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公开(公告)号：US20240079782A1
公开(公告)日：2024-03-07
申请号：US18458916
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Alden T. Rush , Han Wang , Jingni Zhong , Ming Chen , Yiren Wang , Yuan Tao , Hao Xu , Hongfei Hu , Mattia Pascolini
Abstract: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.
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公开(公告)号：US20240079761A1
公开(公告)日：2024-03-07
申请号：US18458835
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Jingni Zhong , Ming Chen , Han Wang , Alden T Rush , Behnam Ghassemiparvin , Bhaskara R Rupakula , Yiren Wang , Yuan Tao , Hao Xu , Jennifer M Edwards , Hongfei Hu , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/48 , H01Q9/0407
Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.
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公开(公告)号：US20240072417A1
公开(公告)日：2024-02-29
申请号：US18502979
申请日：2023-11-06
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q9/0414 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US11811133B2
公开(公告)日：2023-11-07
申请号：US17314740
申请日：2021-05-07
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US11728569B2
公开(公告)日：2023-08-15
申请号：US17111131
申请日：2020-12-03
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew D. Hill , Mattia Pascolini
CPC classification number: H01Q9/0485 , H01Q1/243 , H01Q21/0075
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.
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Patent Agency Ranking
公开(公告)号：US20220094078A1
公开(公告)日：2022-03-24
申请号：US17031780
申请日：2020-09-24
Applicant: Apple Inc.
Inventor： Kexin Ma , Siwen Yong , Jiangfeng Wu , Simon G. Begashaw , Madhusudan Chaudhary , Lijun Zhang , Yi Jiang , Hao Xu , Mattia Pascolini
Abstract: An electronic device may include first and second phased antenna arrays that convey radio-frequency signals at frequencies greater than 10 GHz. The second array may have fewer antennas than the first array. Control circuitry may control the first and second arrays in a diversity mode and in a simultaneous array mode. In the diversity mode, the first array may form a first signal beam while the second array is inactive. When the first array is blocked by an object or otherwise exhibits unsatisfactory performance, the second array may form a second signal beam while the first array is inactive. In the simultaneous mode, the first and second arrays may form a combined array that produces a third signal beam. The combined array may maximize gain. Hierarchical beam searching operations may be performed. The arrays may be distributed across one or more modules.
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公开(公告)号：US11139588B2
公开(公告)日：2021-10-05
申请号：US15950677
申请日：2018-04-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US20210265745A1
公开(公告)日：2021-08-26
申请号：US17314740
申请日：2021-05-07
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US20200021019A1
公开(公告)日：2020-01-16
申请号：US16036770
申请日：2018-07-16
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Travis A. Barbieri , Georgios Atmatzakis , Matthew A. Mow
Abstract: An electronic device may be provided with antenna structures that convey radio-frequency signals greater than 10 GHz. The antenna structures may include overlapping first and second patches. The first patch may include a hole. A transmission line for the second patch may include a conductive via extending through the hole. The via may be coupled to a first end of a trace. A second end of the trace may be coupled to a feed terminal on the second patch over an additional via. The hole may be located within a central region of the first patch to allow the via to pass through the hole without electromagnetically coupling to the first patch. If desired, adjustable impedance matching circuits may be used to couple selected impedances to the antenna feeds that help ensure that the first and second patch antennas are sufficiently isolated from each other.
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公开(公告)号：US20190319367A1
公开(公告)日：2019-10-17
申请号：US15950677
申请日：2018-04-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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