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公开(公告)号：US11647985B2
公开(公告)日：2023-05-16
申请号：US17209126
申请日：2021-03-22
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Gregory L. Charvat , Gregory Corteville
IPC: A61B8/14 , A61B8/00 , A61B8/13 , A61B8/08 , G03B27/42 , G03B27/52 , B06B1/02 , G01S7/00 , G01S7/52 , G01S15/89 , A61N7/02 , A61N7/00
CPC classification number: A61B8/4444 , A61B8/13 , A61B8/14 , A61B8/4477 , A61B8/4483 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/54 , A61B8/56 , A61N7/02 , B06B1/0292 , G01S7/003 , G01S7/5208 , G01S7/52084 , G01S15/8915 , G03B27/423 , G03B27/52 , A61B8/4411 , A61N2007/0078 , Y10T29/49005
Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
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32.发明申请公开(公告)号：US20230093524A1
公开(公告)日：2023-03-23
申请号：US17890099
申请日：2022-08-17
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
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公开(公告)号：US11446001B2
公开(公告)日：2022-09-20
申请号：US15629666
申请日：2017-06-21
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
Abstract: A universal ultrasound device having an ultrasound probe includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.
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公开(公告)号：US11439364B2
公开(公告)日：2022-09-13
申请号：US15638331
申请日：2017-06-29
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , G01S15/89 , A61B8/14 , G01S15/02 , G01S7/52 , B81C1/00 , B06B1/02 , A61N7/02 , A61N7/00 , H04R1/00 , A61B8/08
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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35.发明申请公开(公告)号：US20220110529A1
公开(公告)日：2022-04-14
申请号：US17555351
申请日：2021-12-17
Applicant: BFLY Operations, Inc.
Inventor： Jonathan M. Rothberg , Nevada J. Sanchez , Gregory L. Charvat , Tyler S. Ralston
Abstract: Described herein are arrays of piezoelectric ultrasound elements. The piezoelectric ultrasound elements may be arranged in a checkerboard pattern. The piezoelectric ultrasound elements in one column may be shifted along the vertical dimension of the array with respect to piezoelectric ultrasound elements in an adjacent column. A piezoelectric ultrasound element in one column may be coupled to a different circuit than all other piezoelectric ultrasound elements in the column. The circuit may be, for example, an analog-to-digital converter or a circuit configured to transmit ultrasound signals from the array. Each piezoelectric ultrasound element in a column may be configured so that it can operate at a different frequency from each of the other piezoelectric ultrasound elements in the column. There array may include at least 1,000 piezoelectric ultrasound elements. The array may be monolithically integrated with a substrate comprising different circuits for each piezoelectric ultrasound element in the array.
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Patent Agency Ranking
公开(公告)号：US11154279B2
公开(公告)日：2021-10-26
申请号：US15087962
申请日：2016-03-31
Applicant: BFLY Operations, Inc.
Inventor： Liewei Bao , Kailiang Chen , Tyler S. Ralston , Nevada J. Sanchez
Abstract: Circuitry for ultrasound devices is described. A multi-level pulser is described, which can support time-domain and spatial apodization. The multi-level pulser may be controlled through a software-defined waveform generator. In response to the execution of a computer code, the waveform generator may access master segments from a memory, and generate a stream of packets directed to pulsing circuits. The stream of packets may be serialized. A plurality of decoding circuits may modulate the streams of packets to obtain spatial apodization.
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37.发明申请公开(公告)号：US20250164446A1
公开(公告)日：2025-05-22
申请号：US19032651
申请日：2025-01-21
Applicant: BFLY OPERATIONS, INC.
Inventor： Chao Chen , Youn-Jae Kook , Jihee Lee , Kailiang Chen , Leung Kin Chiu , Joseph Lutsky , Nevada J. Sanchez , Sebastian Schaetz , Hamid Soleimani
IPC: G01N29/24 , A61B8/00 , B06B1/02 , G01N29/30 , G01S7/52 , G01S15/89 , H03F1/32 , H03F3/45 , H03K5/24 , H03M3/00
Abstract: Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.
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公开(公告)号：US12207972B2
公开(公告)日：2025-01-28
申请号：US17868591
申请日：2022-07-19
Applicant: BFLY Operations, Inc.
Inventor： Sewook Hwang , Jungwook Yang , Kailiang Chen , Nevada J. Sanchez
Abstract: Ultrasound devices are disclosed. The ultrasound devices have an elevational dimension. Different percentages of the aperture of the ultrasound device corresponding to different percentages of the elevational dimension are utilized in different applications. The resolution of imagine may be adjusted in connection with usage of different percentages of the aperture.
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公开(公告)号：US20240407759A1
公开(公告)日：2024-12-12
申请号：US18806916
申请日：2024-08-16
Applicant: BFLY Operations, Inc
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , A61B8/08 , A61B8/14 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00 , G01S7/52 , G01S15/02 , G01S15/89 , H04R1/00
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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公开(公告)号：US12156762B2
公开(公告)日：2024-12-03
申请号：US17710697
申请日：2022-03-31
Applicant: BFLY OPERATIONS, INC.
Inventor： Hamid Soleimani , Nevada J. Sanchez
Abstract: Ultrasound devices are described. The ultrasound devices may be flexibly configured to output a certain number of multilines per channel of ultrasound data and to process certain channels of ultrasound data per processing cycle. The ultrasound device may then be configured to either output more multilines per channel and process fewer channels per processing cycle, or output fewer multilines per channel and process more channels per processing cycle. In other words, the circuitry may be configured to change to a configuration with increased resolution and increased processing time or to a configuration with decreased resolution and decreased processing time.
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