公开(公告)号：US07773930B2

公开(公告)日：2010-08-10

申请号：US11839029

申请日：2007-08-15

Applicant: Su-ho Shin ,  Hwan-guem Kim ,  Dong-jin Seol ,  Dong-woo Lee ,  Tae-gyu Kim ,  Chang-hoon Jung

Inventor： Su-ho Shin ,  Hwan-guem Kim ,  Dong-jin Seol ,  Dong-woo Lee ,  Tae-gyu Kim ,  Chang-hoon Jung

IPC: G03G15/20

CPC classification number: G03G15/2064 ,  G03G2215/2035

Abstract: A fixing device includes a fixing roller, a fixing belt which is made to rotate by a rotation force received from the fixing roller, a nip forming unit to form a nip zone at a contact area between the fixing roller and the fixing belt, and a first heating unit, which is separated from the nip zone, to apply heat to the fixing belt. The nip zone and the heating unit are separated, so that the heating unit can be prevented from being broken as a result of the pressurization and thermal deformation.

Abstract translation: 定影装置包括定影辊，通过由定影辊接收的旋转力旋转的定影带，在定影辊和定影带之间的接触区域处形成压区的辊隙形成单元，以及 第一加热单元，其从夹持区域分离，以向定影带施加热量。 夹持区域和加热单元被分离，从而可以防止加热单元由于加压和热变形而破裂。

公开(公告)号：US07769333B2

公开(公告)日：2010-08-03

申请号：US11934913

申请日：2007-11-05

Applicant: Su-ho Shin ,  Tae-hoon Kim ,  Dong-woo Lee ,  Tae-gyu Kim

Inventor： Su-ho Shin ,  Tae-hoon Kim ,  Dong-woo Lee ,  Tae-gyu Kim

IPC: G03G15/20

CPC classification number: G03G15/2053 ,  G03G2215/2038

Abstract: A fusing device includes a pressing member, a belt member to rotate in contact with the pressing member, a nip forming member to support the belt member so that nip areas are formed on the pressing member and the belt member at contacting portions thereto, a heating member disposed away from the nip areas, to heat the belt member, and a tension application member to stiffen the belt member so that the heating member is tightly contacted with the belt member. The heating member includes a plate type heating element which is arranged at an upstream side of the nip areas, and to contact an inner circumference of the belt member, in an advancing direction of the fusing belt. The effective width of then nip areas increases, and the increased pressure is exerted to the nip areas, because the fusing belt enters a location where the nip areas are formed in a heated state. Furthermore, heating efficiency of the fusing belt is increased, because the fusing belt is heated while in a tight contact with the heating member. As a result, fusing performance is enhanced.

Abstract translation: 定影装置包括按压构件，与按压构件接触旋转的带构件，夹持形成构件，用于支撑带构件，使得压区在压接构件和带构件之间在接触部分处形成，加热 远离辊隙区域的构件，以加热带构件;以及张力施加构件，用于加固带构件，使得加热构件与带构件紧密接触。 加热构件包括板状加热元件，其布置在夹持区域的上游侧，并且在定影带的前进方向上接触带构件的内周。 因此，夹紧区域的有效宽度增加，并且增加的压力被施加到辊隙区域，因为定影带进入压区在加热状态下形成的位置。 此外，由于在与加热构件紧密接触的同时加热定影带，因此定影带的加热效率提高。 结果，融合性能得到提高。

公开(公告)号：US20100059846A1

公开(公告)日：2010-03-11

申请号：US12553638

申请日：2009-09-03

Applicant: TAE GYU KIM

Inventor： TAE GYU KIM

IPC: H01L31/0224 ,  H01L31/18 ,  H01L21/768 ,  G03F7/20

CPC classification number: H01L27/14636 ,  H01L27/14689

Abstract: Provided are image sensors and methods of manufacturing the same. An image sensor includes a metal line and an interlayer insulation layer on a semiconductor substrate including a readout circuit; an image detection unit on the interlayer insulation layer and including stacked first and second doping layers; a pixel separation unit penetrating the image detection unit, separating the image detection unit by pixel; a first metal contact penetrating the image detection unit and the interlayer insulation layer to contact the metal line; a first barrier pattern protecting the first metal contact from contacting the second doping layer, while exposing the first metal contact to the first doping layer; and a second metal contact in a trench above the first metal contact, wherein the second metal contact is electrically connected to the second doping layer while being isolated from the first metal contact by a second barrier pattern.

Abstract translation: 提供图像传感器及其制造方法。 图像传感器包括在包括读出电路的半导体衬底上的金属线和层间绝缘层; 层间绝缘层上的图像检测单元，并且包括层叠的第一和第二掺杂层; 穿透图像检测单元的像素分离单元，逐像素分离图像检测单元; 穿过图像检测单元和层间绝缘层以接触金属线的第一金属接触; 第一阻挡图案保护第一金属接触不与第二掺杂层接触，同时将第一金属接触暴露于第一掺杂层; 以及在所述第一金属触点上方的沟槽中的第二金属触点，其中所述第二金属触点电连接到所述第二掺杂层，同时通过第二阻挡图案与所述第一金属触点隔离。

公开(公告)号：US20100029032A1

公开(公告)日：2010-02-04

申请号：US12508345

申请日：2009-07-23

Applicant: Tae Gyu Kim

Inventor： Tae Gyu Kim

IPC: H01L31/18 ,  H01L31/14 ,  H01L31/02

CPC classification number: H01L27/14632 ,  H01L27/14609 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687

Abstract: A method for fabricating an image sensor is provided. In the image sensor fabrication method, an interconnection and a dielectric interlayer are formed on a semiconductor substrate including a readout circuit. An image sensing unit is formed on a carrier substrate of one side of a dielectric layer. The carrier substrate and the dielectric interlayer are bonded to each other. The dielectric layer and the carrier substrate are removed to leave the image sensing unit on the dielectric interlayer.

Abstract translation: 提供了一种用于制造图像传感器的方法。 在图像传感器制造方法中，在包括读出电路的半导体衬底上形成互连和电介质中间层。 在电介质层的一侧的载体基板上形成图像感测单元。 载体基板和电介质中间层彼此结合。 去除电介质层和载体衬底，以将图像感​​测单元留在电介质中间层上。

公开(公告)号：US20100025800A1

公开(公告)日：2010-02-04

申请号：US12508312

申请日：2009-07-23

Applicant: Tae Gyu Kim

Inventor： Tae Gyu Kim

IPC: H01L31/0224

CPC classification number: H01L27/14634 ,  H01L27/14603

Abstract: An image sensor having greatly improved physical and electrical bonding forces between a photodiode and a substrate, and a manufacturing method thereof. The image sensor includes a semiconductor substrate and readout circuitry, a dielectric layer on the semiconductor substrate, a metal line in the dielectric layer, electrically connected with the readout circuitry, an image sensing device including first and second impurity regions on the dielectric layer, a via hole through the dielectric layer and the image sensing device, a hard mask in the via hole, and a lower electrode in the via hole to connect the first impurity region with the metal line.

Abstract translation: 具有极大地改善光电二极管和基板之间的物理和电接合力的图像传感器及其制造方法。 图像传感器包括半导体衬底和读出电路，半导体衬底上的电介质层，电介质层中与读出电路电连接的金属线，在电介质层上包括第一和第二杂质区的图像感测装置， 穿过介电层和图像感测装置的通孔，通孔中的硬掩模和通孔中的下电极，以将第一杂质区与金属线连接。

公开(公告)号：US20080138131A1

公开(公告)日：2008-06-12

申请号：US11927758

申请日：2007-10-30

Applicant: Chang Hoon JUNG ,  Tae-Gyu KIM ,  Hwan Guem KIM ,  Su Ho SHIN

Inventor： Chang Hoon JUNG ,  Tae-Gyu KIM ,  Hwan Guem KIM ,  Su Ho SHIN

IPC: G03G15/20

CPC classification number: G03G15/2039 ,  G03G2215/2016 ,  G03G2215/2035

Abstract: A fusing device and an image forming apparatus including the fusing device fuses a toner image formed on a printing paper. The fusing device includes a pressure roller which axially rotates, a fusing belt which forms a nip portion with the pressure roller where a printing paper is nipped, and which rotates by a rotational force transmitted from the pressure roller, a heater supplied with a power source to generate heat and to transmit at least a portion of the generated heat to the nip portion, and a phase changing portion which includes a material having a phase varying in a heating temperature range of the heater, accumulates latent heat from heat of the heater, and provides the nip portion with the accumulated latent heat.

Abstract translation: 定影装置和包括定影装置的图像形成装置使形成在打印纸上的调色剂图像融合。 定影装置包括轴向旋转的压力辊，与打印纸被夹持的压力辊形成压合部并且由从压力辊传递的旋转力旋转的定影带，配备有电源的加热器 产生热量并将所产生的热量的至少一部分传递到夹持部分，并且包括在加热器的加热温度范围内变化的相变材料的相变部分累积来自加热器的热量的潜热， 并且向夹持部提供累积的潜热。

公开(公告)号：US07377776B2

公开(公告)日：2008-05-27

申请号：US11318539

申请日：2005-12-28

Applicant: Jin-sung Lee ,  Dong-woo Lee ,  Tae-gyu Kim ,  Tae-sang Park ,  Bang-weon Lee ,  Jong-kill Lim ,  Chang-hoon Jung ,  Sang-kwon Wee

Inventor： Jin-sung Lee ,  Dong-woo Lee ,  Tae-gyu Kim ,  Tae-sang Park ,  Bang-weon Lee ,  Jong-kill Lim ,  Chang-hoon Jung ,  Sang-kwon Wee

IPC: H05B3/68

CPC classification number: H01L21/67109 ,  F27B5/04 ,  F27B5/14 ,  F27B17/0025

Abstract: A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

Abstract translation: 半导体晶片烘烤装置包括热板，上部开口的容器和覆盖容器的上部的盖。 该盖包括在其间形成气体循环空间的上板，下板和侧壁。 在侧壁中形成至少一个气体入口，在下板的中心区域形成有多个气体供给孔，并且在其上形成有排气单元的裙部联接到盖的下边缘。

公开(公告)号：US20060174836A1

公开(公告)日：2006-08-10

申请号：US11267406

申请日：2005-11-07

Applicant: Bang-weon Lee ,  Tae-gyu Kim ,  Jin-sung Lee ,  Dong-woo Lee ,  Tae-sang Park ,  Chang-hoon Jung ,  Sang-kwon Wee

Inventor： Bang-weon Lee ,  Tae-gyu Kim ,  Jin-sung Lee ,  Dong-woo Lee ,  Tae-sang Park ,  Chang-hoon Jung ,  Sang-kwon Wee

IPC: C23C16/00 ,  H05B3/68

CPC classification number: H01L21/67103 ,  H05B3/143

Abstract: An apparatus for heating a wafer includes a hot plate, formed of, for example, ceramic, which heats the wafer mounted thereon, a case supporting the hot plate, and a fixing unit fixing the hot plate to the case that is located under the hot plate. The fixing unit may include a ball for contacting and pressing the hot plate, and an elastic spring which presses the ball and which compresses when the hot plate expands thermally.

Abstract translation: 用于加热晶片的装置包括由例如陶瓷形成的加热板，其加热安装在其上的晶片，支撑热板的壳体和将热板固定到位于热的下方的壳体的固定单元 盘子。 固定单元可以包括用于接触和按压加热板的球，以及当热板热膨胀时挤压球并且压缩的弹性弹簧。

公开(公告)号：US20050284362A1

公开(公告)日：2005-12-29

申请号：US11157522

申请日：2005-06-21

Applicant: Tae-Gyu Kim ,  Tae-Sang Park

Inventor： Tae-Gyu Kim ,  Tae-Sang Park

IPC: B05C11/02 ,  B05C13/00 ,  H01L21/00 ,  H01L21/687

CPC classification number: H01L21/68735 ,  H01L21/6715

Abstract: A substrate surface processing apparatus is provided. In the substrate surface processing apparatus, a spin chuck holds a substrate thereon by suction, spins the substrate, and moves up and down the substrate. An upper bowl and a lower bowl surround the spin chuck for receiving a processing solution by which the surface of the substrate is processed. An air outlet is positioned under the lower bowl for exhausting air from the upper and lower bowls. A flow separation protrusion is formed within the upper bowl. It separates an air flow around the substrate into an upward air flow and a downward air flow and exhausts the downward air flow through the air outlet.

Abstract translation: 提供了一种基板表面处理装置。 在基板表面处理装置中，旋转卡盘通过抽吸将基板保持在其上，旋转基板，并且在基板上上下移动。 上碗和下碗围绕旋转卡盘，用于接收处理溶液，通过该处理溶液处理基材的表面。 空气出口位于下碗下面，用于从上碗和下碗排出空气。 在上碗中形成流动分离突起。 它将基板周围的空气流分离成向上的空气流和向下的空气流，并排出通过出气口的向下空气流。

公开(公告)号：US20050280681A1

公开(公告)日：2005-12-22

申请号：US11058279

申请日：2005-02-16

Applicant: Tae-gyu Kim ,  Dong-woo Lee ,  Jin-sung Lee ,  Tae-sang Park ,  Bang-weon Lee

Inventor： Tae-gyu Kim ,  Dong-woo Lee ,  Jin-sung Lee ,  Tae-sang Park ,  Bang-weon Lee

IPC: H01L21/324 ,  B05B7/04 ,  B41J2/04 ,  H01L21/00 ,  H01L21/02

CPC classification number: H01L21/67109 ,  B05B7/0441

Abstract: Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.

Abstract translation: 提供一种热处理装置。 热处理装置包括：加热板，包括加热器; 包括冷却室的室壳体，并且联接到所述加热板的下部; 以及至少一个雾化单元，其安装在所述室壳体上以通过混合冷却液体和气体而产生液滴气溶胶，同时将所述液滴气溶胶喷射到所述冷却室中。