Abstract:
Embodiments of a laminate exhibiting enhanced acoustic performance are described. In one or more embodiments, the laminate includes a first substrate, an interlayer structure and a second substrate. One or both the first substrate and the second substrate have a thickness less than about 1.5 mm. In one or more embodiments, the interlayer structure includes a first interlayer and a second interlayer, wherein the first interlayer has a lower shear modulus than the second interlayer and is positioned near the center of the laminate (i.e., positioned at a thickness range from about 0.4t to about 0.6t, where t is the laminate thickness). The laminates exhibit a transmission loss of greater than about 38 dB over a frequency range from about 2500 Hz to about 6000 Hz. Vehicles and architectural panels including the laminates described herein are also provided.
Abstract:
A laminate structure having a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The first glass layer is comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 μm. The second glass layer can also be comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 μm.
Abstract:
A laminate structure having a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The first glass layer is comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 μm. The second glass layer can also be comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 μm.
Abstract:
Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
Abstract:
A glass laminate comprises an external glass sheet, an internal glass sheet, and a polymer interlayer formed between the external glass sheet and the internal glass sheet. The external glass sheet can be a thin chemically-strengthened glass sheet or can be a non-chemically strengthened glass sheet, the polymer interlayer can have a thickness of less than 1.6 mm, and the internal glass sheet can be a non-chemically-strengthened glass sheet or a thin chemically strengthened glass sheet.