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    HEAD MOUNTABLE DISPLAY
    31.
    发明申请
    HEAD MOUNTABLE DISPLAY 有权

    公开(公告)号：US20240385452A1

    公开(公告)日：2024-11-21

    申请号：US18478463

    申请日：2023-09-29

    Applicant: Apple Inc.

    Inventor： Aidan N. Zimmerman ,  Jessica L. Ong ,  Matin Seadat Beheshti ,  Kristina A. Babiarz

    IPC: G02B27/01

    Abstract: A head-mountable display device can include a structural frame, where a first mounting bracket can be coupled to a first side of the structural frame. In some examples, the first mounting structure can include a cantilever arm. A second mounting bracket can be coupled to a second side of the structural frame opposite the first side, where the second mounting bracket can include a mounting arm, a sensor coupled to the cantilever arm, and a display assemble slidably coupled to the mounting arm.

    Electronic devices having infrared-transparent antireflection coatings
    34.
    发明授权
    Electronic devices having infrared-transparent antireflection coatings 有权

    公开(公告)号：US10890700B2

    公开(公告)日：2021-01-12

    申请号：US16566627

    申请日：2019-09-10

    Applicant: Apple Inc.

    Inventor： Stephen C. Cool ,  Li Zhang ,  Avery P. Yuen ,  Kristina A. Babiarz

    IPC: G02B5/20 ,  G02B5/28 ,  G02B1/115

    Abstract: An electronic device may have a display cover layer provided with an infrared-transparent antireflection coating. A pixel array may emit visible light through the cover layer and the coating. An infrared emitter may emit infrared light and an infrared sensor may receive infrared light through the coating and the cover layer. The coating may include a stack of thin-film interference layers. The stack may include alternating lower and higher refractive index layers. The layers may have thicknesses and materials that configure the coating to exhibit an infrared transmittance of greater than 94% from 920 nm to 960 nm and a photopic reflectance of less than 1.5%. The coating may reflect visible light to prevent displayed images from being obscured by visible reflections. At the same time, some photopic reflectance of the coating may be sacrificed to maximize infrared transmittance and accommodate operation by the infrared emitter and sensor.

    Force sensing of inputs through strain analysis
    35.
    发明授权
    Force sensing of inputs through strain analysis 有权

    公开(公告)号：US10275068B2

    公开(公告)日：2019-04-30

    申请号：US15933113

    申请日：2018-03-22

    Applicant: Apple Inc.

    Inventor： Storrs T. Hoen ,  Kristina A. Babiarz ,  Miguel C. Christophy ,  Romain A. Teil ,  Sinan Filiz ,  Vivek Katiyar

    IPC: G06F3/041 ,  G06F3/0488

    Abstract: An electronic device has a force sensor that determines a measure of applied force from a user contacting a cover glass of the device. In one embodiment, a frame at least partially encloses an interior of the electronic device and has an open end. A cover glass covers the open end of the frame and is movably connected to the frame to allow movement of the cover glass in response to one or more forces applied to an external surface of the cover glass. A plurality of strain probes is positioned under the cover glass, between the cover glass and the frame, and is arranged to output a plurality of strain signals response to the one or more forces applied to the cover glass. A force processing module is configured to at least calculate an amount of force applied to the cover glass based on the plurality of strain signals.

    Methods for Assembling Devices Using Pressure Indicator Adhesives
    38.
    发明申请
    Methods for Assembling Devices Using Pressure Indicator Adhesives 有权
    使用压力指示器粘合剂组装设备的方法

    公开(公告)号：US20140138011A1

    公开(公告)日：2014-05-22

    申请号：US13679699

    申请日：2012-11-16

    Applicant: APPLE INC.

    Inventor： Stephen R. McClure ,  Derek W. Wright ,  Carl R. Peterson ,  Kristina A. Babiarz

    IPC: B32B37/12 ,  G01D11/00

    CPC classification number: G01D11/00 ,  C08K9/10 ,  C09J5/00 ,  C09J7/38 ,  C09J11/02 ,  C09J2205/11 ,  C09J2400/143 ,  C09J2400/163

    Abstract: Pressure indicator pressure sensitive adhesive may contain microspheres that burst and release indicator when subjected to pressure and thereby produce a detectable indication of how much pressure has been applied when forming an adhesive joint between opposing structures. Electronic device structures can be assembled using the pressure indicator pressure sensitive adhesive. A camera or other sensor may monitor joint formation. The camera can gather infrared image data, visible light image data, or ultraviolet light image data. Sensor data such as magnetic or ultrasonic sensor data can also be collected on an adhesive joint. Joint inspection can be performed on test structures and production structures and corresponding adjustments made to the joint formation process. Positioners and other equipment that compresses the pressure indicator pressure sensitive adhesive can be adjusted in real time or calibrated using information about the condition of the pressure indicator pressure sensitive adhesive.

    Abstract translation: 压力指示器压敏粘合剂可能含有微球，当经受压力时，其突发和释放指示器，从而产生在形成相对结构之间的粘合剂接头时施加了多少压力的可检测指示。 可以使用压力指示器压敏粘合剂组装电子装置结构。 照相机或其他传感器可能会监视关节的形成。 相机可以收集红外图像数据，可见光图像数据或紫外光图像数据。 诸如磁性或超声波传感器数据的传感器数据也可以在粘合剂接头上收集。 可以对试验结构和生产结构进行联合检查，并对联合形成过程进行相应的调整。 压缩压力指示器压敏粘合剂的定位器和其他设备可以实时调整或使用关于压力指示器压敏粘合剂状况的信息进行校准。

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