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公开(公告)号：US20230068239A1
公开(公告)日：2023-03-02
申请号：US17982476
申请日：2022-11-07
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Vladimir Stojanovic
Abstract: A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.
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公开(公告)号：US20220407606A1
公开(公告)日：2022-12-22
申请号：US17893114
申请日：2022-08-22
Applicant: Ayar Labs, Inc.
Inventor： Chen Sun , Roy Edward Meade , Mark Wade , Alexandra Wright , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Derek Van Orden
IPC: H04B10/50 , H01S5/40 , H01S5/026 , H04J14/02 , H01S5/02325
Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.
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公开(公告)号：US11233596B2
公开(公告)日：2022-01-25
申请号：US16510829
申请日：2019-07-12
Applicant: Ayar Labs, Inc.
Inventor： Vladimir Stojanovic , Alexandra Wright , Chen Sun , Mark Wade , Roy Edward Meade
Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.
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公开(公告)号：US20210132309A1
公开(公告)日：2021-05-06
申请号：US17083058
申请日：2020-10-28
Applicant: Ayar Labs, Inc.
Inventor： Chong Zhang , Roy Edward Meade
IPC: G02B6/42 , H01L25/18 , H01L23/538 , H01L25/00
Abstract: A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate. The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.
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公开(公告)号：US20210080647A1
公开(公告)日：2021-03-18
申请号：US17019158
申请日：2020-09-11
Applicant: Ayar Labs, Inc.
Inventor： Haiwei Lu , Chen Li , John Fini , Chong Zhang , Roy Edward Meade
Abstract: A handle-integrated composite wafer assembly includes a handle wafer attached to a device wafer. The device wafer includes a device layer formed on a buried oxide layer. The device layer includes an optical resonator structure. The handle wafer includes a base layer and a layer of anti-reflective material disposed on a top side of the base layer. The base layer has a cavity extending into the base layer from the top side of the base layer. The cavity has at least one side surface and a bottom surface. The layer of anti-reflective material is substantially conformally disposed within the cavity on the at least one side surface and bottom surface of the cavity. The handle wafer is attached to the device wafer with the layer of anti-reflective material affixed to the buried oxide layer, and with the cavity substantially aligned with the optical resonator structure in the device layer.
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Patent Agency Ranking
公开(公告)号：US20200341191A1
公开(公告)日：2020-10-29
申请号：US16856387
申请日：2020-04-23
Applicant: Ayar Labs, Inc.
Inventor： Roy Edward Meade , Chen Sun , Shahab Ardalan , John Fini , Forrest Sedgwick
Abstract: An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.
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公开(公告)号：US10771160B2
公开(公告)日：2020-09-08
申请号：US15650586
申请日：2017-07-14
Applicant: Ayar Labs, Inc.
Inventor： Chen Sun , Roy Edward Meade , Mark Wade , Alexandra Wright , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Derek Van Orden
IPC: G02B6/12 , H04B10/50 , H01S5/40 , H01S5/026 , H01S5/022 , H04J14/02 , H01S5/50 , H01S5/024 , H01S4/00
Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.
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公开(公告)号：US20200021899A1
公开(公告)日：2020-01-16
申请号：US16510821
申请日：2019-07-12
Applicant: Ayar Labs, Inc.
Inventor： Vladimir Stojanovic , Alexandra Wright , Chen Sun , Mark Wade , Roy Edward Meade
IPC: H04Q11/00
Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.
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公开(公告)号：US20190317288A1
公开(公告)日：2019-10-17
申请号：US16451955
申请日：2019-06-25
Applicant: Ayar Labs, Inc.
Inventor： John Fini , Roy Edward Meade , Mark Wade , Chen Sun , Vladimir Stojanovic , Alexandra Wright
Abstract: An optical module includes a laser light supply system and a chip disposed within a housing. The chip includes a laser input optical port and a transmit data optical port and a receive data optical port. The optical module includes a link-fiber interface exposed at an exterior surface of the housing. The link-fiber interface includes a transmit data connector and a receive data connector. The optical module includes a polarization-maintaining optical fiber connected between a laser output optical port of the laser light supply system and the laser input optical port of the chip. The optical module includes a first non-polarization-maintaining optical fiber connected between the transmit data optical port of the chip and the transmit data connector of the link-fiber interface. The optical module includes a second non-polarization-maintaining optical fiber connected between the receive data optical port of the chip and the receive data connector of the link-fiber interface.
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公开(公告)号：US20190089461A1
公开(公告)日：2019-03-21
申请号：US16194250
申请日：2018-11-16
Applicant: Ayar Labs, Inc.
Inventor： Chen Sun , Roy Edward Meade , Mark Wade , Alexandra Wright , Vladimir Stojanovic , Rajeev Ram , Milos Popovic , Derek Van Orden , Michael Davenport
Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
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