Reconfigurable bi-stable device
    31.
    发明授权
    Reconfigurable bi-stable device 有权
    可重构双稳态器件

    公开(公告)号:US08853916B2

    公开(公告)日:2014-10-07

    申请号:US13250317

    申请日:2011-09-30

    摘要: A reconfigurable bi-stable device includes an elastically deformable panel laterally disposed between and connected to one or more mounting members directly or indirectly connected to opposing ends of the panel, with the panel maintained under compressive force along at least one vector extending between the opposing ends. The compressive force deforms the panel into a one of two stable deformed positions, with the device disposed such that the panel may be moved between each of the two stable deformed positions by application of manual force to one of two opposing faces of the panel. A first shape memory alloy (SMA) or piezo actuator member is connected to the panel, the actuator member being capable of moving the panel from a first one of the two stable deformed positions to a second one of the two stable deformed positions.

    摘要翻译: 可重构双稳态装置包括横向设置在直接或间接连接到面板的相对端的一个或多个安装构件之间并且连接到面板的相对端部之间并连接到面板的相对端部的弹性变形板,其中面板沿着在相对端之间延伸的至少一个矢量保持在压缩力 。 压缩力使面板变形为两个稳定的变形位置之一,其中该装置设置成使得面板可以通过对面板的两个相对面之一施加手动力而在两个稳定的变形位置中的每一个之间移动。 第一形状记忆合金(SMA)或压电致动器构件连接到面板,致动器构件能够将面板从两个稳定变形位置中的第一个移动到两个稳定变形位置中的第二个。

    Composite Bi-Stable Device
    33.
    发明申请
    Composite Bi-Stable Device 有权
    复合双稳态器件

    公开(公告)号:US20130081389A1

    公开(公告)日:2013-04-04

    申请号:US13250248

    申请日:2011-09-30

    IPC分类号: F01B29/10

    摘要: A deformable bi-stable device includes an elastically deformable member having at least two stable configurations and capable of being deformed from a first stable configuration to a second stable configuration, the element passing through an unstable configuration as it is deformed from the first stable configuration to the second stable configuration, and a shape memory polymer layer on or in the elastically deformable member. A method of using this device includes heating the shape memory polymer to a temperature sufficient to reduce the modulus of the shape memory polymer, deforming the deformable member to move from one of the first and second stable configurations to another of the first and second stable configurations, and cooling the device to a temperature sufficient to increase the modulus of the shape memory polymer.

    摘要翻译: 一种可变形的双稳态装置包括具有至少两个稳定构造并且能够从第一稳定构型变形到第二稳定构型的可弹性变形构件,该元件在从第一稳定构型变形时穿过不稳定构型, 第二稳定构型和可弹性变形构件上或其中的形状记忆聚合物层。 使用该装置的方法包括将形状记忆聚合物加热到足以降低形状记忆聚合物的模量的温度,使可变形构件变形从第一和第二稳定构型中的一个移动到第一和第二稳定构型中的另一个 ,并将该装置冷却到足以增加形状记忆聚合物的模量的温度。

    Method of controlling a thermal energy harvesting system
    35.
    发明授权
    Method of controlling a thermal energy harvesting system 有权
    控制热能收集系统的方法

    公开(公告)号:US09038379B2

    公开(公告)日:2015-05-26

    申请号:US12908191

    申请日:2010-10-20

    IPC分类号: F01B29/10 F03G7/06

    CPC分类号: F01B29/10 F03G7/065

    摘要: A method of controlling an energy harvesting system that converts excess thermal energy into mechanical energy and includes a Shape Memory Alloy (SMA) member, includes obtaining current operational parameters of the energy harvesting system, such as a maximum temperature, a minimum temperature and a cycle frequency of the SMA member. The current operational parameters are compared to a target operating condition of the energy harvesting system to determine if the current operational parameters are within a pre-defined range of the target operating condition. If the current operational parameters are not within the pre-defined range of the target operating condition, then a heat transfer rate to, a heat transfer rate from or a cycle frequency of the SMA member is adjusted to maintain operation of the energy harvesting system within the pre-defined range of the target operating condition to maximize efficiency of the energy harvesting system.

    摘要翻译: 一种控制能量收集系统的方法,其将过剩的热能转换成机械能并且包括形状记忆合金(SMA)构件,包括获得能量收集系统的当前操作参数,例如最高温度,最低温度和循环 SMA部件的频率。 将当前操作参数与能量收集系统的目标操作条件进行比较,以确定当前操作参数是否在目标操作条件的预定义范围内。 如果当前的操作参数不在目标操作条件的预定范围内,则调整传热速率,从SMA构件的传热速率或循环频率,以维持能量收集系统的运行 目标操作条件的预定义范围,以最大限度地提高能量收集系统的效率。

    COOLING SYSTEM
    38.
    发明申请
    COOLING SYSTEM 有权
    冷却系统

    公开(公告)号:US20110121582A1

    公开(公告)日:2011-05-26

    申请号:US12947857

    申请日:2010-11-17

    IPC分类号: F03G7/06 F28D15/00 H02K7/18

    CPC分类号: F03G7/06

    摘要: A cooling system configured for converting thermal energy to mechanical energy includes a source of thermal energy provided by a temperature difference between a heat source having a first temperature and a coolant having a second temperature that is lower than the first temperature. The cooling system includes a cooling circuit configured for conveying the coolant to and from the heat source. The cooling circuit includes a conduit and a pump in fluid communication with the conduit and configured for delivering the coolant to the heat source. The cooling system also includes a heat engine disposed in thermal relationship with the conduit and configured for converting thermal to mechanical energy. The heat engine includes a first element formed from a first shape memory alloy having a crystallographic phase changeable between austenite and martensite at a first transformation temperature in response to the temperature difference between the heat source and coolant.

    摘要翻译: 构造成将热能转换为机械能的冷却系统包括由具有第一温度的热源和具有低于第一温度的第二温度的冷却剂之间的温度差提供的热能源。 冷却系统包括冷却回路,该冷却回路构造成将冷却剂输送到热源。 冷却回路包括导管和与导管流体连通的构造成将冷却剂输送到热源的泵。 冷却系统还包括与导管热关系设置的热引擎,并被配置为将热转换成机械能。 热机包括由第一形状记忆合金形成的第一元件,该第一形状记忆合金在第一相变温度下响应于热源和冷却剂之间的温度差,具有在奥氏体和马氏体之间可变化的结晶相。

    Cooling system
    39.
    发明授权
    Cooling system 有权
    冷却系统

    公开(公告)号:US08769946B2

    公开(公告)日:2014-07-08

    申请号:US12947857

    申请日:2010-11-17

    IPC分类号: F01B29/10 F02G1/04

    CPC分类号: F03G7/06

    摘要: A cooling system configured for converting thermal energy to mechanical energy includes a source of thermal energy provided by a temperature difference between a heat source having a first temperature and a coolant having a second temperature that is lower than the first temperature. The cooling system includes a cooling circuit configured for conveying the coolant to and from the heat source. The cooling circuit includes a conduit and a pump in fluid communication with the conduit and configured for delivering the coolant to the heat source. The cooling system also includes a heat engine disposed in thermal relationship with the conduit and configured for converting thermal to mechanical energy. The heat engine includes a first element formed from a first shape memory alloy having a crystallographic phase changeable between austenite and martensite at a first transformation temperature in response to the temperature difference between the heat source and coolant.

    摘要翻译: 构造成将热能转换为机械能的冷却系统包括由具有第一温度的热源和具有低于第一温度的第二温度的冷却剂之间的温度差提供的热能源。 冷却系统包括冷却回路,该冷却回路构造成将冷却剂输送到热源。 冷却回路包括导管和与导管流体连通的构造成将冷却剂输送到热源的泵。 冷却系统还包括与导管热关系设置的热引擎,并被配置为将热转换成机械能。 热机包括由第一形状记忆合金形成的第一元件,该第一形状记忆合金在第一相变温度下响应于热源和冷却剂之间的温度差,具有在奥氏体和马氏体之间可变化的结晶相。