016-03-30
Applicant: STMicroelectronics, Inc.
Inventor: John H. Zhang
IPC: H01L21/67 , H01L21/677 , H01L21/321 , B24B37/005 , H01L21/02 , H01L21/66
Abstract: CMP selectivity, removal rate, and uniformity are controlled both locally and globally by altering electric charge at the wafer surface. Surface charge characterization is performed by an on-board metrology module. Based on a charge profile map, the wafer can be treated in an immersion bath to impart a more positive or negative charge overall, or to neutralize the entire wafer before the CMP operation is performed. If charge hot spots are detected on the wafer, a charge pencil can be used to neutralize localized areas. One type of charge pencil bears a tapered porous polymer tip that is placed in close proximity to the wafer surface. Films present on the wafer absorb ions from, or surrender ions to, the charge pencil tip, by electrostatic forces. The charge pencil can be incorporated into a CMP system to provide an in-situ treatment prior to the planarization step or the slurry removal step.
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