摘要:
Thermoplastic polyamidimides useful for high temperature coating and having exceptional tensile strength and dimensional stability to heat are produced by condensation of organic polyisocyanates, such as aliphatic, aliphatic-aromatic or aromatic diisocyanates, with cyclic polycarboxylic acid anhydrides and lactams or polyamides carried out at temperatures of from 0.degree. to 400.degree. C. and optionally in a solvent together with from 0.1 to 10 mol-%, preferably from 0.2 to 4 mol-%, of an imidocarboxylic acid corresponding to the following formula ##STR1## wherein R.sub.1 and R.sub.2 represent aliphatic, aliphatic-aromatic or aromatic groups and R.sub.1 carries at least one cyclic anhydride group or carboxyl group in addition to the cyclic imide group.
摘要:
Polyester-phosphonates, polycarbonatophosphonates and polyester-carbonatophosphonates having improved impact strength and notched impact strength as compared with melt-condensation products can be prepared in such a way that, in the first stage, oligophosphonates with hydroxyl end groups are prepared by melt-transesterification and melt-condensation and these are subjected in a second stage to a phase boundary process.
摘要:
This invention relates to certain new aliphatic-aromatic polyamidoimides suitable for use as non-clouding electroinsulating lacquers and duroplasts.
摘要:
Plasticized polyvinyl alcohol containing one or more 1,4-monoanhydrohexitols and/or one or more 1,4-3,6-dianhydrohexitols and its use for the production of composite films by coextrusion, coating, doubling and lamination.
摘要:
The invention relates to coatings based on linear, high molecular weight polyarylene sulfides, preferably PPS, by extrusion coating of, for example, elongate stock in the form of, for example, wires, strands, optical fibers, etc.
摘要:
The invention relates to molding compounds of polyarylene sulfides (PAS), preferably polyphenylene sulfides (PPS), which have a low ion content and delayed crystallization and to their use as an encapsulating compound for active and passive electronic components.