公开(公告)号：US20080087902A1

公开(公告)日：2008-04-17

申请号：US11721803

申请日：2005-10-25

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L33/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US06463000B2

公开(公告)日：2002-10-08

申请号：US09950263

申请日：2001-09-10

Applicant: Young Ju Lee ,  Jeung Joo Lim

Inventor： Young Ju Lee ,  Jeung Joo Lim

IPC: G11C700

CPC classification number: G06F5/14 ,  G11C7/1018

Abstract: A FIFO memory device includes a write address generating circuit generating a write address in response to a write clock signal and a read address generating circuit generating a read address in response to a read clock signal. A memory cell array includes a plurality of memory cells arranged between a plurality of write and read word lines and a plurality of write and read bit lines, the memory cell array storing write data in response to the write address and outputting read data in response to the read address. A flag signal generating circuit compares a next write address with a current read address to generate a full flag signal in response to the write clock signal when the next write address and the current read address are equal, and compares a current write address with a next read address to generate an empty flag signal in response to the read clock signal when the current write address and the next read address are equal.

Abstract translation: FIFO存储器件包括响应于写时钟信号产生写地址的写地址产生电路和响应于读时钟信号产生读地址的读地址产生电路。 存储单元阵列包括布置在多个写入和读取字线和多个写入和读取位线之间的多个存储器单元，所述存储单元阵列响应于所述写入地址存储写入数据，并且响应于 读地址。 当下一个写入地址和当前读取地址相等时，标志信号发生电路将下一个写入地址与当前读取地址进行比较，以响应写入时钟信号产生一个满标志信号，并将当前写入地址与下一个写入地址进行比较 读取地址以在当前写入地址和下一个读取地址相等时响应于读取时钟信号而产生空白标志信号。

公开(公告)号：US20120299783A1

公开(公告)日：2012-11-29

申请号：US13482453

申请日：2012-05-29

Applicant: Young-ju LEE ,  Byung-chul KIM ,  Jung-min PARK

Inventor： Young-ju LEE ,  Byung-chul KIM ,  Jung-min PARK

IPC: H01Q1/38

CPC classification number: H01Q1/36 ,  H01Q1/2291 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q9/0414

Abstract: An antenna structure includes: a substrate; a ground layer disposed on a first surface of the substrate; a patch antenna unit which is disposed on a second surface of the substrate opposite to the first surface of the substrate, and is configured to receive a signal to be radiated; and a three-dimensional (3D) antenna unit which comprises a shorting leg that is shorted with the patch antenna unit, and is configured to radiate the signal received by the patch antenna unit.

Abstract translation: 天线结构包括：基板; 设置在所述基板的第一表面上的接地层; 贴片天线单元，设置在与基板的第一表面相对的基板的第二表面上，并且被配置为接收要辐射的信号; 以及三维（3D）天线单元，其包括与所述贴片天线单元短路的短路支路，并且被配置为辐射由所述贴片天线单元接收的信号。

公开(公告)号：US20110233574A1

公开(公告)日：2011-09-29

申请号：US13152566

申请日：2011-06-03

Applicant: Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

Inventor： Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

IPC: H01L33/60

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US07838891B2

公开(公告)日：2010-11-23

申请号：US12766656

申请日：2010-04-23

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/18 ,  H01L23/48 ,  H01L33/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US07723736B2

公开(公告)日：2010-05-25

申请号：US11721803

申请日：2005-10-25

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/18 ,  H01L23/48 ,  H01L33/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

公开(公告)号：US07515707B2

公开(公告)日：2009-04-07

申请号：US11084433

申请日：2005-03-18

Applicant: Sung-Hyun Ka ,  Young-Ju Lee ,  Hochan Song

Inventor： Sung-Hyun Ka ,  Young-Ju Lee ,  Hochan Song

IPC: H04M1/00 ,  H04M9/00 ,  E05D3/06

CPC classification number: H04M1/0237 ,  G06F1/1616 ,  G06F1/1624 ,  G06F1/1679 ,  G06F1/1681 ,  G06F1/1683 ,  H04B1/3833 ,  H04M1/0216 ,  H04M1/022 ,  Y10T16/547

Abstract: A portable apparatus of the present invention comprises a first unit, a second unit, and a hinge device that is coupled to the first and second units such that the units can be moved to be in contact with or spaced apart from each other and allows relative sliding movement between the first and second units within a certain range. The hinge device exerts a force in a direction in which the first and second units are spaced apart from each other, through the relative sliding movement by a predetermined distance between the two units in the complete contact state of the first and second units.

Abstract translation: 本发明的便携式设备包括第一单元，第二单元和铰链装置，其联接到第一和第二单元，使得单元可以移动成彼此接触或间隔开，并且允许相对 第一和第二单元之间的滑动运动在一定范围内。 在第一和第二单元的完全接触状态下，铰链装置通过两个单元之间的相对滑动移动预定距离，沿着第一和第二单元彼此间隔开的方向施加力。