Process of fabricating high resistance CMOS resistor
    32.
    发明申请
    Process of fabricating high resistance CMOS resistor 有权
    制造高电阻CMOS电阻的工艺

    公开(公告)号:US20050227430A1

    公开(公告)日:2005-10-13

    申请号:US10823238

    申请日:2004-04-12

    CPC classification number: H01L28/20 H01L27/0629 H01L27/0802

    Abstract: A process of forming a high resistance CMOS resistor with a relatively small die size is provided. According to an aspect of the present invention, the process of fabricating a high resistance resistor is a standard CMOS process that does not require any additional masking. An n-well is firstly formed in a p-type silicon substrate. A nitride film is then deposited and patterned to form a patterned mask layer. The patterned mask layer serves as a mask. A p-field region is formed in the n-well to form a CMOS resistor. The CMOS resistor according to the present invention has a resistance of 10 kΩ-20 kΩ per square.

    Abstract translation: 提供了形成具有相对小的管芯尺寸的高电阻CMOS电阻器的工艺。 根据本发明的一个方面,制造高电阻电阻器的过程是不需要额外掩蔽的标准CMOS工艺。 首先在p型硅衬底中形成n阱。 然后沉积和图案化氮化物膜以形成图案化掩模层。 图案化掩模层用作掩模。 在n阱中形成p场区以形成CMOS电阻。 根据本发明的CMOS电阻器具有10kOmega-20kOmega每平方的电阻。

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